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Design Analysis Huawei Technologies W-CDMA Baseband Unit (BBU)

  • July 2014
  • -
  • EJL Wireless Research LLC
  • -
  • 63 pages

Summary

Table of Contents

This report covers the design analysis of a Huawei Technologies W-CDMA. This unit is part of the DBS3900 system. The unit was manufactured between Q3-Q4 of 2011.

Key Findings:

Modular chassis allows for single mode and multi-mode operation

WBBPd1 card allows for capacity of 192 DL UEs and 128 HSDPA UEs

Component and semiconductor suppliers mentioned in this report include: Analog Devices, Fairchild Semiconductor, HiSilicon Technologies, Integrated Device Technology, Linear Technology, Maxim Integrated Products, Micrel, NXP Semiconductors, ON Semiconductor, STMicroelectronics, Texas Instruments, and Vishay Semiconductors.

Features
Complete Part Number/Marking
Component Manufacturer Identification
Function Component Description
Package Type
Total Pages: 64
Total Tables: 18
Total Exhibits: 62

Important Note: There is NO component pricing contained within the report.

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