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Design Analysis Ericsson W-CDMA/LTE 17/2100MHz AIR21 60W (2x30W) 4x2 MIMO

  • November 2013
  • -
  • EJL Wireless Research LLC
  • -
  • 126 pages

This report covers the design analysis of an Ericsson W-CDMA/LTE 17/2100MHz AIR21 60W 4x2 MIMO unit. This unit is part of the RBS610x/6201/6301/6601 base station platform for Ericsson W-CDMA/LTE. The unit was manufactured in Q3 2012.

Component and semiconductor suppliers mentioned in this report include: Analog Devices, ETAL, Fairchild Semiconductor, Freescale Semiconductor, Infineon Technologies, Integrated Device Technology, Maxim Integrated Products, Micron Technology, Nippon Chemi-Con, NXP Semiconductors, STMicroelectronics, TDK-Epcos, Texas Instruments, & Vishay Semiconductors.

Features:

Complete Part Number/Marking
Component Manufacturer Identification
Function Component Description
Package Type

Important Note: There is NO component pricing contained within the report.

Table Of Contents

Design Analysis Ericsson W-CDMA/LTE 17/2100MHz AIR21 60W (2x30W) 4x2 MIMO
EXECUTIVE SUMMARY 7
Radio Unit Active/Passive Component Summary 7
Important Note: 7
CHAPTER 1: ERICSSON RBS6000 BTS SYSTEM 8
Overview of RBS6601 Product Offering 8
CHAPTER 2: AIR21 RADIO UNIT SUBSYSTEM MECHANICAL ANALYSIS. 12
ARUS RRUS 02 TRx/RF Power Amplifier Heat Sink 17
CHAPTER 3: ARUS DC AND RF CABLES 19
CHAPTER 4: CPRI INTERFACE SUBSYSTEM 22
CHAPTER 5: POWER SURGE PROTECTION DEVICE (SPD) PCB 27
CHAPTER 6: RRUS 02 SUBSYSTEM 29
Digital Processor and TRx PCB 31
Area A: Baseband Signal Processing 33
Area B: TRx/Power Amplifier Power Supply.36
Area B1.36
Area B2.37
Area C: RRUS 02 Transmitter 42
Area D: RF Power Amplifier Tx Sampling Circuit 45
Area E: RRUS 02 System Timing 48
Area F: Receiver RF Downconversion 50
Areas F1 and F2: AIR21 Receiver Low Noise Amplifier 51
Area F3: AIR21 Receiver RF/IF Downconverter55
Area G: Dual Receiver A/D Converters 58
ROR 101 0007 1 R2B.61
PA9F41 Frequency Synthesizer Module.64
E-H04AFrequency Synthesizer Module66
E-H14A Frequency Synthesizer Module.68
E-E42A Frequency Synthesizer Module.70
E-R02A Frequency Synthesizer Module.72
CHAPTER 7: RRUS 02 RF POWER AMPLIFIER SUBSYSTEM 75
AIR21 RF Power Amplifier 78
CHAPTER 8: RRUS02 DUPLEXER CAVITY FILTER RF SUBSYSTEM 84
RRUS 02 Duplexer Filter Waveguide/Resonator Analysis 87
Duplexer Filter Housing90
CHAPTER 9: AIR21 ANTENNA SUBSYSTEM MECHANICAL ANALYSIS 91
CHAPTER 10: 1900MHZ BAND. 98
CHAPTER 11: 17/2100 MHZ BAND 105
CHAPTER 12: RET SYSTEM 110
APPENDIX A - PASSIVE COMPONENT MARKET SHARE/CASE SIZE ANALYSIS 116
APPENDIX B - ACTIVE COMPONENT MARKET SHARE ANALYSIS 120

TABLES

Table 1: ARUS Cables/Connectors Bill of Materials 19
Table 2: Interface PCB Top, Bill of Materials 26
Table 4: Power SPD PCB Top, Bill of Materials 28
Table 5: Area A Bill of Materials 34
Table 6: Area B1 Bill of Materials 38
Table 7: Area B2 Bill of Materials 41
Table 8: Area C Bill of Materials 44
Table 9: Area D Bill of Materials 47
Table 10: Area E Bill of Materials 49
Table 11: Area F1 Bill of Materials 53
Table 12: Area F2 Bill of Materials 54
Table 13: Area F3 Bill of Materials 57
Table 14: Area G Bill of Materials 60
Table 15: ROR 101 0007 1 R2B Bill of Materials 63
Table 17: PA9F41 Module Bill of Materials 65
Table 18: E-H04A Module Bill of Materials 67
Table 19: E-H14A Module Bill of Materials 69
Table 19: E-E42A Module Bill of Materials 71
Table 19: E-R02A Module Bill of Materials 74
Table 20: AIR21 RF Power Amplifier Bill of Materials. 83
Table 21: Passive Component Case Size Distribution by System Subsection 117
Table 22: Identified Passive Component Supplier Distribution by System Subsection 118
Table 23: Active/Passive Component Distribution by System Subsection. 119
Table 24: Active Semiconductor/Component Vendor Distribution by System Subsection 121

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