1. Market Research
  2. > Manufacturing
  3. > Electronics Manufacturing Market Trends
  4. > Cost and Investment Implications of 3D NAND

Cost and Investment Implications of 3D NAND

  • May 2014
  • -
  • Forward Insights
  • -
  • 112 pages

The NAND flash industry is on the cusp of a technology inflection point. 2D NAND is reaching its scaling limits with 3D NAND its anointed successor.

In the 2D NAND era, the underlying process technology (with a few exceptions) is essentially the same amongst all the NAND flash manufacturers.
However, in the 3D NAND era, all the NAND flash manufacturers are developing different 3D NAND concepts with variations in the process implementation. The different processes will impact the investment and manufacturing cost for each of the 3D NAND technologies.

This report provides a detailed analysis of the fab and manufacturing implications of 3D floating gate and charge trap NAND concepts from Samsung, Toshiba, SK Hynix and Intel-Micron versus 16nm 2D NAND. The analysis is based on a bottoms-up process flow analysis for each 3D NAND technology and 16nm 2D NAND.

Some of the questions addressed in this report include:

- What are the main drivers of the process complexity for 2D NAND and 3D NAND?
- What is the tool commonality between 3D NAND and 2D NAND?
- What is the cost impact of moving the CMOS under the array in 3D NAND?
- How much does it cost to build a Greenfield 3D NAND fab and how does it compare to a 2D NAND fab? What is the equipment footprint required and the breakdown of the investment by process modules?
- What is the front end manufacturing cost of a 3D NAND wafer compared to a 2D NAND wafer?
- What is the investment required to convert an existing 2D NAND fab to 3D NAND? What is the impact on the fab cycle time and manufacturing capacity?
- What is the incremental investment required to transition a 32 layer 3D NAND fab to 64 layers? What is the impact on fab cycle time and manufacturing capacity?

Table Of Contents

Cost and Investment Implications of 3D NAND
Contents
List of Figures
List of Tables
Executive Summary
Introduction
The Path to 3D
NAND Flash Technology Evolution
3D NAND Flash Memory Cell
Implementation of Floating Gate Cells into 3D NAND Flash Arrays
Floating Gate Memory Cell Scaling Challenges
Charge Trapping Memory Cell Development and Remaining Reliability Issues
Optimization of Charge Trapping Memory Cell for the Application in 3D Arrays
2D and 3D NAND Process Flow
Technology Overview and Process Challenges
3D concepts
Overview
CMOS formation
Conventional CMOS Adjacent to Memory Array
CMOS Placement Below Memory Array
3D Memory Array Formation
Toshiba p-BiCS
Samsung TCAT
3D Floating Gate
BEOL for 3D Concepts
Fundamental Limitation in 3D NAND Fabrication
2D and 3D NAND Process Comparison
Process Complexity Comparison
Cost and Investment Implications of 3D NAND
Greenfield Fab
Fab Investment
Equipment Footprint
Wafer RPT and Cycle Time
Wafer Costs
Sensitivity Analysis
Converting from 2D NAND to 3D NAND
Wafer Capacity
Investment/De-investment
3D NAND Technology Migration
Wafer Capacity
Investment/De-investment
Wafer RPT and Cycle Time
Wafer Costs
Conclusion
References
About the Authors
About Forward Insights
Services
Contact

View This Report »

Get Industry Insights. Simply.

  • Latest reports & slideshows with insights from top research analysts
  • 24 Million searchable statistics with tables, figures & datasets
  • More than 10,000 trusted sources
24/7 Customer Support

Talk to Ahmad

+1 718 618 4302

Purchase Reports From Reputable Market Research Publishers
Gas Insulated Switchgear Market by Type, Sub-Type, End-User & Region - Global Forecast to 2021

Gas Insulated Switchgear Market by Type, Sub-Type, End-User & Region - Global Forecast to 2021

  • $ 7150
  • Industry report
  • January 2017
  • by MarketsandMarkets

“The gas insulated switchgear market is projected to grow at a CAGR of 9.4% from 2016 to 2021” The gas insulated switchgear market is expected to reach a market size of USD 25.95 billion by 2021, ...

Atomic Layer Deposition and other Ultrathin-Film Fabrication Processes

Atomic Layer Deposition and other Ultrathin-Film Fabrication Processes

  • $ 6650
  • Industry report
  • November 2016
  • by BCC Research

"The global market for atomic layer deposition and other ultrathin film fabrication processes was valued at $1.1 billion and $1.3 billion in 2014 and 2015, respectively. This market is expected to increase ...

Tools and Components for Photonic Applications

Tools and Components for Photonic Applications

  • $ 6650
  • Industry report
  • November 2016
  • by BCC Research

This photonic applications report by BCC Research analyzes the tools and components for photonic application and its market dynamics. Use this report to: - Analyze the various applications for tools and ...


ref:plp2014

Reportlinker.com © Copyright 2017. All rights reserved.

ReportLinker simplifies how Analysts and Decision Makers get industry data for their business.