1. Market Research
  2. > Manufacturing
  3. > Electronics Manufacturing Market Trends
  4. > Plasma Etching: Market Analysis and Strategic Issues

Plasma Etching: Market Analysis and Strategic Issues

  • March 2017
  • -
  • Information Network
  • -
  • 142 pages

The future needs in plasma etching will be for ever tighter control of process variability, higher selectivity and less damage.

This report addresses the strategic issues impacting both the user and supplier of plasma etching equipment to the semiconductor industry. Markets for dry etching and stripping are analyzed and projected. Dry etching systems are further segmented by application. Market shares of vendors in each sector are presented

Table Of Contents

Plasma Etching: Market Analysis and Strategic Issues
TABLE OF CONTENTS

Chapter 1 Introduction 1-1

1.1 The Need For This Report 1-1

Chapter 2 Executive Summary 2-1

2.1 Summary of Technical Issues 2-1
2.2 Summary of User Issues 2-2
2.3 Summary of Supplier Issues 2-3
2.4 Summary of Market Forecasts 2-4

Chapter 3 Technical Issues and Trends 3-1

3.1 Introduction 3-1
3.2 Processing Issues 3-14
3.2.1 Chlorine Versus Fluorine Processes 3-19
3.2.2 Multilevel Structures 3-32
3.2.3 New Materials 3-42
3.2.4 GaAs Processing 3-50
3.3 Plasma Stripping 3-51
3.3.1 Photoresist Stripping 3-51
3.3.2 Low-K Removal 3-72
3.4 Safety Issues 3-73
3.4.1 System Design Considerations 3-73
3.4.2 Gas Handling 3-74
3.4.3 Reactor Cleaning 3-76

Chapter 4 Market Forecast 4-1

4.1 Influence of Technology Trends on the Equipment Market 4-1
4.2 Market Forecast Assumptions 4-5
4.3 Market Forecast 4-6

Chapter 5 Strategic Issues: Users 5-1

5.1 Evaluating User Needs 5-1
5.1.1 Device Architecture 5-1
5.1.2 Wafer Starts and Throughput Requirements 5-5
5.1.3 Wafer Size 5-6
5.2 Benchmarking a Vendor 5-7
5.2.1 Pricing 5-7
5.2.2 Vendor Commitment and Attitudes 5-9
5.2.3 Vendor Capabilities 5-10
5.2.4 System Capabilities 5-12
5.3 Cost Analysis 5-14
5.3.1 Equipment Price 5-14
5.3.2 Installation Costs 5-17
5.3.3 Maintenance Costs 5-18
5.3.4 Sustaining Costs 5-19
5.3.5 Hidden Costs 5-19
5.4 User - Supplier Synergy 5-20
5.4.1 Feedback During Equipment Evaluation 5-20
5.4.2 Feedback During Device Production 5-21

Chapter 6 Strategic Issues: Suppliers 6-1

6.1 Competition 6-1
6.2 Customer Interaction 6-3
6.2.1 Customer Support 6-3
6.2.2 Cleanroom Needs in the Applications Lab 6-6
6.3 Equipment Compatibility in Class 1 Cleanrooms 6-7
6.3.1 Footprint Versus Serviceability 6-7
6.3.2 Particulate Generation 6-7
6.3.3 Automation 6-17
6.3.4 300-mm Tools 6-20


FIGURES

3.1 Various Enhanced Designs (a) Helicon, (b) Multiple
ECR, (c) Helical Resonator 3-4
3.2 Schematic of Inductively Coupled Plasma Source 3-6
3.3 Schematic of the HRe Source 3-9
3.4 Schematic of the Dipole Magnet Source 3-10
3.5 Schematic of Chemical Downstream Etch 3-11
3.6 Silicon Trench Structure 3-21
3.7 fin/STI Etch Requirements 3-34
3.8 FinFET Gate Etch Requirements 3-36
3.9 Dual Damascene Dielectric Etch Approaches 3-38
4.1 Trends in Minimum Feature Size for Dynamic RAMS 4-4
4.2 Market Shares for Dry Etch Equipment 4-7
4.3 Market Shares for Strip Equipment 4-10
4.4 Distribution of Etch Sales by Type 4-14
4.5 Distribution of Etch Sales by Device 4-16
4.6 Geographical Distribution of Equipment Purchases 4-18
5.1 Typical First Year Single Wafer System Cost Analysis 5-16
6.1 Relationship Between Device Yield and Particles 6-9
6.2 Sources of Particles 6-12
6.3 Relationship Between Die Yield and Chip Size 6-16


TABLES

3.1 Silicon Wafer Usage 3-2
3.2 Plasma Source Comparison 3-12
3.3 Typical Process Specifications 3-18
4.1 Worldwide Dry Etch Market Shares 4-8
4.2 Worldwide Dry Strip Market Shares 4-11
4.3 Worldwide Market Forecast of Plasma Etching Systems 4-12
4.4 Distribution of Etch Sales by Device by Vendor 4-15
4.5 Number of Layers To Be Etched 4-19
5.1 Levels of Integration of Dynamic Rams 5-3
5.2 Interconnect Levels of Logic Devices 5-4
6.1 Etch Process Specifications 6-21

View This Report »

Get Industry Insights. Simply.

  • Latest reports & slideshows with insights from top research analysts
  • 24 Million searchable statistics with tables, figures & datasets
  • More than 10,000 trusted sources
24/7 Customer Support

Talk to Ahmad

+1 718 618 4302

Purchase Reports From Reputable Market Research Publishers
Gas Insulated Switchgear Market by Type, Sub-Type, End-User & Region - Global Forecast to 2021

Gas Insulated Switchgear Market by Type, Sub-Type, End-User & Region - Global Forecast to 2021

  • $ 7150
  • Industry report
  • January 2017
  • by MarketsandMarkets

“The gas insulated switchgear market is projected to grow at a CAGR of 9.4% from 2016 to 2021” The gas insulated switchgear market is expected to reach a market size of USD 25.95 billion by 2021, ...

Atomic Layer Deposition and other Ultrathin-Film Fabrication Processes

Atomic Layer Deposition and other Ultrathin-Film Fabrication Processes

  • $ 6650
  • Industry report
  • November 2016
  • by BCC Research

"The global market for atomic layer deposition and other ultrathin film fabrication processes was valued at $1.1 billion and $1.3 billion in 2014 and 2015, respectively. This market is expected to increase ...

Superconductors: Technologies and Global Markets

Superconductors: Technologies and Global Markets

  • $ 6650
  • Industry report
  • January 2017
  • by BCC Research

Use this report to: - Analyze the developing market for superconducting applications, materials and other enabling technologies. - Assess expected technological and market trends in the longer term. - ...


ref:plp2017

Reportlinker.com © Copyright 2017. All rights reserved.

ReportLinker simplifies how Analysts and Decision Makers get industry data for their business.