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Global Chip-R Trends Industry

  • January 2014
  • -
  • Global Industry Analysts
  • -
  • 13 pages

Chip resistors are mainly used for improving the reliability and functionality of electrical components through the creation and maintenance of an optimal level of current.

The report analyzes and presents an overview of Chip-R market worldwide. The report also provides a review of growth drivers, and strategic industry activities of major companies worldwide. In addition, 58 companies operating in the Chip-R arena worldwide including American Technical Ceramics Corporation, Anaren Inc., Bourns Inc., CTS Corporation, Hong Kong Resistors Manufactory, International Manufacturing Services Inc., NIC Components Corporation, Panasonic Corporation, and Vishay Precision Group, Inc. and others are profiled.

Table Of Contents

Global Chip-R Trends Industry

1.CHIP-R

Chip Resistors - An Introduction

2.RECENT INDUSTRY ACTIVITY

Vishay Precision Group Launches VCS1625ZP Chip Resistor

Vishay Precision Group Unveils VCS1610Z Chip Resistor

Yageo Develops RC0075 Chip Resistor

Vishay Precision Group Releases VSMF Series of Bulk Metal® Foil Chip Resistors

Vishay Intertechnology Extends MC AT Professional Thin Film Chip Resistor Series

3.MARKET PARTICIPANTS

American Technical Ceramics Corporation (USA)

Anaren, Inc. (USA)

ARCOL UK Ltd. (UK)

ASJ Holdings Ltd. (Singapore)

AVX Corporation a Kyocera Group Company (USA)

Bourns, Inc. (USA)

Caddock Electronics, Inc. (USA)

Cal-Chip Electronics (USA)

CTS Corporation (USA)

Cyntec Co., Ltd. (Taiwan)

EMC Technology and Florida RF Labs (USA)

Hokuriku Electric Industry Co., Ltd. (Japan)

Hong Kong Resistors Manufactory (Hong Kong)

Hua Jung Components Co., Ltd. (Taiwan)

Integrated Electronics Technology Pvt., Ltd. (INTRON) (India)

International Manufacturing Services, Inc. (USA)

Kamaya Electric Co., Ltd. (Japan)

KOA Corporation (Japan)

KOA Speer Electronics, Inc. (USA)

Megastar Electroniques, Inc. (Canada)

Microtech GmbH Electronic (Germany)

Mini-Systems, Inc. (MSI) (USA)

NIC Components Corporation (USA)

Nicrom Electronic (Switzerland)

Nikkohm Co., Ltd. (Japan)

Ohmite Mfg. Company (USA)

OnChip Devices, Inc. (USA)

Panasonic Corporation (Japan)

PRO-AN Electronic Co., Ltd. (Hong Kong)

RCD Components, Inc. (USA)

Rhopoint Components Ltd. (UK)

Riedon, Inc. (USA)

ROHM Co., Ltd. (Japan)

RUTRONIK Elektronische Bauelemente GmbH (Germany)

Samsung Electro-Mechanics Co., Ltd. (Korea)

Siegert Thinfilm Technology GmbH (Germany)

Siricom Technology (India)

SRT Resistor Technology GmbH (Germany)

Stackpole Electronics, Inc. (USA)

State of the Art, Inc. (USA)

Susumu Co., Ltd. (Japan)

SUSUMU International USA (USA)

Synton-Tech Corporation (Taiwan)

TA-I Technology Co., Ltd. (Taiwan)

Tateyama Kagaku Device Technology Co., Ltd. (Japan)

TE Connectivity Corporation (USA)

Tecdia, Inc. (USA)

Thin Film Technology Corporation (USA)

Token Electronics Industry Co., Ltd. (Taiwan)

TT Electronics PLC (UK)

Venkel Ltd. (USA)

Viking Tech Corporation (Taiwan)

Vishay Precision Group, Inc. (USA)

Walsin Technology Corporation (Taiwan)

Welt Electronic SpA (Italy)

Yageo Corporation (Taiwan)

Yantel Corporation (China)

Zealway Electronics Co., Ltd. (Taiwan)

4.APPENDIX



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