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  4. > Plasma Etching: Market Analysis and Strategic Issues

Plasma Etching: Market Analysis and Strategic Issues

  • November 2016
  • -
  • Information Network
  • -
  • 142 pages

The future needs in plasma etching will be for ever tighter control of process variability, higher selectivity and less damage.

This report addresses the strategic issues impacting both the user and supplier of plasma etching equipment to the semiconductor industry. Markets for dry etching and stripping are analyzed and projected. Dry etching systems are further segmented by application. Market shares of vendors in each sector are presented

Table Of Contents

Plasma Etching: Market Analysis and Strategic Issues
TABLE OF CONTENTS

Chapter 1 Introduction 1-1

1.1 The Need For This Report 1-1

Chapter 2 Executive Summary 2-1

2.1 Summary of Technical Issues 2-1
2.2 Summary of User Issues 2-2
2.3 Summary of Supplier Issues 2-3
2.4 Summary of Market Forecasts 2-4

Chapter 3 Technical Issues and Trends 3-1

3.1 Introduction 3-1
3.2 Processing Issues 3-14
3.2.1 Chlorine Versus Fluorine Processes 3-19
3.2.2 Multilevel Structures 3-32
3.2.3 New Materials 3-42
3.2.4 GaAs Processing 3-50
3.3 Plasma Stripping 3-51
3.3.1 Photoresist Stripping 3-51
3.3.2 Low-K Removal 3-72
3.4 Safety Issues 3-73
3.4.1 System Design Considerations 3-73
3.4.2 Gas Handling 3-74
3.4.3 Reactor Cleaning 3-76

Chapter 4 Market Forecast 4-1

4.1 Influence of Technology Trends on the Equipment Market 4-1
4.2 Market Forecast Assumptions 4-5
4.3 Market Forecast 4-6

Chapter 5 Strategic Issues: Users 5-1

5.1 Evaluating User Needs 5-1
5.1.1 Device Architecture 5-1
5.1.2 Wafer Starts and Throughput Requirements 5-5
5.1.3 Wafer Size 5-6
5.2 Benchmarking a Vendor 5-7
5.2.1 Pricing 5-7
5.2.2 Vendor Commitment and Attitudes 5-9
5.2.3 Vendor Capabilities 5-10
5.2.4 System Capabilities 5-12
5.3 Cost Analysis 5-14
5.3.1 Equipment Price 5-14
5.3.2 Installation Costs 5-17
5.3.3 Maintenance Costs 5-18
5.3.4 Sustaining Costs 5-19
5.3.5 Hidden Costs 5-19
5.4 User - Supplier Synergy 5-20
5.4.1 Feedback During Equipment Evaluation 5-20
5.4.2 Feedback During Device Production 5-21

Chapter 6 Strategic Issues: Suppliers 6-1

6.1 Competition 6-1
6.2 Customer Interaction 6-3
6.2.1 Customer Support 6-3
6.2.2 Cleanroom Needs in the Applications Lab 6-6
6.3 Equipment Compatibility in Class 1 Cleanrooms 6-7
6.3.1 Footprint Versus Serviceability 6-7
6.3.2 Particulate Generation 6-7
6.3.3 Automation 6-17
6.3.4 300-mm Tools 6-20


FIGURES

3.1 Various Enhanced Designs (a) Helicon, (b) Multiple
ECR, (c) Helical Resonator 3-4
3.2 Schematic of Inductively Coupled Plasma Source 3-6
3.3 Schematic of the HRe Source 3-9
3.4 Schematic of the Dipole Magnet Source 3-10
3.5 Schematic of Chemical Downstream Etch 3-11
3.6 Silicon Trench Structure 3-21
3.7 fin/STI Etch Requirements 3-34
3.8 FinFET Gate Etch Requirements 3-36
3.9 Dual Damascene Dielectric Etch Approaches 3-38
4.1 Trends in Minimum Feature Size for Dynamic RAMS 4-4
4.2 Market Shares for Dry Etch Equipment 4-7
4.3 Market Shares for Strip Equipment 4-10
4.4 Distribution of Etch Sales by Type 4-14
4.5 Distribution of Etch Sales by Device 4-16
4.6 Geographical Distribution of Equipment Purchases 4-18
5.1 Typical First Year Single Wafer System Cost Analysis 5-16
6.1 Relationship Between Device Yield and Particles 6-9
6.2 Sources of Particles 6-12
6.3 Relationship Between Die Yield and Chip Size 6-16


TABLES

3.1 Silicon Wafer Usage 3-2
3.2 Plasma Source Comparison 3-12
3.3 Typical Process Specifications 3-18
4.1 Worldwide Dry Etch Market Shares 4-8
4.2 Worldwide Dry Strip Market Shares 4-11
4.3 Worldwide Market Forecast of Plasma Etching Systems 4-12
4.4 Distribution of Etch Sales by Device by Vendor 4-15
4.5 Number of Layers To Be Etched 4-19
5.1 Levels of Integration of Dynamic Rams 5-3
5.2 Interconnect Levels of Logic Devices 5-4
6.1 Etch Process Specifications 6-21

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