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Design Analysis Huawei Technologies W-CDMA Baseband Unit (BBU)

  • July 2014
  • -
  • EJL Wireless Research LLC
  • -
  • 63 pages

This report covers the design analysis of a Huawei Technologies W-CDMA. This unit is part of the DBS3900 system. The unit was manufactured between Q3-Q4 of 2011.

Key Findings:

Modular chassis allows for single mode and multi-mode operation

WBBPd1 card allows for capacity of 192 DL UEs and 128 HSDPA UEs

Component and semiconductor suppliers mentioned in this report include: Analog Devices, Fairchild Semiconductor, HiSilicon Technologies, Integrated Device Technology, Linear Technology, Maxim Integrated Products, Micrel, NXP Semiconductors, ON Semiconductor, STMicroelectronics, Texas Instruments, and Vishay Semiconductors.

Features
Complete Part Number/Marking
Component Manufacturer Identification
Function Component Description
Package Type
Total Pages: 64
Total Tables: 18
Total Exhibits: 62

Important Note: There is NO component pricing contained within the report.

Table Of Contents

Design Analysis Huawei Technologies W-CDMA Baseband Unit (BBU)
TABLE OF CONTENTS
EXECUTIVE SUMMARY ..6
Active/Passive Component Summary . 6
Important Note: .. 6
CHAPTER 1: HUAWEI TECHNOLOGIES DBS3900 BTS SYSTEM..7
Overview of DBS3900 Product Offering . 7
CHAPTER 2: BSBC MECHANICAL ANALYSIS . 11
Mechanical Analysis11
BSBC Backplane PCB.15
CHAPTER 3: FAN UNIT (UBFA) 18
CHAPTER 4: UPEUC . 24
CHAPTER 5: W-CDMA/HSPA CONFIGURATION .. 33
CHAPTER 6: WMPT UNIT . 34
CHAPTER 7: WBBP UNIT . 47
APPENDIX A - PASSIVE CASE SIZE ANALYSIS 56
APPENDIX B - ACTIVE COMPONENT MARKET SHARE ANALYSIS . 60

TABLES
Table 1: BSBC PCB Bill of Materials, Top .. 17
Table 2: BSBC PCB Bill of Materials, Bottom 17
Table 3: Fan Unit Bill of Materials 20
Table 4: Fan Unit PCB, Top Bill of Materials . 23
Table 5: Fan Unit PCB, Bottom Bill of Materials .. 23
Table 6: UPEU Ethernet PCB Bill of Materials .. 27
Table 7: UPEU Main PCB Area A Bill of Materials. 31
Table 8: UPEU Main PCB Area B Bill of Materials. 32
Table 9: WMPT Board Top View Bill of Materials . 41
Table 10: WMPT Board Top View Area A Bill of Materials . 44
Table 11: WMPT Board Bottom View Bill of Materials 45
Table 12: WBBP Variant Specifications.. 47
Table 13: WBBPd1 Top View Bill of Materials .. 53
Table 14: WBBPd1 Bottom View Bill of Materials 55
Table 15: Passive Component Case Size Distribution by System Subsection . 57
Table 16: Identified Passive Component Supplier Distribution by System Subsection. 58
Table 17: Active/Passive Component Distribution by System Subsection 59
Table 18: Active Semiconductor/Component Vendor Distribution by System Subsection .. 61

EXHIBITS
Exhibit 1: BTS3900 DBS3900 ..7
Exhibit 2: BBU3900 BSBC Unit8
Exhibit 3: DBS3900 Configurations (Star/Cascade) .8
Exhibit 4: BSBC Configuration for W-CDMA 9
Exhibit 5: BBU3900 Basic Configuration for WCDMA with cards9
Exhibit 6: BBU3900 Full Configuration for WCDMA with cards ..9
Exhibit 7: BSBC Chassis, Front View.. 11
Exhibit 8: BSBC Chassis, Top View . 12
Exhibit 9: BSBC Chassis, Bottom View.. 12
Exhibit 10: BSBC Chassis, Left View .. 13
Exhibit 11: BSBC Chassis, Right View 13
Exhibit 12 : BSBC Chassis, Back View 14
Exhibit 13: BSBC Chassis, Back View with Back plate Cover Removed 14
Exhibit 14: Backplane Connector PCB, Top View 15
Exhibit 15: Backplane Connector PCB, Bottom View . 15
Exhibit 16: Backplane Connector Component Diagram, Top View . 16
Exhibit 17: Fan Unit Panel Identification 18
Exhibit 18: Fan Unit, Top View. 18
Exhibit 19: Fan Unit, Bottom View.. 19
Exhibit 20: Fan Unit, Right Side View. 19
Exhibit 21: Fan Unit, Left Side View 19
Exhibit 22: Fan Unit Component Diagram. 20
Exhibit 23: Fan Unit Cable Diagram 20
Exhibit 24: Fan Unit PCB, Top View, Component Diagram .. 21
Exhibit 25: Fan Unit PCB, Bottom View. Component Diagram 22
Exhibit 26: UPEU Panel Identification. 24
Exhibit 27: UPEUc, Top View 25
Exhibit 28: UPEUc, Bottom View . 25
Exhibit 29: UPEUc, Side View .. 25
Exhibit 30: UPEU Ethernet PCB, Top View 26
Exhibit 31: UPEU Ethernet PCB, Bottom View, Component Diagram. 26
Exhibit 32: UPEU Main PCB with Heatsink (Top) and without (Bottom) 28
Exhibit 33: UPEU Main PCB, Top View 29
Exhibit 34: UPEU Main PCB, Bottom View. 29
Exhibit 35: UPEU Main PCB Area A Component Diagram . 30
Exhibit 36: UPEU Main PCB Area B Component Diagram . 30
Exhibit 37: BBU3900 Basic Configuration for WCDMA with cards .. 33
Exhibit 38: WMPT Panel Identification 34
Exhibit 39: WMPT System Block Diagram. 35
Exhibit 40: WMPT Board, Top View. 36
Exhibit 41: WMPT Board, Bottom View.. 37
Exhibit 42: WMPT Board, Top View without Heat Sinks and Front Panel . 37
Exhibit 43: WMPT Board Top View Component Diagram.. 38
Exhibit 44: External GPS Cable 39
Exhibit 45: WBBPd1 Faceplate . 39
Exhibit 46: WMPT Board Top View Area A Component Diagram. 40
Exhibit 47: WMPT Board Bottom View Component Diagram 40
Exhibit 48: WBBPa Panel Identification . 47
Exhibit 49: WBBPb Panel Identification . 47
Exhibit 50: WBBPd Panel Identification . 48
Exhibit 51: WBBPf Panel Identification .. 48
Exhibit 52: WBBPd1 System Block Diagram. 49
Exhibit 53: WBBP Board, Top View . 50
Exhibit 54: WBBP Board Top View Component Diagram without Heat sinks .. 51
Exhibit 55: WBBP Board Bottom View Component Diagram 52
Exhibit 56: WBBPd1 Faceplate . 52
Exhibit 57: Passive Component Case Size Distribution . 56
Exhibit 58: Identified Passive Component Market Share by Vendor . 59
Exhibit 59: Active Semiconductor Component Share. 60
Exhibit 60: High Pin Count IC vs. Discretes . 62
Exhibit 61: Active Semiconductor Market Share by Vendor. 62
Exhibit 62: High Pin Count (64+) Active Semiconductor Market Share by Vendor 63

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