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Design Analysis Ericsson GSM/EDGE DUG 20 01 Digital Baseband Unit

  • January 2013
  • -
  • EJL Wireless Research LLC
  • -
  • 38 pages

Design Analysis Ericsson GSM/EDGE DUG 20 01 Digital Baseband Unit

This report covers the design analysis of an Ericsson GSM/EDGE baseband digital unit. This unit is part of the RBS610x/6201/6301/6601 base station platform for Ericsson GSM/EDGE. The unit was manufactured in Q1 2012.

Component and semiconductor suppliers mentioned in this report include: Analog Devices, Bourns, Broadcom, Clare, Ericsson, Fairchild Semiconductor, Hynix, Infineon Technologies, Integrated Device Technology, Kemet, Lantiq, Lattice Semiconductor, Maxim Integrated Products, Micron Technology, Nihon Denpa Kogyo, Nichicon, NXP Semiconductors, ON Semiconductor, Pulse Electronics, Rakon, Sanyo Electric, STMicroelectronics, TDK-Epcos, Texas Instruments, Vishay Semiconductors.


Features:

• Complete Part Number/Marking
• Component Manufacturer Identification
• Function Component Description
• Package Type


Important Note: There is NO component pricing contained within the report.

Table Of Contents

Design Analysis Ericsson GSM/EDGE DUG 20 01 Digital Baseband Unit
TABLE OF CONTENTS

EXECUTIVE SUMMARY 5

Active/Passive Component Summary 5
Important Note: 5

CHAPTER 1: ERICSSON RBS6000 BTS SYSTEM 6

Overview of RBS6101/6102/6201/6202/6301/6601 Product Offering 6

CHAPTER 2: DUG MECHANICAL ANALYSIS 9

Mechanical Analysis 9

CHAPTER 3: BASEBAND PROCESSING BOARD SUBSYSTEM 15

Semiconductor Heat Sinks 29

APPENDIX A - PASSIVE CASE SIZE ANALYSIS 30

APPENDIX B - ACTIVE COMPONENT MARKET SHARE ANALYSIS 34



TABLES

Table 1: DUG Baseband Processor PCB Top Area A Bill of Materials 22
Table 2: DUG Baseband Processor PCB Top Area B1 Bill of Materials 24
Table 3: DUG Baseband Processor PCB Top Area B2 Bill of Materials 24
Table 4: DUG Baseband Processor PCB Bottom Area C Bill of Materials 27
Table 5: Passive Component Case Size Distribution by System Subsection 31
Table 6: Identified Passive Component Supplier Distribution by System Subsection 32
Table 7: Active/Passive Component Distribution by System Subsection 33
Table 8: Active Semiconductor/Component Vendor Distribution by System Subsection 35



EXHIBITS

Exhibit 1: Ericsson RBS620x Macro Cell Indoor BTS System 7
Exhibit 2: Ericsson DUG System Block Diagram 8
Exhibit 3: DUG Unit, Front 9
Exhibit 4: DUG Unit, Back 10
Exhibit 5: DUG Unit, Right Side 10
Exhibit 6: DUG Unit, Left Side 10
Exhibit 7: DUG Unit, Top 11
Exhibit 8: DUG Unit, Bottom 11
Exhibit 9: DUG Top Shield, External View 12
Exhibit 10: DUG Top Shield, Internal View 12
Exhibit 11: DUG Bottom Shield, External View 13
Exhibit 12: DUG Bottom Shield, Internal View 13
Exhibit 13: DUG Bottom Shield, Front View 14
Exhibit 14: DUG Bottom Shield, Rear View 14
Exhibit 15: DUG 20 01 System, Exploded Side View 14
Exhibit 16: DUG PCB Top View 15
Exhibit 17: DUG Baseband Processing PCB Top, Areas A and B 16
Exhibit 18: DUG Baseband Processing PCB Bottom, Area C 17
Exhibit 19: DUG Baseband Processing PCB Component Diagram, Top View 18
Exhibit 20: DUG Baseband Processing PCB Area B 19
Exhibit 21: DUG Baseband Processing PCB Area B1 Component Diagram 19
Exhibit 22: DUG Baseband Processing PCB Area B2 Component Diagram 20
Exhibit 23: DUG Baseband Processing Block Diagram 21
Exhibit 24: DUG Baseband Processing PCB Area C Component Diagram 26
Exhibit 25: Semiconductor IC Heat Sink Dimensions, 41mm 29
Exhibit 26: Passive Component Case Size Distribution 30
Exhibit 27: Identified Passive Component Market Share by Vendor 33
Exhibit 28: Active Semiconductor Component Share 34
Exhibit 29: High Pin Count IC vs Discretes 36
Exhibit 30: Active Semiconductor Market Share by Vendor 36
Exhibit 31: High Pin Count (64+) Active Semiconductor Market Share by Vendor 37

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