The semiconductor industry is in the era of 32nm process, and it is expected that it will meet 16nm around 2019. Designing a 45nm SoC costs USD20-50 million except labor cost, and the design of a 32nm SoC costs USD75-120 million, while it is less than USD5 million for 130nm. Therefore, even if the IC design companies with annual revenue of over USD2 billion probably can not afford such high cost, and there are no more than ten such companies all over the world, which means that the majority of IC design companies are disqualified to enter 45nm or 32nm era. Perhaps the semiconductor industry will develop at the pace of Moore’s Law. Having made up for the bottleneck of process shrinkage, the packaging industry will yield unusually brilliant results in post-Moore’s Law era.
In practice, the packaging industry has become increasingly important since 2000, and the debut of BGA, FC and CSP has sped up the progression of semiconductor industry. However, the front-end of semiconductor manufacturing has been in stagnancy, still in the era of 12-inch wafer, and it is likely that 15-inch wafer era will not come. Currently, a revolutionary packaging, TSV packaging presents itself, which is so called 3D IC. The technology will dramatically improve chip transistor density, cubic density rather than plane density, and make semiconductor industry surpass the development pace of Moore’s Law. Not only packaging companies and wafer OEMs, but also nearly all global prominent semiconductor companies such as IBM, Samsung, Intel and Qualcomm are all actively developing TSV technology. TSV has been in large shipment in image sensor and MEMS field, and it will rapidly expand to memory field in the future, and to DSP, RF IC, cell phone baseband, processor, CPU and GPU in 2013. Furthermore, TSV market size will rise to over US$2 billion from less than US$ 300 million currently, which will be the rapidest growing field in semiconductor industry.
In the meantime, the advanced packaging has an increasingly powerful driving force. IC advanced packaging mainly refers to IC substrate packaging, including BGA, CSP, FC and LGA, and it mainly applies for cell phone, memory, PC (CPU, GPU and Chipest), network communications, and consumer electronics. In addition, the network communications include high-speed switch, router and base station. Consumer electronics are as the followings such as game console, IPOD, ITOUCH, and high-end PMP. The cell phone has more and more powerful functions, thinner and thinner in size; and the smart phones have covered a rising ratio. In the field of memory, DDR3 has become the mainstream, with the rate increased to over 1GHz; CPU has multi-cores, and the number of pins has exceeded 1,200. China’s 3G and the world’s 4G network distribution has boosted up the sales of base stations. The stay-at-home economy has made game machine shipment increase sharply as well.
Japan and Taiwan have almost dominated IC packaging industry. Among the global top 12 companies, seven of which are from Taiwan, two from Japan, two from the United States, and one from South Korea.
Global Packaging Industry
Table of Contents
1 Status Quo and Future of IC Advanced Packaging
1.1 IC Packaging Overview
1.2 IC Packaging Types
1.2.1 SOP
1.2.2 QFP and LQFP
1.2.3 FBGA
1.2.4 TEBGA
1.2.5 FC-BGA
1.2.6 WLCSP
1.3 Future Star – TSV Packaging
1.3.1 TSV Intro
1.3.2 Why is TSV rather than SoC
1.3.3 TSV Development
1.3.4 TSV Industry and Market
2 IC Advanced Packaging Market
2.1 Cell Phone IC Advanced Packaging Market
2.2 Cell Phone Baseband Packaging
2.2.1 Cell Phone Baseband Industry
2.2.2 Cell Phone Baseband Packaging
2.3 Cell Phone (Mobile) Application Processor
2.3.1 Definition
2.3.2 Market and Industry
2.4 Smart Phone Processor Industry and Packaging
2.5 Cell Phone Embedded Memory
2.5.1 Overview
2.5.2 Cell Phone Memory Development
2.5.3 Cell Phone Memory Industry and Packaging
2.6 Cell Phone RF IC
2.6.1 Market
2.6.2 Industry
2.6.3 3G/4G-era Cell Phone RF IC Packaging
2.7 Other Cell Phone IC
2.8 Cell Phone Market and Industry
2.8.1 Market
2.8.2 Industry
2.8.3 China’s Smart Phone Market
2.9 Advanced Packaging in PC Field
2.9.1 DRAM Industry
2.9.2 DRAM Packaging
2.9.3 NAND Flash Industry
2.9.4 NAND Flash Packaging Development
2.9.5 CPU, GPU & North and South Bridge Chipset
2.10 Image Sensor
3 Advanced Packaging Industry
3.1 Industry Scale
3.2 Industry Patterns
3.3 Comparison of Manufacturers
4 Advanced Packaging Manufacturers
4.1 TESSERA
4.2 Greatek
4.3 Formosa
4.4 ASE
4.5 AMKOR
4.6 SPIL
4.7 STATS ChipPAC
4.8 PHOENIX
4.9 Nanya
4.10 Kinsus
4.11 PowerTech
4.12 ChipMOS
4.13 King Yuan Electronics
4.14 IBIDEN
4.15 SHINKO
4.16 CARSEM
4.17 UNISEM
4.18 NEPES
4.19 STS
4.20 SEMCO
4.21 Unimicron
4.22 Chipbond
4.23 Changjiang Electronics Technology Selected Charts
IC Packaging Development Course, 1980-2010
SOP and TSSO Outline and Cross-sectional Diagram
QFP, LQFP, HQFP Packaging Outline and Cross-sectional Diagram
FBGA Outline and Cross-sectional Diagram
FBGA Development Roadmap, 2006-2012
TEBGA Outline and Cross-sectional Diagram
FC-BGA Outline and Cross-sectional Diagram
FC-BGA Development Roadmap, 2006-2012
WL-CSP Outline, Manufacturing Flow and Cross-sectional Diagram
Via First TSV Sketch-map
Via Last TSV Sketch-map
TSV Roadmap, 2005-2015
TSV Application Roadmap
TSV Via Size Roadmap
TSV Industry Layout
TSV Wafer Shipment by Application, 2006-2014
Typical Cell Phone Block Diagram
Market Shares of Global Cell Phone Baseband Manufacturers' Shipment, 2007-2009
Market Shares of China’s Cell Phone Baseband Manufacturers, 2009
Processor Marker Scale Forecast by Type, 2008-2012
Market Shares of Main Non-Smart Phone Processor Manufacturers by Sum, 2008
Market Shares of Main Smart Phone Processor Manufacturers, 2009
Cell Phone Embedded Memory Development Roadmap
Cell Phone NOR Memory Demand (Mb), 2004-2012
Cell Phone RAM Memory Demand (Mb), 2004-2012
Cell Phone NAND Memory Demand (Mb), 2004-2012
Market Shares of Main Cell Phone Memory Manufacturers, 2009
Cell Phone Single-chip Memory Packaging Trend, 2007-2010
SIP Cell Phone Memory Packaging Development Trend, 2007-2011
PoP Cell Phone Memory Development Trend, 2007-2011
Global Cell Phone RF Market Scale, 2003-2010E
Global 3G Cell Phone Distribution by Band Number, 2009-2013
Market Shares of Global Main Cell Phone RF Transceiver Manufacturers by Shipment, 2008
Market Shares of Global Main Cell Phone PA Manufacturers by Sum, 2008
Comparison of Main PA Manufacturers’ Technology Capabilities
Intel CPU Development Trend, 2009-2011
PC Shipment, 2006-2013E
Early Cell Phone Camera Module Sketch-map
Cell Phone Camera Module with TSV Packaging
Cell Phone Camera Module Industry Chain
CMOS Image Sensor Shipment, 2008-2013
Market Shares of Main CMOS Image Sensor Manufacturers, 2009
Market Shares of Cell Phone Camera Module Assembly Manufacturers
Market Shares of Main Cell Phone Camera Optics Lens Manufacturers
TSV Roadmap of CMOS Image Sensor
Global IC Packaging Shipment by Type, 2007
Global IC Packaging Shipment by Type, 2012
Global IC Packaging Sum by Type, 2007
Global IC Packaging Sum by Type, 2012
Downstream Distribution of Global Advanced Packaging Industry , 2009
Regional Distribution of Global Advanced Packaging Industry, 2009
Market Shares of Main Global Advanced Packaging Manufacturers in Cell Phone Field, 2009
Market Shares of Main Global Advanced Packaging Manufacturers in Laptop Field, 2009
Market Shares of Main Global Advanced Packaging Manufacturers in Memory Field, 2009
Market Shares of Main Global Advanced Packaging Manufacturers in Network Communication, 2009
Market Shares of Main Global Advanced Packaging Manufacturers in Consumer Electronics, 2009
TESSERA Business Distribution
TESSERA’s Patent Number, 2000-2009Q2
TESSERA’s Revenue, 2004-2008
TESSERA’s Main Clients
TESSERA’s Presence Worldwide
Revenue and Gross Profit Margin of Greatek Electronics, 2002-2012
Organization Structure of Greatek Electronics
Revenue of Greatek Electronics by Packaging Technology, 2007-2008
Formosa’s Revenue and Gross Profit Margin, 2002-2012
Formosa’s Organization Structure
Formosa’s Revenue by Product, 2009
ASE’s Revenue and Gross Profit Margin, 2001-2010
ASE ‘s Organization Structure
ASE’s Revenue and Gross Profit Margin, 2007Q1-2009Q2
ASE’s EBITDA and Investment Amount, 2007Q1-2009Q2
ASE’s Packaging Revenue and Gross Profit Margin, 2007Q1-2009Q2
ASE’s Packaging Revenue by Product, 2007Q1-2009Q2
ASE Test Department’s Revenue and Gross Profit Margin, 2007Q1-2009Q2
ASE Test Department’s Revenue by Technology, 2007Q1-2009Q2
ASE Product Downstream Application, 2005Q4, 2007Q2, 2008Q1 and 2009Q2
ASE’s Core Test Technologies
Amkor’s Revenue and Gross Profit Margin, 2007Q1-2009Q2
Amkor’s Expenditure Ratio by Item, 2007Q1-2009Q2
Amkor’s Revenue by Division, 2008Q1-2009Q2
Amkor’s Product Downstream Application, 2008Q1-2009Q2
Amkor’s IC Shipment by Packaging Type, 2008Q1-2009Q2
Amkor’s Output Utilization Rate and Customer Concentration, 2008Q1-2009Q2
SPIL’s Organization Structure
SPIL’s Revenue and Gross Profit Margin, 2003-2010
SPIL’s Revenue by Region, 2005Q4, 2007Q2, 2009Q1 & 2009Q2
SPIL’s Product Downstream Application Structure, 2005Q4, 2007Q2, 2009Q1 & 2009Q2
SPIL’s Product Structure by Technology Type, 2005Q4, 2007Q2, 2009Q1 & 2009Q2
StatsChipPAC’s Revenue and Gross Profit Margin, 2004-2009
StatsChipPAC’s Revenue by Division, 2006-2009Q2
StatsChipPAC’s Product Downstream Application Ratio, 2006-2009Q2
StatsChipPAC’s Revenue by Region, 2006-2009Q2
PHOENIX’s Organization Structure
PHOENIX’s Revenue and Gross Profit Margin, 2003-2010
PHOENIX’s Product Structure, 2008Q1-2009Q2
PHOENIX’s Product by Layer, 2008Q1-2009Q2
PHOENIX’s Product Downstream Application Ratio, 2008Q1-2009Q2
PHOENIX’s Revenue by Region, 2007Q1-2009Q2
PHOENIX’s Staff Structure
Nanya’s Revenue and Gross Profit Margin, 2003-2010
Nanya's Circuit Board Revenue Structure, 2007, 2008 & 2009Q2
Nanya’s Circuit Board Product Downstream Application Ratio, 2009Q2
Kinsus’ Revenue and Gross Profit Margin, 2001-2010
Kinsus’ Revenue, Jul, 2008-Jul, 2009
Kinsus’ Product Downstream Application Ratio, Jan-Jul, 2009
Ratios of Main Clients’ Contribution to Kinsus Revenue, 2007H1
Kinsus’ Products by Technology, 2007-2009
PowerTech’s Revenue and Gross Profit Margin, 2005-2010
ChipMOS Organization Structure
ChipMOS Revenue and Gross Profit Margin, 2001-2009
ChipMOS Revenue by Region, 2006-2008
ChipMOS Revenue by Division, 2006-2008
ChipMOS Memory Revenue, 2001-2007Q3
ChipMOS Flash Memory Revenue, 2006Q1-2007Q3
ChipMOS LCD Driver IC Revenue, 2001-2007Q3
Revenue and Gross Profit Margin of King Yuan Electronics, 2003-2010
Organization Structure of King Yuan Electronics
Revenue of King Yuan Electronics by Process, 2007Q3
Revenue of King Yuan Electronics by Product, 2007Q3
Product Downstream Applications of King Yuan Electronics, 2007Q3
IBIDEN’s Revenue and Operation Profit Margin, 2004-2008FY
IBIDEN’s Revenue by Division, 2004-2008FY
IBIDEN’s Revenue by Region, 2004-2008FY
IBIDEN’s FC Substrate Output Capability Expansion Plan
IBIDEN’s FC Packaging Product Shipment, 2006-2012
Shinko’s Revenue and Operating Profit Margin, 2005-2010
Shinko’s Total Liabilities and Shareholder’s Equities, 2005-2009FY
Shinko’s Net Profit, 2005-2009FY
Shinko’s Capital Expenditure, 2005-2009FY
Shinko’s Revenue by Division, 2005-2009FY
Shinko’s Product Tree
Unisem’s Revenue and Gross Profit Margin, 2004-2009
Nepes’ Revenue and EBITDA, 2007-2011E
Nepes’ Revenue by Division, 2008Q1-2009Q4
STS Revenue and EBITDA, 2004-2008
STS Revenue by Product, 2009Q1-2010Q4
Unimicron’s Organization Structure
Unimicron’s Revenue and Gross Profit Margin, 2000-2010
Unimicron’s Plants
Unimicron’s Output Capability by Product, 2007-2009
Unimicron’s Revenue by Product, 2009Q1 vs. 2009Q2
Unimicron’s Revenue by Downstream Application, 2009Q1 vs. 2009Q2
Unimicron’s Revenue by Product, 2008 vs. 2009H1
Unimicron’s Revenue by Downstream Application, 2008 vs. 2009H1
Chipbond’s Revenue and Gross Profit Margin, 2003-2010
Chipbond’s Revenue by Technology, 2006-2010
Chipbond’s Clients, 2005-2009
Revenue and Operating Profit Margin of Changjiang Electronics Technology, 2006-2009
Staff Structure of Changjiang Electronics Technology by the end of 2008
Revenue of Global Main Cell Phone Baseband Manufacturers, 2008
Packaging Technology Development Forecast of Global Main Cell Phone Baseband Manufacturers, 2008-2013
Comparison of 12 Typical Baseband Packaging Types
Packaging Comparison of Typical Cell Phone Processors
Packaging Technologies of Global Typical Cell Phone Processors, 2009
Comparison of 12 Typical PA Packaging
Comparison of 13 Typical RF Transceivers’ Packaging
Other Typical Cell Phone IC Packaging Technologies
Shipment of Global Top 13 Brand Manufacturers, 2008
Top 25 Cell Phone Manufacturers in China by Output, 2008
ASE’s Top Ten Clients, 2006Q1, 2008Q1 & 2009Q2
SPIL’s Output Capacity, 2006Q1, 2007Q2&Q3 and 2009Q1&Q2
Nanya’s Circuit Board Output Capacity, 2007-2009
M&A Events of ChipMOS
Output Capacity of ChipMOS Shanghai Base
FC Packaging Revenue, 2006-2009FY
Chipbond’s Output Capacity, 2009-2010
