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Global Flexible Substrate Trends Industry

  • January 2014
  • -
  • Global Industry Analysts
  • -
  • 17 pages

Flexible Substrates refer to ultra-thin and ultra-light base components upon which electronic devices are deposited at the time of assembling electronic circuits to fabricate extremely lightweight and rollable flexible electronics. Plastic, glass, and stainless steel are the most commonly used materials for flexible substrates.

The report analyzes and presents an overview of Flexible Substrates market worldwide. The report also provides a review of market trends, growth drivers, and strategic industry activities of major companies worldwide. In addition, 18 companies operating in the Flexible Substartes arena worldwide including 3M Company, BenQ Materials Corporation, Polyonics Inc., Rogers Corporation and others are profiled.

Table Of Contents

Global Flexible Substrate Trends Industry

1.FLEXIBLE SUBSTRATES - AN OVERVIEW

Flexible Substrates - Adding Flexibility and Conformability to Electronic Devices

2.MARKET TRENDS

Market Overview

Printed Electronics Technologies Emerge in Commercial Applications

Flexible Substrates Witness Upsurge in OLED Displays and Lightings

Flexible PVs - An Emerging Solution for Use in Solar Modules

Flexible Substrates Garner Considerable Research Interest for Developing Flexible Medical Devices

Increase in Adoption of Organic Electronics-based IC Designing Method for Non-Invasive Monitoring Devices

Flexible Substrates Face Stiff Competition from Existing Substrates and Technologies

3.RECENT INDUSTRY ACTIVITY

Clariant International Acquires Silver Nanoparticle Ink Technology of Bayer

New Energy Technologies Enters into Phase 2 of CRADA with US NREL

Soligie Inks Agreement with Thin Film Electronics

Universal Display and Fujifilm Ink Agreement

DuPont Microcircuit Materials and Holst Centre Collaborate for Printed Structures on Flexible Substrates Program

FLEXcon to Acquire Graphics Division of Arlon

AU Optronics Enters into Partnership with Flexible Display Center

4.PRODUCT LAUNCHES

MOMA Consortium Develops Re-Programmable Memory Arrays

Polyonics Expands PolyFLEX Flexible Substrates and Films Range

Kolon Industries Unveils Colourless Polyimide Material

Wayne State University Develops New Technology to Integrate CMOS Devices in Flexible Substrates

Beneq Introduces Web Coating System WCS 500

HP Develops Technology for Production of AMOLED Panels

Lawrence Berkeley National Laboratory Develops New Carbon Nanotube Ink

North Dakota State University Develops Laser-Enabled Advanced Packagingâ„¢ Technology

DKN Research Unveils UTF Connector Concept Model

5.MARKET PARTICIPANTS

3M Company (USA)

American Semiconductor, Inc. (USA)

Argotec LLC (USA)

Arlon Graphics LLC (USA)

AzCoat, Inc. (USA)

BenQ Materials Corporation (Taiwan)

Corning, Inc. (USA)

DuPont Teijin Films U.S. Ltd. Partnership (USA)

Dyesol Ltd. (Australia)

E.I. DuPont de Nemours and Company (USA)

Griff Paper and Film (USA)

Heraeus Materials Technology GmbH and Co. KG (Germany)

Heraeus Packaging Technology (Germany)

Polyonics, Inc. (USA)

Porex Corporation (USA)

Rogers Corporation (USA)

SCHOTT North America, Inc. (USA)

Teijin Ltd. (Japan)

6.APPENDIX



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