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Global IC Substrate Trends Industry

  • January 2014
  • -
  • Global Industry Analysts
  • -
  • 17 pages

IC substrates, also referred to as IC carriers, are extremely miniaturized circuits used as packaging for ICs, assembled into electronic devices such as digital cameras, mobile phones, engine controls, memory modules, and global positioning systems. In electronic devices including PCs, the mother board comprises a number of components such as GPU, MPU, or memory; which contain a network of IC chips.

The report analyzes and presents an overview of IC Substrates market worldwide. Supported with 3 market data tables, the report provides a review of market trends, growth drivers, and strategic industry activities of major companies worldwide. The report further discusses about various types, and applications of IC Substrates. In addition, 32 companies operating in the IC Substrates arena worldwide including AT & S Austria Technologie & Systemtechnik AG, Camtek Ltd., Compeq Manufacturing Co. Ltd., Founder PCB, Genesem Inc., IBIDEN Co. Ltd., Laird Technologies Inc., QDOS Holdings Bhd., Samsung Electro-Mechanics Co. Ltd., and others are profiled.

Table Of Contents

Global IC Substrate Trends Industry

1.IC SUBSTRATES - A TECHNOLOGY PERSPECTIVE

IC Substrates - An Introduction

IC Substrates - Characteristics

IC Substrates - Manufacturing Process

IC Substrates - Types

IC Substrates - Applications

Substrate-Specific Applications

2.MARKET TRENDS

Global IC Substrate Market to Witness Growth

Table 1: Global IC Substrate Market (2012-2017) in US$ Million

Table 2: Global IC Substrates Market by Company (2012) - Percentage Share Breakdown by Value Sales for IBIDEN, SEMCO, Shinko, NANYA PCB, Unimicron, Kinsus and Others

Technology Innovations in the IC Packaging Industry

Chemical Bonding-based NEAP vsMechanical Bonding-based NEAP

Role of Japan in the Global IC Substrate Market

Overview of the PCB Assembly Industry in China

Major Production Centers in China

Strategies adopted by Manufacturers

Significant Government Support

IC Substrate Industry in Taiwan

Table 3: Global IC Substrates Packaging Market by Country (2012) - Percentage Share Breakdown for Taiwan and Others

Increasing Adoption of Flip-chip Connection Technology

Emergence of Coreless IC Substrates

Major IC Substrate Manufacturers in South Korea

BT Resin Production Shifts from Japan to China, Taiwan and South Korea

3.RECENT INDUSTRY ACTIVITY

Atotech Expands TechCenters in Asia

Austria Technologie and Systemtechnik Aktiengesellschaft Commences Production of IC Substrates

Orbotech Introduces Ultra PerFix 120 Automated Optical Repair System

Orbotech Pacific Showcases PCB Innovations

Atotech Develops Ecoganth MV Manufacturing Process for PCBs and IC Substrates

Atotech Offers Cupra Etchâ„¢ DE Process

Orbotech Releases Ultra Fusionâ„¢ 300 AOI System

Unimicron Technology and Nan Ya PCB Corporation Develop Coreless IC Substrates

Advanced Semiconductor Engineering to Expand Operations in Taiwan and China

Camtek Unveils Phoenix Range of Automatic Optical Inspection Systems

4.MARKET PARTICIPANTS

AT and S Austria Technologie and Systemtechnik AG (ATandS) (Austria)

Atotech Deutschland GmbH (Germany)

BoardTek Electronics Corporation (Taiwan)

Camtek Ltd. (Israel)

Compeq Manufacturing Co., Ltd. (Taiwan)

Daeduck Electronics Company (Korea)

DYCONEX AG an MST Company (Switzerland)

Eastern Co., Ltd. (Japan)

Elec and Eltek International Holdings Ltd. (Singapore)

Founder PCB (China)

Fujitsu Interconnect Technologies Ltd. (Japan)

Genesem, Inc. (Korea)

Hoya Corporation (Japan)

IBIDEN Co., Ltd. (Japan)

Kinsus Interconnect Technology Corporation (Taiwan)

Kyocera SLC Technologies Corporation (Japan)

Laird Technologies, Inc. (USA)

LG Innotek Co., Ltd. (Korea)

Linxens (France)

Nan Ya PCB Corporation (Taiwan)

NGK Spark Plug Co., Ltd. (Japan)

QDOS Holdings Bhd. (Malaysia)

Samsung Electro-Mechanics Co., Ltd. (South Korea)

SEP Co., Ltd. (Korea)

Shennan Circuit Co., Ltd. (China)

Shinko Electric Industries Co., Ltd. (Japan)

Simmtech Co., Ltd. (Korea)

Tong Hsing Electronic Industries Ltd. (Taiwan)

Toppan Printing Co., Ltd. - Material Solutions Division (Japan)

TTM Technologies, Inc. (USA)

Unimicron Technology Corporation (Taiwan)

Zhen Ding Technology Holding Ltd. (China)

5.APPENDIX



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