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3-D TSV: Insight On Critical Issues And Market Analysis

  • March 2017
  • -
  • Information Network
  • -
  • 161 pages

Summary

Table of Contents

Through-Silicon Via (TSV) is a vertical electrical connection that passes completely through a silicon wafer or chip to create 3D ICs or packages. The drivers for market adoption of 3D ICs are increased performance, reduced form factor and cost reduction. TSV provides the high-bandwidth interconnection between stacked chips. The different TSV processes, which are more complex than initially anticipated, are analyzed.

This report analyzes the market for TSV ICs by units and wafers, and for equipment and materials used in their manufacture.

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