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Design Analysis Ericsson DUS31 01 FDD/TDD LTE + GSM Baseband Unit

  • August 2014
  • -
  • EJL Wireless Research LLC
  • -
  • 45 pages

This report covers the design analysis of a Ericsson DUS31 01 FDD/TDD LTE + GSM. This unit is part of the RBS6000 system. The unit was manufactured between Q1 of 2013.

Key Findings:

Advanced ASICs for high capacity LTE user support and throughput

Advanced power management for ASICs and FPGAs

Component and semiconductor suppliers mentioned in this report include: Analog Devices, Broadcom, Fairchild Semiconductor, Integrated Device Technology, Maxim Integrated Products, NXP Semiconductors, ON Semiconductor, Samsung Semiconductor, STMicroelectronics, Texas Instruments, and Vishay Semiconductors.

Features
Complete Part Number/Marking
Component Manufacturer Identification
Function Component Description
Package Type
Total Pages: 46
Total Tables: 9
Total Exhibits: 36

Important Note: There is NO component pricing contained within the report.

Table Of Contents

Design Analysis Ericsson DUS31 01 FDD/TDD LTE + GSM Baseband Unit
TABLE OF CONTENTS
EXECUTIVE SUMMARY ..5
Active/Passive Component Summary . 5
Important Note: .. 5
CHAPTER 1: ERICSSON RBS6000 BTS SYSTEM 6
Overview of RBS6101/6102/6201/6202/6301/6601 Product Offering 6
CHAPTER 2: DUS MECHANICAL ANALYSIS 10
Mechanical Analysis10
CHAPTER 3: BASEBAND PROCESSING/CPRI/INTERFACE BOARD SUBSYSTEM .. 21
APPENDIX A - PASSIVE CASE SIZE ANALYSIS 38
APPENDIX B - ACTIVE COMPONENT MARKET SHARE ANALYSIS . 42

TABLES
Table 1: Area C Bill of Materials .. 28
Table 2: DUS PCB Top Area A Bill of Materials 31
Table 3: DUS PCB Top Area A1 Bill of Materials.. 32
Table 4: DUS PCB Top Area A2 Bill of Materials.. 34
Table 5: DUS PCB Bottom Area B Bill of Materials . 36
Table 6: Passive Component Case Size Distribution by System Subsection 39
Table 7: Identified Passive Component Supplier Distribution by System Subsection 40
Table 8: Active/Passive Component Distribution by System Subsection.. 41
Table 9: Active Semiconductor/Component Vendor Distribution by System Subsection . 43

EXHIBITS
Exhibit 1: Ericsson RBS620x Macro Cell Indoor BTS System.7
Exhibit 2: Ericsson RBS6601 Macro Cell Main/Remote BTS System.7
Exhibit 3: Ericsson DUS System Block Diagram.9
Exhibit 4: DUS Unit, Front. 10
Exhibit 5: DUS Unit, Back . 11
Exhibit 6: DUS Unit, Left Side.. 11
Exhibit 7: DUS Unit, Top 12
Exhibit 8: DUS Unit, Bottom. 13
Exhibit 9: DUS Faceplate, Top View 14
Exhibit 10: DUS Faceplate, Bottom View.. 14
Exhibit 11: DUS Faceplate, Internal View . 14
Exhibit 12: DUS Top Shield, External View .. 15
Exhibit 13: DUS Top Shield, Internal View 16
Exhibit 14: DUS Bottom Shield, External View 17
Exhibit 15: DUS Bottom Shield, Internal View. 18
Exhibit 16: DUS Bottom Shield, Front View . 19
Exhibit 17: DUS 31 01 System, Exploded Side View . 19
Exhibit 18: DUS with Top Shield Removed .. 20
Exhibit 19: DUS Semiconductor IC Heat Sink Types, Top View.. 21
Exhibit 20: DUS Semiconductor IC Heat Sink Types, Bottom View 22
Exhibit 21: DUS PCB, Top View w/Heat Sinks . 22
Exhibit 22: DUS PCB Top, Area A 24
Exhibit 23: DUS PCB Top, Area A1 and A2 25
Exhibit 24: DUS PCB Bottom, Area B . 26
Exhibit 25: DUS PCB Top Area A Component Diagram . 27
Exhibit 26: Area C SSD Daughter Card Component Diagram, Top (L) and Bottom (R) 28
Exhibit 27: DUS PCB Top Area A1 Component Diagram 29
Exhibit 28: DUS PCB Top Area A2 Component Diagram 29
Exhibit 29: DUS Baseband Processing/CPRI/Interface Block Diagram.. 30
Exhibit 30: DUS PCB Bottom Area B Component Diagram .. 35
Exhibit 31: Passive Component Case Size Distribution . 38
Exhibit 32: Identified Passive Component Market Share by Vendor . 41
Exhibit 33: Active Semiconductor Component Share. 42
Exhibit 34: High Pin Count IC vs. Discretes . 44
Exhibit 35: Active Semiconductor Market Share by Vendor. 44
Exhibit 36: High Pin Count (64+) Active Semiconductor Market Share by Vendor 45

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