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Sub-100nm Lithography: Market Analysis and Strategic Issues

  • November 2016
  • -
  • Information Network
  • -
  • 110 pages

The continued improvements in lithography have been the driving force that has upheld Moore's Law. Shorter wavelengths, better lenses, and adaptive optics have all contributed to this success story, which has allowed commercial chips to be fabricated with 14nm feature sizes

This report examines and projects the technologies involved, their likely developments, what problems and choices are facing users, and where the opportunities and pitfalls are. The worldwide lithography markets are analyzed and projected by type (EUV, DUV, and optical), and market shares by vendor for each type

Table Of Contents

Sub-100nm Lithography: Market Analysis and Strategic Issues
TABLE OF CONTENTS

Chapter 1 Introduction 1-1

1.1 The Need For This Report 1-1

Chapter 2 Executive Summary 2-1

2.1 Summary of Major Issues 2-1
2.2 Summary of Market Opportunities 2-2

Chapter 3 Lithography Issues And Trends 3-1

3.1 Optical Systems 3-1
3.1.1 Introduction 3-1
3.1.2 Step-and-Repeat Aligners 3-8
3.1.3 Deep Ultraviolet (DUV) 3-11
3.2 EUV 3-18
3.5 Nano-Imprint Lithography 3-23
3.4 X-Ray Lithography 3-28
3.3 Electron Beam Lithography 3-34
3.4 Ion Beam Lithography 3-38

Chapter 4 User - Supplier Strategies 4-1

4.1 Determining Lithography Needs 4-1
4.2 Benchmarking a Vendor 4-3
4.2.1 Pricing 4-3
4.2.2 Vendor Commitment and Attitudes 4-5
4.2.3 Vendor Capabilities 4-7
4.2.4 System Capabilities 4-9
4.2.5 Vendor Feedback During Equipment Evaluation 4-9
4.2.6 Vendor Feedback During Device Production 4-11
4.3 Competitive Environment 4-12
4.4 Equipment For Class 1 Cleanrooms 4-15
4.5 Equipment For the Factory of the Future 4-18
4.6 Opportunities 4-19

Chapter 5 Market Forecast 5-1

5.1 Driving Forces 5-1
5.1.1 Technical Trends 5-4
5.1.2 Economic Trends 5-5
5.1.3 Optical Limitations 5-9
5.2 Market Forecast Assumptions 5-10
5.3 Market Forecast 5-11


LIST OF TABLES

3.1 Wavelength “Generations” 3-5
3.2 Characteristics of X-Ray Systems 3-29
5.1 Worldwide Capital Spending 5-6
5.2 DRAM Lithographic Requirements 5-8
5.3 Worldwide Optical Stepper Market 5-20
5.4 Worldwide Stepper Market Shares 5-23


LIST OF FIGURES

1.1 Lithographic Equipment Requirements for DRAMs 1-2
3.1 Lithography Options For MPUs/DRAMs 3-6
3.2 Lithography Options For Flash 3-7
3.3 Illustration of Stepper Exposure System 3-9
3.4 Lens Arrangement For Submicron Features 3-14
3.5 Excimer Laser Evolution 3-15
3.6 EUV Lithography 3-18
3.7 Thermoplastic Nanoimprint Lithography Process 3-23
3.8 Step And Flash Nanoimprint Lithography Process 3-25
3.9 Illustration of X-Ray Lithography 3-30
3.10 Schematic Of Scalpel Electron Beam System 3-34
3.11 Multi-Source E-Beam Lithography 3-36
3.12 Ion Projection Lithography System 3-39
4.1 Manufacturing Costs Per Exposure Station 4-2
5.1 Lithography Market Vs Equipment Market 5-13
5.2 Lithography Double Exposure Technique 5-15
5.3 Lithography Requirements 5-16
5.4 Lithography Extensions 5-17
5.5 Lithography Cost of Ownership 5-18
5.6 Segmentation of Stepper/Scan Shipments 5-21
5.7 Market Shares of Vendors (Units) 5-22
5.8 Unit Market Shares of Vendors 5-24
5.9 Worldwide I-Line Market Shares 5-25
5.10 Worldwide 248nm Market Shares 5-26
5.11 Worldwide 193nm Dry Market Shares 5-27
5.12 Worldwide 193nm Wet Market Shares 5-28
5.13 Market Shares of Vendors (Revenues) 5-30

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