Flash Packaging: What Phone Makers Want, When & Why?

Flash Packaging: What Phone Makers Want, When & Why?

Flash packaging is undergoing significant changes. The NOR/PSRAM stack in current handsets will soon give way to NOR/NAND stacks, NOR/LP-DRAM stacks, NAND/LP-DRAM stacks, and even three, four, and five-chip stacks. Meanwhile new packaging technologies are being explored, including package-on package (POP). This report looks into the how and why of these changes to help chip makers and chip purchasers understand the market and plan their strategic moves.

Executive Summary 1
Cell Handset Needs 2
Why Stack Memories? 3
How Architecture Determines Memory Mix 5
How Features Determine Memory Configuration 5
Camera Resolution 7
Operating System Considerations 8
Music Player Feature 10
Memory Expandability – Flash Cards 11
Pricing’s Play in These Decisions 12
Role of Minimum NAND Density 14
Which Stacks are Most Desired? 17
Multi-Chip Packages (MCP) 17
Package on Package (POP) 17
Package in Package (PIP) 18
Other 18
Through-Silicon Vias 18
Folded Substrates 18
System in Package (SIP) 19
MCP Markets by Handset Type 20
Full-Feature Handsets 20
Music Handsets 22
High-Resolution Camera Handsets 24
VGA Camera Handsets 26
Basic Handsets 27
Combined Stacked Chip Forecast 29
Total MCP Forecast 31
Methodology 33
Figures 34
Tables 35
Author 36