1. Market Research
  2. > Manufacturing
  3. > Electronics Manufacturing Market Trends
  4. > Global Outsourced Semiconductor Assembly and Test Market (OSAT) Trends Industry

The Outsourced Semiconductor Assembly and Test Services market is projected to witness significant upsurge, primarily driven by the increase in packaging costs and a rapid transformation towards the adoption of outsourcing model in the coming years.

The report analyzes and presents an overview of Outsourced Semiconductor Assembly and Test market worldwide. The report in addition provides global market estimates and projections in US dollars for Outsourced Semiconductor Assembly and Test (OSAT) for years 2012 through 2017. Supported with 2 market data tables, the report provides a review of market trends, growth drivers, and various strategic industry activities of major companies witnessed by the industry over the last few years. In addition, 37 companies operating in the Outsourced Semiconductor Assembly and Test market worldwide including Amkor Technology, BE Semiconductor Industries, Cirtek Electronics Corporation, Denis Ferranti Group, IBM Microelectronics, PSI Technologies, STATS ChipPAC, Toshiba Semiconductor & Storage Products Company, Unisem (M) Bhd, and others are profiled.

Table Of Contents

Global Outsourced Semiconductor Assembly and Test Market (OSAT) Trends Industry

1.OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST MARKET - AN OVERVIEW

Market Scenario

Table 1: Global Outsourced Semiconductor Assembly and Test Market (OSAT) (2012-2017) in US$ Million

Table 2: Outsourced Semiconductor Assembly and Test Market (OSAT) Worldwide by Company (2012): Percentage Share Breakdown by Value Sales for Advanced Semiconductor Engineering, Inc.; Amkor Technology, Inc.; Siliconware Precision Industries Co., Ltd.; STATS ChipPac Ltd.; ChipMOS TECHNOLOGIES (Bermuda) Ltd.; and Others

Back-end Manufacturing Processes Provide Impetus to Outsourced Semiconductor Assembly and Test Companies

Major Growth Drivers

Increased Adoption of Packaging and Assembly Technologies in Diversified Electronic and Portable Devices

Rapid Expansion of Outsourced Semiconductor Assembly and Test Companies in Southeast Asia

Electronic Outsourcing Services Industry Fails to Address Demand of Middle Market

Japanese Chipmakers Turn towards Outsourcing of Assembly and Test Processes

2.RECENT INDUSTRY ACTIVITY

Amkor Signs MoU with Toshiba to Take Over Toshiba Electronics Malaysia

ASE Assembly and Test (Shanghai) to Take Over Wuxi Tongzhi Microelectronics

Renesas Electronics Inks MoU with J-Devices

STATS ChipPAC and UMC Microelectronics Introduce Advanced 3D IC Chip Stacking Technology

Shinko Electric Industries Obtains License to Use TMV® Technology of Amkor Technology

Salland Engineering International and Pintail Technologies Merge

Dynamic Test Solutions and Tessolve Services Sign Merger Agreement

3.MARKET PARTICIPANTS

Advanced Semiconductor Engineering, Inc. (Taiwan)

Amkor Technology, Inc. (USA)

Ardentec Corp. (Taiwan)

ASE Assembly and Test (Shanghai) Ltd. (China)

Automated Technology (Phil), Inc. (Philippines)

BE Semiconductor Industries N.V. (The Netherlands)

Carsem (M) Sdn. Bhd. (Malaysia)

ChipMOS Technologies (Bermuda) LTD. (Taiwan)

Cirtek Electronics Corporation (Philippines)

Denis Ferranti Group (UK)

Dynamic Test Solutions Asia Pte., Ltd. (Singapore)

EEMS Italia SpA (Italy)

GEM Services, Inc. (China)

IBM Microelectronics (USA)

J-DEVICES Corporation (Japan)

King Yuan Electronics Co., Ltd. (Taiwan)

Kulicke and Soffa Industries, Inc. (Singapore)

Lingsen Precision Industries, Ltd. (Taiwan)

LTX-Credence Corporation (USA)

Orient Semiconductor Electronics (Taiwan)

Powertech Technology, Inc. (Taiwan)

PSI Technologies, Inc. (Philippines)

Salland Engineering International (The Netherlands)

Signetics Corporation (Korea)

Siliconware Precision Industries Co., Ltd. (Taiwan)

SPEL Semiconductor Ltd. (India)

Stars Microelectronics (Thailand) Public Company Ltd. (Thailand)

STATS ChipPAC, Ltd. (Singapore)

Tektronix Component Solutions (USA)

Tessolve Services Pvt. Ltd. (India)

Tianshui Huatian Microelectronics Co., Ltd. (China)

Tong Hsing Electronic Industries Ltd. (Taiwan)

Toshiba Semiconductor and Storage Products Company (Japan)

Unisem (M) Bhd. (Malaysia)

United Microelectronics Corporation (Taiwan)

United Test and Assembly Center Ltd. (Singapore)

Youngtek Electronics Corporation (YTEC) (Taiwan)

4.APPENDIX



View This Report »

Get Industry Insights. Simply.

  • Latest reports & slideshows with insights from top research analysts
  • 24 Million searchable statistics with tables, figures & datasets
  • More than 10,000 trusted sources
24/7 Customer Support

Talk to Veronica

+1 718 514 2762

Purchase Reports From Reputable Market Research Publishers
Power Over Ethernet Solutions Market by Type, Device Type, Application, Vertical, and Geography - Global Forecast to 2022

Power Over Ethernet Solutions Market by Type, Device Type, Application, Vertical, and Geography - Global Forecast to 2022

  • $ 6328
  • Industry report
  • October 2016
  • by MarketsandMarkets

“Growing demand for PoE-enabled products is fueling the growth of the power over Ethernet (PoE) solutions market.” The global power over Ethernet solutions market is expected to grow at a CAGR of ...

Worldwide Advanced Driver Assistance Systems Forecast, 2016-2020: Semiconductors in the Connected Car and the Changing Automotive Architecture

Worldwide Advanced Driver Assistance Systems Forecast, 2016-2020: Semiconductors in the Connected Car and the Changing Automotive Architecture

  • $ 5720
  • Industry report
  • December 2016
  • by IDC

This IDC study provides data for ADAS and microprocessors for 2015-2020, with analysis and commentary."The increased adoption of more sophisticated ADAS function, which will eventually result in autonomous ...

Radiation-Hardened Electronics Market by Component, Manufacturing Technique, Application, and Geography - Global Forecast to 2022

Radiation-Hardened Electronics Market by Component, Manufacturing Technique, Application, and Geography - Global Forecast to 2022

  • $ 5650
  • Industry report
  • October 2016
  • by MarketsandMarkets

“Advancements in FPGA & multicore processor technologies for defense and space applications is fueling the growth of the radiation-hardened electronics market” The global radiation-hardened electronics ...


ref:plp2014

Reportlinker.com © Copyright 2017. All rights reserved.

ReportLinker simplifies how Analysts and Decision Makers get industry data for their business.