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Global Flip-Chip Trends Industry

  • January 2014
  • -
  • Global Industry Analysts
  • -
  • 15 pages

"Flip-chip is one of the key packaging techniques for microelectronic circuits. The technique is finding rapid adoption in consumer and high-end applications. The adoption of flip-chip technique is primarily fueled by its benefits in terms of performance, size, reliability, flexibility and cost in comparison to other packaging methods."

The report analyzes and presents an overview of Flip-Chip market worldwide. Supported with 2 market data tables, the report provides a review of market trends, applications, advantages of Flip-Chip technique, and further highlights on various strategic industry activities of major companies witnessed by the industry over the last few years. In addition, 28 companies operating in the Flip-Clip arena worldwide including Amkor Technology Inc., FlipChip International LLC, Kyocera America Inc., NTK Technologies Inc., Philips Lumileds Lighting Company, Signetics Corporation, STATS ChipPAC Ltd., STMicroelectronics NV, Tessera Technologies Inc., Toshiba Electronics Europe GmbH, and other are profiled.

Table Of Contents

Global Flip-Chip Trends Industry

1.FLIP-CHIP - AN OVERVIEW

A Prelude

Flip-Chip - Enabling Compact, Smart Devices

Flip-Chip - Applications

Advantages of Flip-Chip Technique

High Packaging Density

High Performance

Ruggedness

Cost-efficiency

Flip-Chips Package Design

Manufacturing of Flip-Chip Assemblies

2.MARKET TRENDS

Flip-Chip Technique Extends to New Applications

Table 1: Global Flip Chip Market (2012-2017) in US$ Million

Table 2: Global Flip Chip Market by Application (2012-2017) in Million Units for Aerospace and Defense, Automotive, Industrial and Medical, Consumer, Computing, and Telecommunications

Latest Chip Interconnection Techniques Drive Flip-Chip Adoption

WLP Gradually Replaces Flip-Chips in Compact Products

3.RECENT INDUSTRY ACTIVITY

FlipChip International Inks Partnership Agreement with EZconn Czech

Philips Lumileds Introduces LUXEON Flip Chip LEDs

Altera Selects FCmBGA Packaging Solution of Amkor Technology

FlipChip International Takes Over Millennium Microtech Holdings

FlipChip International Forms Joint Venture with Millennium Microtech

Kyocera America Sets Up New Clean Room

Shinkawa Unveils LFB-1102 Flip-Chip Bonder for TCB Substrate Process

Signetics to Expand Flip-Chip Package Assembly Capacity

STATS ChipPAC Introduces fcCuBEâ„¢ Flip-Chip Packaging Technology

Philips Lumileds Unveils LUXEON Rebel LEDs

STATS ChipPAC Launches LCFC Technology with Copper Column Bump

Tessera Inks Licensing Agreement with Nanium

Zicom Group Purchases Controlling Stake in Orion Systems Integration

4.MARKET PARTICIPANTS

Amkor Technology, Inc. (USA)

ASE Group (Taiwan)

ASE Kaohsiung (Taiwan)

Belton Technology Group (China)

Faraday Technology Corporation (Taiwan)

FlipChip International LLC (USA)

GigOptix, Inc. (USA)

Ibiden Co., Ltd. (Japan)

Kyocera America, Inc. (USA)

LSI Corporation (USA)

Nanium (Portugal)

NTK Technologies, Inc. (USA)

Philips Lumileds Lighting Company (USA)

Reflex Photonics, Inc. (Canada)

Renesas Electronics America, Inc. (USA)

Shinko Electric Industries Co., Ltd. (Japan)

Signetics Corporation (South Korea)

Siliconware Precision Industries Co., Ltd. (Taiwan)

STATS ChipPAC Ltd. (Singapore)

STMicroelectronics NV (Switzerland)

Tektronix Component Solutions (USA)

Tessera Technologies, Inc. (USA)

Tokyo Electron Ltd. (Japan)

Toshiba Electronics Europe GmbH (Germany)

Toshiba Semiconductor and Storage Products (Japan)

Unisem Advanced Technologies Sdn. Bhd. (UAT) (Malaysia)

UTAC Holdings Ltd. (UTAC Group) (Singapore)

Valtronic Technologies (Suisse) SA (Switzerland)

5.APPENDIX



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