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Design Analysis Huawei Technologies FDD LTE Baseband Unit (BBU)

  • July 2014
  • -
  • EJL Wireless Research LLC
  • -
  • 68 pages

This report covers the design analysis of a Huawei Technologies FDD LTE. This unit is part of the DBS3900 system. The unit was manufactured between Q3-Q4 of 2011.

Key Findings:

Modular chassis allows for single mode and multi-mode operation

LBBPc card allows for capacity up to 2T2R 3 x 20MHz or 4T4R 3 x 10MHz

Component and semiconductor suppliers mentioned in this report include: Analog Devices, Fairchild Semiconductor, HiSilicon Technologies, Integrated Device Technology, Maxim Integrated Products, Micrel, NXP Semiconductors, ON Semiconductor, STMicroelectronics, Texas Instruments, and Vishay Semiconductors.

Features
Complete Part Number/Marking
Component Manufacturer Identification
Function Component Description
Package Type
Total Pages: 68
Total Tables: 23
Total Exhibits: 68

Important Note: There is NO component pricing contained within the report.

Table Of Contents

Design Analysis Huawei Technologies FDD LTE Baseband Unit (BBU)
TABLE OF CONTENTS
EXECUTIVE SUMMARY ..6
Active/Passive Component Summary . 6
Important Note: .. 6
CHAPTER 1: HUAWEI TECHNOLOGIES DBS3900 BTS SYSTEM..7
Overview of DBS3900 Product Offering . 7
CHAPTER 2: BSBC MECHANICAL ANALYSIS . 11
Mechanical Analysis11
BSBC Backplane PCB.15
CHAPTER 3: FAN UNIT (UBFA) 18
CHAPTER 4: UPEUC . 24
CHAPTER 5: LTE CONFIGURATION 33
CHAPTER 6: LMPT 34
CHAPTER 7: LBBP 53
APPENDIX A - PASSIVE CASE SIZE ANALYSIS 61
APPENDIX B - ACTIVE COMPONENT MARKET SHARE ANALYSIS . 65

TABLES
Table 1: BSBC PCB Bill of Materials, Top .. 17
Table 2: BSBC PCB Bill of Materials, Bottom 17
Table 3: Fan Unit Bill of Materials 20
Table 4: Fan Unit PCB, Top Bill of Materials . 23
Table 5: Fan Unit PCB, Bottom Bill of Materials .. 23
Table 6: UPEU Ethernet PCB Bill of Materials .. 27
Table 7: UPEU Main PCB Area A Bill of Materials. 31
Table 8: UPEU Main PCB Area B Bill of Materials. 32
Table 9: LMPT Top View Bill of Materials .. 43
Table 10: LMPT Top View Area A Bill of Materials .. 47
Table 11: LMPT Top View Area B Bill of Materials .. 48
Table 12: LMPT Bottom View Area B Bill of Materials 49
Table 13: LMPT Top View Area C Bill of Materials .. 50
Table 14: LMPT Bottom View Area C Bill of Materials 50
Table 15: LMPT Bottom View Bill of Materials.. 51
Table 16: LBBP Variant Specifications 53
Table 17: LBBP Variant Maximum Data Rate Support .. 54
Table 18: LBBP Top View Bill of Materials . 58
Table 19: LBBP Bottom View Bill of Materials .. 60
Table 20: Passive Component Case Size Distribution by System Subsection . 62
Table 21: Identified Passive Component Supplier Distribution by System Subsection. 63
Table 22: Active/Passive Component Distribution by System Subsection 64
Table 23: Active Semiconductor/Component Vendor Distribution by System Subsection .. 66

EXHIBITS
Exhibit 1: BTS3900 DBS3900 ..7
Exhibit 2: BBU3900 BSBC Unit8
Exhibit 3: BBU3900 Logical Structure for LTE Configuration..8
Exhibit 4: DBS3900 Configurations (Star/Cascade) .9
Exhibit 5: BSBC Configuration for LTE..9
Exhibit 6: BBU3900 Basic Configuration for LTE with cards9
Exhibit 7: BBU3900 Typical 3x20MHz 2T2R Configuration for LTE with cards 10
Exhibit 8: BSBC Chassis, Front View.. 11
Exhibit 9: BSBC Chassis, Top View . 12
Exhibit 10: BSBC Chassis, Bottom View 12
Exhibit 11: BSBC Chassis, Left View .. 13
Exhibit 12: BSBC Chassis, Right View 13
Exhibit 13 : BSBC Chassis, Back View 14
Exhibit 14: BSBC Chassis, Back View with Back plate Cover Removed 14
Exhibit 15: Backplane Connector PCB, Top View 15
Exhibit 16: Backplane Connector PCB, Bottom View . 15
Exhibit 17: Backplane Connector Component Diagram, Top View . 16
Exhibit 18: Fan Unit Panel Identification 18
Exhibit 19: Fan Unit, Top View. 18
Exhibit 20: Fan Unit, Bottom View.. 19
Exhibit 21: Fan Unit, Right Side View. 19
Exhibit 22: Fan Unit, Left Side View 19
Exhibit 23: Fan Unit Component Diagram. 20
Exhibit 24: Fan Unit Cable Diagram 20
Exhibit 25: Fan Unit PCB, Top View, Component Diagram .. 21
Exhibit 26: Fan Unit PCB, Bottom View. Component Diagram 22
Exhibit 27: UPEU Panel Identification. 24
Exhibit 28: UPEUc, Top View 25
Exhibit 29: UPEUc, Bottom View . 25
Exhibit 30: UPEUc, Side View .. 25
Exhibit 31: UPEU Ethernet PCB, Top View 26
Exhibit 32: UPEU Ethernet PCB, Bottom View, Component Diagram. 26
Exhibit 33: UPEU Main PCB with Heatsink (Top) and without (Bottom) 28
Exhibit 34: UPEU Main PCB, Top View 29
Exhibit 35: UPEU Main PCB, Bottom View. 29
Exhibit 36: UPEU Main PCB Area A Component Diagram . 30
Exhibit 37: UPEU Main PCB Area B Component Diagram . 30
Exhibit 38: BBU3900 Basic Configuration (3x20MHz 2T2R) for LTE with LBBPc card 33
Exhibit 39: BBU3900 Basic Configuration (3x20MHz 2T2R) for LTE with LBBPb cards. 33
Exhibit 40: LMPT Panel Identification . 34
Exhibit 41: Working Principle of the LMPT Unit 34
Exhibit 42: LMPT Board, Top View .. 35
Exhibit 43: LMPTb System Block Diagram 36
Exhibit 44: LMPT Board Top View Analysis Map.. 37
Exhibit 45: LMPT Board Top View Component Diagram 37
Exhibit 46: LMPT Board Top View Area A Component Diagram.. 38
Exhibit 47: Area B GPS Processing Daughter Card, Top View Component Diagram . 38
Exhibit 48: Area B GPS Processing Daughter Card, Bottom View Component Diagram .. 39
Exhibit 49: External GPS Cable 39
Exhibit 50: Internal GPS Cable. 40
Exhibit 51: LMPT Area C Daughter Card Top View Component Diagram . 40
Exhibit 52: LMPT Area C Daughter Card Bottom View Component Diagram .. 41
Exhibit 53: LMPT Board Bottom View Component Diagram. 42
Exhibit 54: LMPT Faceplate .. 42
Exhibit 55: LBBPb Panel Identification .. 54
Exhibit 56: LBBPc Panel Identification 54
Exhibit 57: LBBPd Panel Identification .. 54
Exhibit 58: LBBPc System Block Diagram. 55
Exhibit 59: LBBP Board, Top View .. 56
Exhibit 60: LBBP Top View Component Diagram 56
Exhibit 61: LBBP Bottom View Component Diagram . 57
Exhibit 62: LBBP Faceplate 57
Exhibit 63: Passive Component Case Size Distribution . 61
Exhibit 64: Identified Passive Component Market Share by Vendor . 64
Exhibit 65: Active Semiconductor Component Share. 65
Exhibit 66: High Pin Count IC vs. Discretes . 67
Exhibit 67: Active Semiconductor Market Share by Vendor. 67
Exhibit 68: High Pin Count (64+) Active Semiconductor Market Share by Vendor 68

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