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Flip-Chip Technologies and Global Markets

  • July 2016
  • -
  • BCC Research
  • -
  • 139 pages

This BCC Research report discusses factors currently driving and restraining growth in flip chip technology market as well as factors that will have an impact on the future of this industry.

Use this report to:

Gain insight into opportunities and highlights of the innovation-driven flip-chip market and the major regions and countries of the market.
Analyze various applications of flip-chip technology and the market dynamics of each application.
Identify segments with high growth prospects along with future applications within each segment.
Assess the most relevant patent data

Highlights

The global market for flip-chip technology totaled $24.9 billion in 2015.

The market should total $27.2 billion and $41.4 billion in 2016 and 2021 respectively, increasing at a compound annual growth rate (CAGR) of 8.8% from 2016 to 2021. The flip-chip technology market for copper (Cu) pillar bumping totaled $8.3 billion in 2015.
The market should total $9.8 billion and $21.2 billion in 2016 and 2021 respectively, increasing at a CAGR of 16.7% from 2016 to 2021.
The market for gold stud and plated solder bumping totaled $6.5 billion in 2015, and should total $7.7 billion and $10.1 billion in 2016 and 2021 respectively, increasing at a CAGR of 5.6% from 2016 to 2021.

STUDY GOALS AND OBJECTIVES

The objective of the report is to analyze flip-chip technology market dynamics and trends, including the prime factors driving the market. The report discusses factors currently driving and restraining growth in this market as well as those factors that will have an impact on the future of the industry. The goals and objectives of this report are as follows:

To understand opportunities and highlights of the innovation-driven flip-chip market and the major regions and countries of the market.
To analyze various application of the flip-chip market and the market dynamics of each application.
To identify segments with high growth prospects along with future applications withineach segment.

To examine key trends related to the product, technology, prices, and applications that shape and influence the flip-chip market.
To examine region-specific developments in the market.
To understand the major stakeholders in the market and the competitive landscapefor market leaders.
To analyze growth strategies of key players in the flip-chip market.
To analyze patent data where relevant

REASONS FOR CONDUCTING THE STUDY

New levels of performance of electronics technology have been enabled by flip-chip technology, fueling the growth of global markets for semiconductors, electronic devices, and a host of industrial and consumer products. During the forecast period, flip-chip interconnect technology is expected to show remarkable growth over other interconnect technologies. Increasing complexity of the architecture of chip design and fabrication is responsible for this exponential growth rate. The market has grown due to increased demand for small-size chips ranging from around 12 mm to 35 mm. This study defines the scope of flip chips with segmental analyses such as by application and end user, helping the reader gain knowledge about technological as well as analytical aspects of the industry.

Table Of Contents

Flip-Chip Technologies and Global Markets
CHAPTER 1 INTRODUCTION 2
STUDY GOALS AND OBJECTIVES 2
REASONS FOR CONDUCTING THE STUDY 2
SCOPE OF REPORT 2
INTENDED AUDIENCE 3
INFORMATION SOURCES 3
ANALYST'S CREDENTIALS 4
RELATED BCC RESEARCH REPORTS 4
BCC RESEARCH WEBSITE 4
DISCLAIMER 5
CHAPTER 2 SUMMARY 7
SUMMARY TABLE GLOBAL MARKET FOR FLIP-CHIP TECHNOLOGY BY WAFER
BUMPING PROCESS, THROUGH 2021 ($ MILLIONS) 8
SUMMARY FIGURE GLOBAL MARKET FOR FLIP-CHIP TECHNOLOGY BY WAFER
BUMPING PROCESS, 2015-2021 ($ MILLIONS) 8
CHAPTER 3 OVERVIEW 10
MARKET DEFINITION 10
EVOLUTION OF FLIP-CHIP WAFER BUMPING TECHNOLOGIES 10
FIGURE 1 DEVELOPMENT OF WAFER BUMPING TECHNOLOGIES, 1960-2004 10
SOLDER EVAPORATION 10
FIGURE 2 SOLDER EVAPORATION PROCESS 11
ELECTROPLATING OF SOLDER ALLOYS 11
FIGURE 3 SOLDER ALLOY ELECTROPLATING PROCESS 11
SOLDER PASTE SCREENING 12
FIGURE 4 SOLDER PASTE SCREENING PROCESS 12
SOLDER BALL REPLACEMENT 13
C4NP PROCESS 14
SIGNIFICANT PATENTS ON FLIP-CHIP TECHNOLOGIES 14
METHOD FOR FLIP CHIP PACKAGING CO-DESIGN 14
Abstract 14
USE OF ELECTROLYTIC PLATING TO CONTROL SOLDER WETTING 14
Abstract 15
LEADLESS MULTI-LAYERED CERAMIC CAPACITOR STACKS 15
Abstract 15
FLIP-CHIP LED PACKAGE 15
Abstract 15
MEMS SENSOR INTEGRATED WITH A FLIP-CHIP 16
Abstract 16
COPPER PILLAR BUMP WITH COBALT-CONTAINING SIDEWALL PROTECTION
LAYER 16
Abstract 17
LOW NOISE FLIP-CHIP PACKAGES AND FLIP-CHIPS THEREOF 17
Abstract 17
COPPER POST SOLDER BUMPS ON SUBSTRATES 17
SMC089B - Flip-Chip Technologies and Global Markets
Copyright © BCC Research, Wellesley MA USA, Website: www.bccresearch.com
TOPIC PAGE NO.
Abstract 18
MATRIX LID HEATSPREADER FOR FLIP CHIP PACKAGE 18
Abstract 18
FLIP-CHIP MMIC HAVING MOUNTING STIFFENER 18
Abstract 18
FLIP-CHIP BONDER AND FLIP-CHIP BONDING METHOD 19
Abstract 19
RED FLIP-CHIP LIGHT EMITTING DIODE, PACKAGE AND METHOD OF
MAKING THE SAME 19
Abstract 19
FLIP-CHIP TYPE LASER DIODE 20
Abstract 20
SELF-ALIGNED PROTECTION LAYER FOR COPPER POST STRUCTURE 20
Abstract 20
COPPER PILLAR SIDEWALL PROTECTION 20
Abstract 21
ENHANCED FLIP CHIP STRUCTURE USING COPPER COLUMN
INTERCONNECT 21
Abstract 21
METHOD OF FORMING COPPER PILLAR BUMP WITH NON-METAL SIDEWALL
SPACER AND METAL TOP CAP 22
Abstract 22
SUBSTRATES FOR PACKAGING FLIP-CHIP LIGHT EMITTING DEVICE AND
FLIP-CHIP LIGHT EMITTING DEVICE PACKAGE STRUCTURES 22
Abstract 22
FLIP-CHIP SOLAR CELL CHIP AND FABRICATION METHOD THEREOF 23
Abstract 23
FLIP CHIP OVERMOLD PACKAGE 23
Abstract 23
FLIP-CHIP LIGHT EMITTING DIODE PACKAGE STRUCTURE 24
Abstract 24
ELECTRICAL CONNECTING ELEMENT HAVING NANO-TWINNED COPPER,
METHOD OF FABRICATING THE SAME, AND ELECTRICAL CONNECTING
STRUCTURE COMPRISING THE SAME
24
Abstract 24
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR ASSEMBLY WITH
LEAD-FREE SOLDER 25
Abstract 25
LEAD-FREE SOLDER ALLOY 25
Abstract 26
DUMMY FLIP CHIP BUMPS FOR REDUCING STRESS 26
Abstract 26
ELECTRONIC ASSEMBLY WITH COPPER PILLAR ATTACH SUBSTRATE 26
Abstract 26
FLIP-CHIP ASSEMBLY COMPRISING AN ARRAY OF VERTICAL CAVITY
SURFACE EMITTING LASERS (VCSELSS), AND AN OPTICAL TRANSMITTER
ASSEMBLY THAT INCORPORATES THE FLIP-CHIP ASSEMBLY
27
Abstract 27
LEAD-FREE SOLDER BUMP BONDING STRUCTURE 27
Abstract 28
EXPOSED DIE OVERMOLDED FLIP CHIP PACKAGE AND FABRICATION
METHOD 28
Abstract 28
APPARATUS FOR LEAD FREE SOLDER INTERCONNECTIONS FOR
INTEGRATED CIRCUITS 28
Abstract 29
HIGH VOLTAGE FLIP-CHIP LED STRUCTURE AND MANUFACTURING
METHOD THEREOF 29
Abstract 29
FLIP-CHIP INTERCONNECTION STRUCTURE 30
Abstract 30
STUD BUMP STRUCTURE AND METHOD FOR MANUFACTURING THE SAME 30
Abstract 30
FLIP-CHIP PACKAGE 30
Abstract 31
LOCALIZED HEATING FOR FLIP CHIP BONDING 31
Abstract 31
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE 31
Abstract 32
CU PILLAR BUMP WITH ELECTROLYTIC METAL SIDEWALL PROTECTION 32
Abstract 32
FLIP-CHIP PACKAGE FOR MONOLITHIC SWITCHING REGULATOR 32
Abstract 33
CHAPTER 4 FLIP-CHIP TECHNOLOGY MARKET BY WAFER BUMPING PROCESS 35
INTRODUCTION 35
MARKET DYNAMICS 35
DRIVERS 35
Expansion of Semiconductor Business 35
Application of Flip Chips in Packaging 35
End-User Demand Among Consumers 35
RESTRAINTS 36
Stringent Government Regulations 36
European Union 36
High Investment Cost 36
Structural Problems in Solder Bumps 37
OPPORTUNITIES 37
Lead-Free Flip-Chip Assembly 37
TABLE 1 GLOBAL MARKET SHARES FOR FLIP-CHIP TECHNOLOGY BY WAFER
BUMPING PROCESS, 2015 AND 2021 (%) 37
FIGURE 5 GLOBAL MARKET SHARES FOR FLIP-CHIP TECHNOLOGY BY WAFER
BUMPING PROCESS, 2015 AND 2021 (%) 38
TABLE 2 GLOBAL FLIP-CHIP UNIT SALES BY WAFER BUMPING PROCESS, THROUGH
2021 (MILLION UNITS) 39
FIGURE 6 GLOBAL FLIP-CHIP UNIT SALES BY WAFER BUMPING PROCESS,
2015-2021 (MILLION UNITS) 39
TABLE 3 GLOBAL FLIP-CHIP TECHNOLOGY AVERAGE PRICE PER UNIT BY WAFER
BUMPING PROCESS, 2015-2021 ($) 40
Copper Pillar 40
TABLE 4 GLOBAL MARKET FOR COPPER (CU) PILLAR FLIP CHIPS BY END USE,
THROUGH 2021 ($ MILLIONS) 41
FIGURE 7 GLOBAL MARKET FOR COPPER (CU) PILLAR FLIP CHIPS BY END USE,
2015-2021 ($ MILLIONS) 41
Copper Bumping Features 42
Tin-Lead Eutectic Solder 43
TABLE 5 MECHANICAL PROPERTIES OF TIN-LEAD (SN-PB) 43
TABLE 6 PHYSICAL PROPERTIES OF TIN-LEAD (SN-PB) 43
TABLE 7 GLOBAL MARKET FOR TIN-LEAD (SN-PB) FLIP CHIPS BY END USE,
THROUGH 2021 ($ MILLIONS) 44
FIGURE 8 GLOBAL MARKET FOR TIN-LEAD (SN-PB) FLIP CHIPS BY END USE,
2015-2021 ($ MILLIONS) 45
Advantages of Tin-Lead Eutectic Solder 45
Lead-Free Solder 45
TABLE 8 CHARACTERISTICS OF VARIOUS ELEMENTS 46
TABLE 9 CHARACTERISTICS OF VARIOUS MIXED COMPOSITIONS 46
Properties of Some Commonly Used Alloy Systems 48
58Bi-42Sn 48
52In-48Sn 48
TABLE 10 GLOBAL MARKET FOR LEAD (PB)-FREE FLIP CHIPS BY END USE,
THROUGH 2021 ($ MILLIONS) 48
FIGURE 9 GLOBAL MARKET FOR LEAD (PB)-FREE FLIP CHIPS BY END USE,
2015-2021 ($ MILLIONS) 49
Gold Stud Bumping 49
TABLE 11 GLOBAL MARKET FOR GOLD STUD BUMPED FLIP CHIPS BY END USE,
THROUGH 2021 ($ MILLIONS) 50
FIGURE 10 GLOBAL MARKET FOR GOLD STUD BUMPED FLIP CHIPS BY END USE,
2015-2021 ($ MILLIONS) 51
CHAPTER 5 FLIP-CHIP TECHNOLOGY MARKET BY APPLICATION 53
INTRODUCTION 53
FIGURE 11 MARKET SEGMENTATION BY APPLICATION 53
MARKET DYNAMICS 53
DRIVERS 53
New and Improved 3-D Integrated Circuits 53
Invention of Double Data Rate Fourth-Generation (DDR4) Memory 54
RESTRAINTS 54
Challenges in Transition 54
OPPORTUNITIES 54
DDR5 Memory for the Future 54
TABLE 12 GLOBAL MARKET DEMAND FOR FLIP-CHIP TECHNOLOGIES BY
APPLICATION, THROUGH 2021 ($ MILLIONS) 55
FIGURE 12 GLOBAL MARKET FOR FLIP-CHIP TECHNOLOGIES BY APPLICATION,
2015-2021 ($ MILLIONS) 55
2-D LOGIC SYSTEM-ON-A-CHIP 56
FIGURE 13 STRUCTURE OF MULTI-CHIP MODULE 56
FIGURE 14 STRUCTURE OF SYSTEM-ON-CHIP 57
TABLE 13 GLOBAL MARKET FOR FLIP CHIPS USED IN 2-D LOGIC SYSTEM-ON-CHIP
BY REGION, THROUGH 2021 ($ MILLIONS) 58
FIGURE 15 GLOBAL MARKET FOR FLIP CHIPS USED IN 2-D LOGIC SYSTEM-ON-CHIP
BY REGION, 2015-2021 ($ MILLIONS) 58
MEMORY 59
TABLE 14 COMPARATIVE ANALYSES OF VARIOUS TYPES OF MEMORY 59
TABLE 15 GLOBAL MARKET FOR FLIP CHIPS USED IN MEMORY APPLICATIONS BY
REGION, THROUGH 2021 ($ MILLIONS) 61
FIGURE 16 GLOBAL MARKET FOR FLIP CHIPS USED IN MEMORY APPLICATIONS BY
REGION, 2015-2021 ($ MILLIONS) 61
IMAGING 62
TABLE 16 GLOBAL MARKET FOR FLIP CHIPS USED IN IMAGING TECHNOLOGIES BY
REGION, THROUGH 2021 ($ MILLIONS) 62
FIGURE 17 GLOBAL MARKET FOR FLIP CHIPS USED IN IMAGING TECHNOLOGIES BY
REGION, 2015-2021 ($ MILLIONS) 63
HIGH-BRIGHTNESS LIGHT-EMITTING DIODE (HB-LED) 64
FIGURE 18 STRUCTURE OF HB-LED 65
TABLE 17 GLOBAL MARKET FOR FLIP CHIPS USED IN HB-LED APPLICATIONS BY
REGION, THROUGH 2021 ($ MILLIONS) 66
FIGURE 19 GLOBAL MARKET FOR FLIP CHIPS USED IN HB-LED APPLICATIONS BY
REGION, 2015-2021 ($ MILLIONS) 66
SMALL LOGIC, RADIO FREQUENCY, POWER, ANALOG, AND MIXED-SIGNAL
INTEGRATED CIRCUITS 67
TABLE 18 GLOBAL MARKET FOR FLIP CHIPS USED IN RF APPLICATIONS BY REGION,
THROUGH 2021 ($ MILLIONS) 67
FIGURE 20 GLOBAL MARKET FOR FLIP CHIPS USED IN RF APPLICATIONS BY REGION,
2015-2021 ($ MILLIONS) 67
2.5-D AND 3-D SYSTEM-IN-PACKAGE/SYSTEM-ON-A-CHIP 68
FIGURE 21 ARCHITECTURE OF 2.5-D INTEGRATED CIRCUIT 68
FIGURE 22 STRUCTURE OF 3-D INTEGRATED CIRCUIT 69
TABLE 19 GLOBAL MARKET FOR FLIP CHIPS USED IN 2.5-D/3-D APPLICATIONS BY
REGION, THROUGH 2021 ($ MILLIONS) 70
FIGURE 23 GLOBAL MARKET FOR FLIP CHIPS USED IN 2.5-D/3-D APPLICATIONS BY
REGION, 2015-2021 ($ MILLIONS) 70
CHAPTER 6 FLIP-CHIP TECHNOLOGY MARKET BY END USE 72
INTRODUCTION 72
MARKET DYNAMICS 72
DRIVERS 72
Increased Application of Flip Chip in Automotive 72
Application of Smart Technologies 73
Extensive Research and Development 73
RESTRAINTS 73
Time Consumption for New Innovation 73
OPPORTUNITIES 73
Household Robots in the Future 73
TABLE 20 GLOBAL MARKET FOR FLIP-CHIP TECHNOLOGY BY END USE, THROUGH
2021 ($ MILLIONS) 74
FIGURE 24 GLOBAL MARKET FOR FLIP-CHIP TECHNOLOGY BY END USE, 2015-2021
($ MILLIONS) 75
SMARTPHONES 75
TABLE 21 GLOBAL FLIP-CHIP MARKET IN SMARTPHONES BY BUMPING PROCESS,
THROUGH 2021 ($ MILLIONS) 76
FIGURE 25 GLOBAL FLIP-CHIP MARKET IN SMARTPHONES BY BUMPING PROCESS,
2015-2021 ($ MILLIONS) 76
LAPTOPS 77
TABLE 22 GLOBAL FLIP-CHIP MARKET IN LAPTOPS BY BUMPING PROCESS,
THROUGH 2021 ($ MILLIONS) 77
FIGURE 26 GLOBAL FLIP-CHIP MARKET IN LAPTOPS BY BUMPING PROCESS,
2015-2021 ($ MILLIONS) 78
DESKTOP CENTRAL PROCESSING UNITS 78
TABLE 23 GLOBAL FLIP-CHIP MARKET IN DESKTOP CENTRAL PROCESSING UNITS BY
BUMPING PROCESS, THROUGH 2021 ($ MILLIONS) 78
FIGURE 27 GLOBAL FLIP-CHIP MARKET IN DESKTOP CENTRAL PROCESSING UNITS
BY BUMPING PROCESS, 2015-2021 ($ MILLIONS) 79
GRAPHICS PROCESSING UNIT AND CHIPSETS 79
TABLE 24 GLOBAL FLIP-CHIP MARKET IN GRAPHIC PROCESSING UNITS AND
CHIPSETS BY BUMPING PROCESS, THROUGH 2021 ($ MILLIONS) 80
FIGURE 28 GLOBAL FLIP-CHIP MARKET IN GRAPHICS PROCESSING UNITS AND
CHIPSETS BY BUMPING PROCESS, 2015-2021 ($ MILLIONS) 80
OTHER COMPUTING DEVICES 81
TABLE 25 GLOBAL FLIP-CHIP MARKET IN OTHER COMPUTING DEVICES BY BUMPING
PROCESS, THROUGH 2021 ($ MILLIONS) 81
FIGURE 29 GLOBAL FLIP-CHIP MARKET IN OTHER COMPUTING DEVICES BY
BUMPING PROCESS, 2015-2021 ($ MILLIONS) 81
AUTOMOTIVE 82
TABLE 26 GLOBAL FLIP-CHIP MARKET IN AUTOMOTIVE APPLICATIONS BY BUMPING
PROCESS, THROUGH 2021 ($ MILLIONS) 83
FIGURE 30 GLOBAL FLIP-CHIP MARKET IN AUTOMOTIVE APPLICATIONS BY BUMPING
PROCESS, 2015-2021 ($ MILLIONS) 83
ROBOTICS 84
TABLE 27 GLOBAL FLIP-CHIP MARKET IN ROBOTICS BY BUMPING PROCESS,
THROUGH 2021 ($ MILLIONS) 84
FIGURE 31 GLOBAL FLIP-CHIP MARKET IN ROBOTICS BY BUMPING PROCESS,
2015-2021 ($ MILLIONS) 84
MEDICAL DEVICES 85
TABLE 28 GLOBAL FLIP-CHIP MARKET IN MEDICAL DEVICES BY BUMPING PROCESS,
THROUGH 2021 ($ MILLIONS) 86
FIGURE 32 GLOBAL FLIP-CHIP MARKET IN MEDICAL DEVICES BY BUMPING PROCESS,
2015-2021 ($ MILLIONS) 86
SMART TECHNOLOGIES 87
TABLE 29 GLOBAL FLIP-CHIP MARKET IN SMART TECHNOLOGIES BY BUMPING
PROCESS, THROUGH 2021 ($ MILLIONS) 87
FIGURE 33 GLOBAL FLIP-CHIP MARKET IN SMART TECHNOLOGIES BY BUMPING
PROCESS, 2015-2021 ($ MILLIONS) 88
INDUSTRIAL APPLICATIONS 88
TABLE 30 GLOBAL FLIP-CHIP MARKET IN INDUSTRIAL APPLICATIONS BY BUMPING
PROCESS, THROUGH 2021 ($ MILLIONS) 89
FIGURE 34 GLOBAL FLIP-CHIP MARKET IN INDUSTRIAL APPLICATIONS BY BUMPING
PROCESS, 2015-2021 ($ MILLIONS) 89
CHAPTER 7 FLIP-CHIP TECHNOLOGY MARKET BY REGION 91
INTRODUCTION 91
FIGURE 35 REGIONAL SEGMENTATION OF THE FLIP-CHIP MARKET 91
MARKET SNAPSHOT 91
TABLE 31 GLOBAL MARKET FOR FLIP-CHIP PRODUCTION BY REGION, THROUGH
2021 ($ MILLIONS) 92
TABLE 32 GLOBAL MARKET FOR FLIP-CHIP END-USE DEMAND BY REGION,
THROUGH 2021 ($ MILLIONS) 92
NORTH AMERICA 92
OVERVIEW 92
TABLE 33 NORTH AMERICAN MARKET FOR FLIP-CHIP PRODUCTION BY COUNTRY,
THROUGH 2021 ($ MILLIONS) 93
TABLE 34 NORTH AMERICAN MARKET FOR FLIP-CHIP END-USE DEMAND BY
COUNTRY, THROUGH 2021 ($ MILLIONS) 93
TABLE 35 NORTH AMERICAN FLIP-CHIP MARKET BY END-USE DEMAND, THROUGH
2021 ($ MILLIONS) 94
TABLE 36 NORTH AMERICAN FLIP-CHIP MARKET BY APPLICATION, THROUGH 2021
($ MILLIONS) 94
RULES AND REGULATIONS IN NORTH AMERICA 95
EUROPE 95
OVERVIEW 95
TABLE 37 EUROPEAN MARKET FOR FLIP-CHIP PRODUCTION BY COUNTRY,
THROUGH 2021 ($ MILLIONS) 96
TABLE 38 EUROPEAN MARKET FOR FLIP-CHIP END-USE DEMAND BY COUNTRY,
THROUGH 2021 ($ MILLIONS) 96
TABLE 39 EUROPEAN FLIP-CHIP MARKET BY END-USE DEMAND, THROUGH 2021 ($
MILLIONS) 97
TABLE 40 EUROPEAN FLIP-CHIP MARKET BY APPLICATION, THROUGH 2021 ($
MILLIONS) 97
RULES AND REGULATIONS IN EUROPE 98
RoHS 98
RoHS 2 98
ASIA-PACIFIC REGION 99
OVERVIEW 99
TABLE 41 ASIA-PACIFIC MARKET FOR FLIP-CHIP PRODUCTION BY COUNTRY,
THROUGH 2021 ($ MILLIONS) 99
TABLE 42 ASIA-PACIFIC MARKET FOR FLIP-CHIP END-USE DEMAND BY COUNTRY,
THROUGH 2021 ($ MILLIONS) 100
TABLE 43 ASIA-PACIFIC FLIP-CHIP MARKET BY END-USE DEMAND, THROUGH 2021
($ MILLIONS) 100
TABLE 44 ASIA-PACIFIC FLIP-CHIP MARKET BY APPLICATION, THROUGH 2021 ($
MILLIONS) 101
RULES AND REGULATIONS OF VARIOUS ASIA-PACIFIC ECONOMIES 101
China 101
REST OF THE WORLD 102
OVERVIEW 102
TABLE 45 ROW FLIP-CHIP MARKET BY END-USE DEMAND, THROUGH 2021 ($
MILLIONS) 102
TABLE 46 ROW FLIP-CHIP MARKET BY APPLICATION, THROUGH 2021 ($ MILLIONS) 103
CHAPTER 8 INDUSTRY STRUCTURE AND COMPETITIVE ANALYSIS 105
INDUSTRY STRUCTURE 105
INFLUENTIAL FACTORS 105
FORECAST COMPONENTS 105
FIGURE 36 INDUSTRY REVENUE MODEL 105
MARKET SHARE ANALYSIS 106
TABLE 47 GLOBAL FLIP-CHIP MARKET SHARES BY KEY PLAYERS, 2014 (%) 107
FACTORS IMPACTING THE FLIP-CHIP MARKET 108
SUPPLIERS' POWER 108
BARGAINING POWER OF BUYERS 108
THREAT FROM SUBSTITUTES 108
THREAT FROM NEW ENTRANTS 108
DEGREE OF COMPETITION 109
PATENT ANALYSIS 109
PATENTS BY REGION 109
FIGURE 37 REGIONAL ANALYSIS OF PATENTS, DECEMBER 2012-DECEMBER 2015 109
PATENTS BY YEAR 110
FIGURE 38 NUMBER OF PATENTS FILED BY YEAR, DECEMBER 2012-DECEMBER
2015 (NO OF PATENTS) 110
CHAPTER 9 COMPANY PROFILES 112
AMKOR TECHNOLOGY INC. 112
OVERVIEW AND PRIMARY BUSINESS 112
FINANCIALS 112
BUSINESS STRATEGIES 112
Innovation in Product Portfolio Through Research and Development 112
RECENT DEVELOPMENTS 113
ASE GROUP 113
OVERVIEW AND PRIMARY BUSINESS 113
FINANCIALS 113
BUSINESS STRATEGIES 113
Business Expansion Through Licensing Agreement 113
RECENT DEVELOPMENTS 114
FARADAY TECHNOLOGY CORP. 114
OVERVIEW AND PRIMARY BUSINESS 114
FINANCIALS 114
BUSINESS STRATEGIES 114
Strengthening Product Portfolio 115
RECENT DEVELOPMENTS 115
FLIPCHIP INTERNATIONAL LLC 115
OVERVIEW AND PRIMARY BUSINESS 115
FINANCIALS 116
BUSINESS STRATEGIES 116
Expanding Business Portfolio Through Agreements 116
RECENT DEVELOPMENTS 116
GIGPEAK INC. 116
OVERVIEW 117
FINANCIALS 117
BUSINESS STRATEGIES 117
Business Expansion by Acquisition 117
RECENT DEVELOPMENTS 117
GLOBALFOUNDRIES INC. 118
OVERVIEW AND PRIMARY BUSINESS 118
FINANCIALS 118
BUSINESS STRATEGIES 118
Strengthening Product Portfolio 118
RECENT DEVELOPMENTS 118
IBM CORP. 119
OVERVIEW AND PRIMARY BUSINESS 119
FINANCIALS 119
BUSINESS STRATEGIES 119
Business Expansion Through Acquisition 120
RECENT DEVELOPMENTS 120
INTEL CORP. 120
OVERVIEW AND PRIMARY BUSINESS 120
FINANCIALS 121
BUSINESS STRATEGIES 121
Acquisitions to Extend Product Portfolio 121
RECENT DEVELOPMENTS 121
KYOCERA AMERICA INC. 121
OVERVIEW AND PRIMARY BUSINESS 122
FINANCIALS 122
BUSINESS STRATEGIES 122
New Product Development 122
RECENT DEVELOPMENTS 122
NANIUM SA 123
OVERVIEW AND PRIMARY BUSINESS 123
FINANCIALS 123
BUSINESS STRATEGIES 123
New Product Development 123
Business Expansion Through Partnership 123
RECENT DEVELOPMENTS 124
NICHIA CORP. 124
OVERVIEW AND PRIMARY BUSINESS 124
FINANCIALS 124
BUSINESS STRATEGIES 124
Expanding Business Through Agreements 124
RECENT DEVELOPMENTS 125
NTK TECHNOLOGIES INC. 125
OVERVIEW AND PRIMARY BUSINESS 125
FINANCIALS 125
BUSINESS STRATEGIES 126
Business Expansion 126
RECENT DEVELOPMENTS 126
PHILIPS LUMILEDS LIGHTING CO. 126
OVERVIEW AND PRIMARY BUSINESS 126
FINANCIALS 126
BUSINESS STRATEGIES 127
Innovation in Product Portfolio 127
RECENT DEVELOPMENTS 127
POWERTECH TECHNOLOGY INC. 127
OVERVIEW AND PRIMARY BUSINESS 127
FINANCIALS 128
BUSINESS STRATEGIES 128
Business Expansion Through Agreements 128
RECENT DEVELOPMENTS 128
RENESAS ELECTRONICS AMERICA INC. 128
OVERVIEW AND PRIMARY BUSINESS 128
FINANCIALS 129
BUSINESS STRATEGIES 129
New Product Development 129
RECENT DEVELOPMENTS 129
SAMSUNG ELECTRONICS CO. LTD. 129
OVERVIEW AND PRIMARY BUSINESS 130
FINANCIALS 130
BUSINESS STRATEGIES 130
New Product Development 130
Business Expansion Through Acquisition 130
RECENT DEVELOPMENTS 131
SIGNETICS CORP. 131
OVERVIEW AND PRIMARY BUSINESS 131
FINANCIALS 131
BUSINESS STRATEGIES 131
Business Expansion 132
RECENT DEVELOPMENTS 132
SILICONWARE PRECISION INDUSTRIES CO. LTD. 132
OVERVIEW AND PRIMARY BUSINESS 132
FINANCIALS 133
BUSINESS STRATEGIES 133
Strategic Business Agreement 133
RECENT DEVELOPMENTS 133
SK HYNIX INC. 133
OVERVIEW AND PRIMARY BUSINESS 133
FINANCIALS 134
BUSINESS STRATEGIES 134
New Product Development 134
Research and Development 134
RECENT DEVELOPMENTS 134
STATS CHIPPAC PTE. LTD. 135
OVERVIEW AND PRIMARY BUSINESS 135
FINANCIALS 135
BUSINESS STRATEGIES 135
New Product Development 135
RECENT DEVELOPMENTS 136
STMICROELECTRONICS NV 136
OVERVIEW AND PRIMARY BUSINESS 136
FINANCIALS 136
BUSINESS STRATEGIES 136
Strengthening Product Portfolio 136
RECENT DEVELOPMENTS 137
SUSS MICROTEC AG 137
OVERVIEW AND PRIMARY BUSINESS 137
FINANCIALS 137
BUSINESS STRATEGIES 138
New Product Development 138
RECENT DEVELOPMENTS 138
TAIWAN SEMICONDUCTOR MANUFACTURING CO. 138
OVERVIEW AND PRIMARY BUSINESS 138
FINANCIALS 139
BUSINESS STRATEGIES 139
Business Expansion Through Collaboration 139
RECENT DEVELOPMENTS 139
TEKTRONIX COMPONENT SOLUTIONS INC. 139
OVERVIEW AND PRIMARY BUSINESS 140
FINANCIALS 140
BUSINESS STRATEGIES 140
Strengthening Product Portfolio 140
RECENT DEVELOPMENTS 140
TESSERA TECHNOLOGIES INC. 141
OVERVIEW AND PRIMARY BUSINESS 141
FINANCIALS 141
BUSINESS STRATEGIES 141
Strengthening Product Portfolio 141
RECENT DEVELOPMENTS 141
TEXAS INSTRUMENTS INC. 142
OVERVIEW AND PRIMARY BUSINESS 142
FINANCIALS 142
BUSINESS STRATEGIES 142
Strengthening Product Portfolio 142
RECENT DEVELOPMENTS 143
TOKYO ELECTRON LTD. 143
OVERVIEW AND PRIMARY BUSINESS 143
FINANCIALS 144
BUSINESS STRATEGIES 144
Strengthening Product Portfolio Through New Product Development 144
RECENT DEVELOPMENTS 144
TOSHIBA ELECTRONICS EUROPE GMBH 144
OVERVIEW AND PRIMARY BUSINESS 144
FINANCIALS 145
BUSINESS STRATEGIES 145
SMC089B - Flip-Chip Technologies and Global Markets
Copyright © BCC Research, Wellesley MA USA, Website: www.bccresearch.com
TOPIC PAGE NO.
New Product Development 145
RECENT DEVELOPMENTS 145
UNISEM (M) BERHAD 146
OVERVIEW AND PRIMARY BUSINESS 146
FINANCIALS 146
BUSINESS STRATEGIES 146
Business Expansion 146
RECENT DEVELOPMENTS 147
UTAC HOLDINGS LTD. 147
OVERVIEW AND PRIMARY BUSINESS 147
FINANCIALS 147
BUSINESS STRATEGIES 148
Strengthening Product Portfolio 148
RECENT DEVELOPMENTS 148

LIST OF TABLES

SUMMARY TABLE GLOBAL MARKET FOR FLIP-CHIP TECHNOLOGY BY WAFER
BUMPING PROCESS, THROUGH 2021 ($ MILLIONS) 8
TABLE 1 GLOBAL MARKET SHARES FOR FLIP-CHIP TECHNOLOGY BY WAFER
BUMPING PROCESS, 2015 AND 2021 (%) 37
TABLE 2 GLOBAL FLIP-CHIP UNIT SALES BY WAFER BUMPING PROCESS, THROUGH
2021 (MILLION UNITS) 39
TABLE 3 GLOBAL FLIP-CHIP TECHNOLOGY AVERAGE PRICE PER UNIT BY WAFER
BUMPING PROCESS, 2015-2021 ($) 40
TABLE 4 GLOBAL MARKET FOR COPPER (CU) PILLAR FLIP CHIPS BY END USE,
THROUGH 2021 ($ MILLIONS) 41
TABLE 5 MECHANICAL PROPERTIES OF TIN-LEAD (SN-PB) 43
TABLE 6 PHYSICAL PROPERTIES OF TIN-LEAD (SN-PB) 43
TABLE 7 GLOBAL MARKET FOR TIN-LEAD (SN-PB) FLIP CHIPS BY END USE, THROUGH
2021 ($ MILLIONS) 44
TABLE 8 CHARACTERISTICS OF VARIOUS ELEMENTS 46
TABLE 9 CHARACTERISTICS OF VARIOUS MIXED COMPOSITIONS 46
TABLE 10 GLOBAL MARKET FOR LEAD (PB)-FREE FLIP CHIPS BY END USE, THROUGH
2021 ($ MILLIONS) 48
TABLE 11 GLOBAL MARKET FOR GOLD STUD BUMPED FLIP CHIPS BY END USE,
THROUGH 2021 ($ MILLIONS) 50
TABLE 12 GLOBAL MARKET DEMAND FOR FLIP-CHIP TECHNOLOGIES BY
APPLICATION, THROUGH 2021 ($ MILLIONS) 55
TABLE 13 GLOBAL MARKET FOR FLIP CHIPS USED IN 2-D LOGIC SYSTEM-ON-CHIP BY
REGION, THROUGH 2021 ($ MILLIONS) 58
TABLE 14 COMPARATIVE ANALYSES OF VARIOUS TYPES OF MEMORY 59
TABLE 15 GLOBAL MARKET FOR FLIP CHIPS USED IN MEMORY APPLICATIONS BY
REGION, THROUGH 2021 ($ MILLIONS) 61
TABLE 16 GLOBAL MARKET FOR FLIP CHIPS USED IN IMAGING TECHNOLOGIES BY
REGION, THROUGH 2021 ($ MILLIONS) 62
TABLE 17 GLOBAL MARKET FOR FLIP CHIPS USED IN HB-LED APPLICATIONS BY
REGION, THROUGH 2021 ($ MILLIONS) 66
TABLE 18 GLOBAL MARKET FOR FLIP CHIPS USED IN RF APPLICATIONS BY REGION,
THROUGH 2021 ($ MILLIONS) 67
TABLE 19 GLOBAL MARKET FOR FLIP CHIPS USED IN 2.5-D/3-D APPLICATIONS BY
REGION, THROUGH 2021 ($ MILLIONS) 70
TABLE 20 GLOBAL MARKET FOR FLIP-CHIP TECHNOLOGY BY END USE, THROUGH
2021 ($ MILLIONS) 74
TABLE 21 GLOBAL FLIP-CHIP MARKET IN SMARTPHONES BY BUMPING PROCESS,
THROUGH 2021 ($ MILLIONS) 76
TABLE 22 GLOBAL FLIP-CHIP MARKET IN LAPTOPS BY BUMPING PROCESS, THROUGH
2021 ($ MILLIONS) 77
TABLE 23 GLOBAL FLIP-CHIP MARKET IN DESKTOP CENTRAL PROCESSING UNITS BY
BUMPING PROCESS, THROUGH 2021 ($ MILLIONS) 78
TABLE 24 GLOBAL FLIP-CHIP MARKET IN GRAPHIC PROCESSING UNITS AND
CHIPSETS BY BUMPING PROCESS, THROUGH 2021 ($ MILLIONS) 80
TABLE 25 GLOBAL FLIP-CHIP MARKET IN OTHER COMPUTING DEVICES BY BUMPING
PROCESS, THROUGH 2021 ($ MILLIONS) 81
TABLE 26 GLOBAL FLIP-CHIP MARKET IN AUTOMOTIVE APPLICATIONS BY BUMPING
PROCESS, THROUGH 2021 ($ MILLIONS) 83
TABLE 27 GLOBAL FLIP-CHIP MARKET IN ROBOTICS BY BUMPING PROCESS,
THROUGH 2021 ($ MILLIONS) 84
TABLE 28 GLOBAL FLIP-CHIP MARKET IN MEDICAL DEVICES BY BUMPING PROCESS,
THROUGH 2021 ($ MILLIONS) 86
TABLE 29 GLOBAL FLIP-CHIP MARKET IN SMART TECHNOLOGIES BY BUMPING
PROCESS, THROUGH 2021 ($ MILLIONS) 87
TABLE 30 GLOBAL FLIP-CHIP MARKET IN INDUSTRIAL APPLICATIONS BY BUMPING
PROCESS, THROUGH 2021 ($ MILLIONS) 89
TABLE 31 GLOBAL MARKET FOR FLIP-CHIP PRODUCTION BY REGION, THROUGH
2021 ($ MILLIONS) 92
TABLE 32 GLOBAL MARKET FOR FLIP-CHIP END-USE DEMAND BY REGION, THROUGH
2021 ($ MILLIONS) 92
TABLE 33 NORTH AMERICAN MARKET FOR FLIP-CHIP PRODUCTION BY COUNTRY,
THROUGH 2021 ($ MILLIONS) 93
TABLE 34 NORTH AMERICAN MARKET FOR FLIP-CHIP END-USE DEMAND BY
COUNTRY, THROUGH 2021 ($ MILLIONS) 93
TABLE 35 NORTH AMERICAN FLIP-CHIP MARKET BY END-USE DEMAND, THROUGH
2021 ($ MILLIONS) 94
TABLE 36 NORTH AMERICAN FLIP-CHIP MARKET BY APPLICATION, THROUGH 2021 ($
MILLIONS) 94
TABLE 37 EUROPEAN MARKET FOR FLIP-CHIP PRODUCTION BY COUNTRY, THROUGH
2021 ($ MILLIONS) 96
TABLE 38 EUROPEAN MARKET FOR FLIP-CHIP END-USE DEMAND BY COUNTRY,
THROUGH 2021 ($ MILLIONS) 96
TABLE 39 EUROPEAN FLIP-CHIP MARKET BY END-USE DEMAND, THROUGH 2021 ($
MILLIONS) 97
TABLE 40 EUROPEAN FLIP-CHIP MARKET BY APPLICATION, THROUGH 2021 ($
MILLIONS) 97
TABLE 41 ASIA-PACIFIC MARKET FOR FLIP-CHIP PRODUCTION BY COUNTRY,
THROUGH 2021 ($ MILLIONS) 99
TABLE 42 ASIA-PACIFIC MARKET FOR FLIP-CHIP END-USE DEMAND BY COUNTRY,
THROUGH 2021 ($ MILLIONS) 100
TABLE 43 ASIA-PACIFIC FLIP-CHIP MARKET BY END-USE DEMAND, THROUGH 2021 ($
MILLIONS) 100
TABLE 44 ASIA-PACIFIC FLIP-CHIP MARKET BY APPLICATION, THROUGH 2021 ($
MILLIONS) 101
TABLE 45 ROW FLIP-CHIP MARKET BY END-USE DEMAND, THROUGH 2021 ($
MILLIONS) 102
TABLE 46 ROW FLIP-CHIP MARKET BY APPLICATION, THROUGH 2021 ($ MILLIONS) 103
TABLE 47 GLOBAL FLIP-CHIP MARKET SHARES BY KEY PLAYERS, 2014 (%) 107

LIST OF FIGURES

SUMMARY FIGURE GLOBAL MARKET FOR FLIP-CHIP TECHNOLOGY BY WAFER
BUMPING PROCESS, 2015-2021 ($ MILLIONS) 8
FIGURE 1 DEVELOPMENT OF WAFER BUMPING TECHNOLOGIES, 1960-2004 10
FIGURE 2 SOLDER EVAPORATION PROCESS 11
FIGURE 3 SOLDER ALLOY ELECTROPLATING PROCESS 11
FIGURE 4 SOLDER PASTE SCREENING PROCESS 12
FIGURE 5 GLOBAL MARKET SHARES FOR FLIP-CHIP TECHNOLOGY BY WAFER
BUMPING PROCESS, 2015 AND 2021 (%) 38
FIGURE 6 GLOBAL FLIP-CHIP UNIT SALES BY WAFER BUMPING PROCESS, 2015-2021
(MILLION UNITS) 39
FIGURE 7 GLOBAL MARKET FOR COPPER (CU) PILLAR FLIP CHIPS BY END USE,
2015-2021 ($ MILLIONS) 41
FIGURE 8 GLOBAL MARKET FOR TIN-LEAD (SN-PB) FLIP CHIPS BY END USE,
2015-2021 ($ MILLIONS) 45
FIGURE 9 GLOBAL MARKET FOR LEAD (PB)-FREE FLIP CHIPS BY END USE, 2015-2021
($ MILLIONS) 49
FIGURE 10 GLOBAL MARKET FOR GOLD STUD BUMPED FLIP CHIPS BY END USE,
2015-2021 ($ MILLIONS) 51
FIGURE 11 MARKET SEGMENTATION BY APPLICATION 53
FIGURE 12 GLOBAL MARKET FOR FLIP-CHIP TECHNOLOGIES BY APPLICATION,
2015-2021 ($ MILLIONS) 55
FIGURE 13 STRUCTURE OF MULTI-CHIP MODULE 56
FIGURE 14 STRUCTURE OF SYSTEM-ON-CHIP 57
FIGURE 15 GLOBAL MARKET FOR FLIP CHIPS USED IN 2-D LOGIC SYSTEM-ON-CHIP
BY REGION, 2015-2021 ($ MILLIONS) 58
FIGURE 16 GLOBAL MARKET FOR FLIP CHIPS USED IN MEMORY APPLICATIONS BY
REGION, 2015-2021 ($ MILLIONS) 61
FIGURE 17 GLOBAL MARKET FOR FLIP CHIPS USED IN IMAGING TECHNOLOGIES BY
REGION, 2015-2021 ($ MILLIONS) 63
FIGURE 18 STRUCTURE OF HB-LED 65
FIGURE 19 GLOBAL MARKET FOR FLIP CHIPS USED IN HB-LED APPLICATIONS BY
REGION, 2015-2021 ($ MILLIONS) 66
FIGURE 20 GLOBAL MARKET FOR FLIP CHIPS USED IN RF APPLICATIONS BY REGION,
2015-2021 ($ MILLIONS) 67
FIGURE 21 ARCHITECTURE OF 2.5-D INTEGRATED CIRCUIT 68
FIGURE 22 STRUCTURE OF 3-D INTEGRATED CIRCUIT 69
FIGURE 23 GLOBAL MARKET FOR FLIP CHIPS USED IN 2.5-D/3-D APPLICATIONS BY
REGION, 2015-2021 ($ MILLIONS) 70
FIGURE 24 GLOBAL MARKET FOR FLIP-CHIP TECHNOLOGY BY END USE, 2015-2021
($ MILLIONS) 75
FIGURE 25 GLOBAL FLIP-CHIP MARKET IN SMARTPHONES BY BUMPING PROCESS,
2015-2021 ($ MILLIONS) 76
FIGURE 26 GLOBAL FLIP-CHIP MARKET IN LAPTOPS BY BUMPING PROCESS,
2015-2021 ($ MILLIONS) 78
FIGURE 27 GLOBAL FLIP-CHIP MARKET IN DESKTOP CENTRAL PROCESSING UNITS BY
BUMPING PROCESS, 2015-2021 ($ MILLIONS) 79
FIGURE 28 GLOBAL FLIP-CHIP MARKET IN GRAPHICS PROCESSING UNITS AND
CHIPSETS BY BUMPING PROCESS, 2015-2021 ($ MILLIONS) 80
FIGURE 29 GLOBAL FLIP-CHIP MARKET IN OTHER COMPUTING DEVICES BY BUMPING
PROCESS, 2015-2021 ($ MILLIONS) 81
FIGURE 30 GLOBAL FLIP-CHIP MARKET IN AUTOMOTIVE APPLICATIONS BY BUMPING
PROCESS, 2015-2021 ($ MILLIONS) 83
FIGURE 31 GLOBAL FLIP-CHIP MARKET IN ROBOTICS BY BUMPING PROCESS,
2015-2021 ($ MILLIONS) 84
FIGURE 32 GLOBAL FLIP-CHIP MARKET IN MEDICAL DEVICES BY BUMPING PROCESS,
2015-2021 ($ MILLIONS) 86
FIGURE 33 GLOBAL FLIP-CHIP MARKET IN SMART TECHNOLOGIES BY BUMPING
PROCESS, 2015-2021 ($ MILLIONS) 88
FIGURE 34 GLOBAL FLIP-CHIP MARKET IN INDUSTRIAL APPLICATIONS BY BUMPING
PROCESS, 2015-2021 ($ MILLIONS) 89
FIGURE 35 REGIONAL SEGMENTATION OF THE FLIP-CHIP MARKET 91
FIGURE 36 INDUSTRY REVENUE MODEL 105
FIGURE 37 REGIONAL ANALYSIS OF PATENTS, DECEMBER 2012-DECEMBER 2015 109
FIGURE 38 NUMBER OF PATENTS FILED BY YEAR, DECEMBER 2012-DECEMBER 2015
(NO OF PATENTS) 110

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