The Taiwanese Cable Modem CPE Application IC Market, 3Q 2009

The Taiwanese Cable Modem CPE Application IC Market, 3Q 2009

This research report presents market volume forecast and recent quarter review of the Taiwanese cable modem CPE chipset market. This report includes cable modem CPE market value, ASP, market share by technology and solution provider, as well as cable modem and E-MTA shipment BOM structure. The content of this report is based on primary data obtained through interviews with cable modem CPE component makers. This report finds that Taiwanese cable modem CPE chipset market volume and value both recorded growth in the second quarter of 2009. With the acceleration of DOCSIS 3.0 deployment in various regions, it is projected that the market share of DOCSIS 3.0 chipsets will see steady growth in accordance with the increasing demand for DOCSIS 3.0 CPE. Overall, it is forecasted that the second-half market volume will return to the level in the previous year and will see continuous growth in the first half of 2010.

List of Tables
1. Taiwanese Cable Modem CPE Chipset Market Volume, 1Q 2007 - 2Q 2010
2. Taiwanese Cable Modem CPE Chipset Market Value and ASP, 1Q 2007 - 2Q 2010
3. Taiwanese Cable Modem CPE Chipset Market Volume Share by Technology, 1Q 2007 - 2Q 2009
4. Taiwanese Cable Modem CPE Chipset ASP by Technology, 1Q 2007 - 2Q 2009
5. Taiwanese E-MTA CPE Chipset ASP by Technology, 1Q 2007 - 2Q 2009
6. Taiwanese Cable Modem CPE Chipset Market Volume Share by Solution Provider, 1Q 2007 - 2Q 2009
7. Taiwanese Cable Modem CPE Shipment BOM Structure by Key Component, 1Q 2007 - 2Q 2009
8. Taiwanese E-MTA (with Battery) Shipment BOM Structure by Key Component, 1Q 2007 - 2Q 2009
9. Taiwanese E-MTA (without Battery) Shipment BOM Structure by Key Component, 1Q 2007 - 2Q 2009