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This report reflects the progress in the development of short-range radio (with maximum transmission distance of 30-100 feet) and ultra-short-range communications devices (with maximum transmission distance of - 5-10 centimeters). The report updates and revises Practel reports issued in 2008-2012.

In particular, the following technologies and related markets were addressed:

Bluetooth (BT)
Near Field Communications
The report emphasizes one of the important technological trends: advanced manufacturing methods and microminiaturization allow the creation of multimodal devices. Such devices implement several technologies on one chipset, which effectively integrates common elements serving different radios. The report also shows the role of ultra-short-range communications: used as an independent technique or together with short-range radios.

The report contains a detailed survey of WPAN/WLAN equipment vendors specializing in the production of the discussed communications equipment.

Table Of Contents

Progress in Short-range Wireless Communications Developments: Marketing and Technological Trends
1.0. Introduction

1.0. Introduction

1.1. General
1.2. NFC Specifics
1.3. TransferJet
1.4. Short-range Radio Specifics
1.5. Report Structure
1.6. Methodology
1.7. Intended Audience
2.0. Short-reach Radio: Technologies and Markets

2.1. Ultra Wideband
2.1.1. Downturn
2.1.2. General: History
2.1.3. Benefits
2.1.4. Definition
2.1.5. Rates
2.1.6. Spectrum Allocation
2.1.7. Regulations
2.1.8. Major Features
2.1.9. Standards Multiband OFDM DS-UWB Groups ECMA PHY WiNET EC-ETSI IEEE 802.15.4a - 2007 IEEE 802.15.4f
2.1.10. Major Applications Example: Characteristics and Requirements: WSN-UWB
2.1.11. Market Estimate General Geographical Segmentation Forecast
2.1.12. Industry
Alereon (chipsets)
Camero (radar, equipment for first responders)
Gefen (HDMI Extender)
General Atomics (Chipsets)
Multispectral (Zebra)-Sensors
Pulse~ Link (Chipsets)
RealTek (IC)
Samsung (WUSB)
Sensiotec (Sensor/Radar Health Care)
Time Domain (Chipsets-fusion of communications and radar)
TiaLinx (Sensor)
Ubisense (RFID-tracking)
Veebeam (Device)
Wisair (WUSB-chipsets)
2.2. Z-Wave
2.2.1. General
2.2.2. Z-Wave Alliance
2.2.3. Benefits
2.2.4. Details General Characteristics ITU G.9959 (2/2012)
2.2.5. ZigBee and Z-Wave
2.2.6. Advanced Energy Control Framework Z-wave and Smart Metering
2.2.7. Summary
2.2.8. Selected Vendors
Aeon Labs (Aeotec)
Mi Casa Verde
Sigma Designs
2.2.9. Pricing
2.2.10. Market Estimate: Z-wave Products for HAN Model Results
2.3. ZigBee
2.3.1. General
2.3.2. Details Major Features
2.3.3. Device Types
2.3.4. Protocol Stack Physical and MAC layers - IEEE802.15.4 Frame Upper Layers
2.3.5. Interoperability
2.3.6. Security
2.3.7. Platform Considerations
2.3.8. Battery Life
2.3.9. ZigBee Technology Benefits and Limitations
2.3.10. Standardization Process ZigBee Alliance Objectives Smart Energy Profile-ICT for Smart Grid Further Developments Features-Energy Service Portal ZigBee IP
2.3.11. 802.15.4 - ZigBee Basis IEEE 802.15.4 Radio - Details
2.3.12. Application Specifics - Profiles Applications - General Home PC Manufacturing WSN-UGS and ZigBee “Green” ZigBee
2.3.13. Market Expectations Segments Forecast
2.3.14. Industry
Amber (RF Modules)
Atmel (Chipsets)
CEL (Modules)
Chipcon - TI (Chipsets)
Cirronet-RFM (Modules-Industrial Applications)
Digi (Radios, Routers, Energy Management)
Ember - Silicon Labs (Chipsets)
EnergyHub (Smart Home)
GreenPeak (WSN)
Helicomm (Modules)
Jennic - NXP (Chipsets-Modules)
Freescale (Chipsets)
Libelium (Router)
Nuri Telecom (AMR Application)
Renesas Electronics (Platforms, AMR)
Silicon Laboratories (Chipsets, Modules)
Synapse (Modules, Protocols)
Telegesis (Integrator, Modules)
TI (Chipsets)
2.4. IEEE 802.15.1 (Bluetooth-BT)
2.4.1. BT Protocol Stack Transport layer Radio Layer Baseband and Link Manager Layers Middleware Layer
2.4.2. Profiles Power Consumption - ULP Medical Profile
2.4.3. Bluetooth Security
2.4.4. Highlights The Standard: The Technology:
2.4.5. Evolution BT v2.1 BT v3.0 BT v4.0 and Up
2.4.6. Market Estimate
2.4.7. BT Industry-HDP
Cambridge Consultants
Laird Technologies
Nordic Semiconductor
2.5. IEEE 802.11n WLAN
2.5.1. Major Enhancements General MIMO “True MIMO” BeamFlex Atheros Spatial Division Multiplexing OFDM Channel Bonding Packet Aggregation
2.5.2. Features Specifics Channel Bandwidth
2.5.3. Adaptation
2.5.4. Benefits and Applications Benefits Applications
2.5.5. Market General Drivers Market Forecast Model Assumptions Forecast Chipsets
2.5.6. Industry
Aerohive (AP)
Aruba (AP)
Buffalo (Router, AP)
Belkin (Router, Adaptor)
Broadcom (Chipsets; combo)
Cisco (AP)
CSR (Chips)
D-Link (Router, Adapter)
Encore (Adapter, router)
Edimax (Router, Adapter)
Extreme (AP)
Extricom (AP)
Gemtek (Router)
Intel (Chipsets)
Marvell (Chipsets)
Meru (Family of Products)
Motorola (Tools, AP)
NEC (Router)
Netgear (Router, AP)
Qualcomm Atheros
RedPine (Chipsets)
Ruckus (AP)
Ralink (Chipsets)
Siemens (AP)
TrendNet (Routers, AP)
ZyXel (AP, Router, Adapter)
3.0. Ultra-short Reach Wireless Communications

3.1. Near Field Communications
3.1.1. General
3.1.2. Characteristics
3.1.3. Standardization General ECMA -340 ISO NFC Forum General Specifications Summary
3.1.4. Single Wire Protocol
3.1.5. Host Controller Interface
3.1.6. Security
3.1.7. Comparison Bluetooth RFID
3.1.8. Applications General Primary Users Mobile Phone - Major Application Example Danger WPAN Applications Smart Poster NFC and Wi-Fi NFC and UWB
3.1.9. Trials
3.1.10. NFC Market General Market Drivers Estimate
3.1.11. Industry
Arygon (Identive Technologies)
Inside Secure
Motorola Solutions
Qualcomm Atheros
Toppan Forms
UPM Raflatac
3.1.12. Major Developmental Trends
3.2. TransferJet
3.2.1. General
3.2.2. Basis Goal and Development
3.2.3. Technology
3.2.4. Major Features
3.2.5. ECMA/ISO
3.2.7. Applications and Industry
3.2.8. Industry
4.0. Conclusions

Attachment I: NFC Tags Types

List of Figures:

Figure 1: Illustration - UWB Spectrum
Figure 2: Global Regulations
Figure 3: DS-UWB Spectrum Characteristics
Figure 4: Spectrum Regulations-UWB
Figure 5: ECMA - Architectural Reference Model
Figure 6: TAM: Global UWB IC Revenue ($B)
Figure 7: TAM: Global UWB IC (Unit Bil)
Figure 8: TAM: U.S. Small SH Z - Wave IC ($US Mil)
Figure 9: TAM: U.S. Large SH Z - Wave IC ($US Mil)
Figure 10: ZigBee Protocol Stack
Figure 11: Profiles
Figure 12: TAM: U.S. ZigBee Modules Sales ($B)
Figure 13: TAM: U.S. ZigBee Modules Sales (Mil. Units)
Figure 14: ZigBee Market Segmentation (2010)
Figure 15: ZigBee Market Segmentation (2014) - Projection
Figure 16: Bluetooth Protocol Stack
Figure 17: Piconets Illustration
Figure 18: BT ULP Layers
Figure 19: TAM: BT Modules Shipped (Bil. Units)
Figure 20: TAM: BT Modules Shipped ($B)
Figure 21: BT Market Geographical Segmentation
Figure 22: Two-antenna MIMO system with two-stream SDM example
Figure 23: 802.11 Protocol Family MAC Frame Structure
Figure 24: TAM: Worldwide Legacy Wi-Fi Chipsets Sales (Unit Bil)
Figure 25: TAM: 802.11n Chipsets Worldwide Sales (Unit Bil)
Figure 26: TAM: Wi-Fi Chipsets Worldwide Sales ($B)
Figure 27: Market Geography: IEEE 802.11n
Figure 28: Standardization
Figure 29: NFC ECMA and ISO Standards
Figure 30: ISO Protocols
Figure 31: NFC Forum Activities
Figure 32: Mobile Phone with NFC
Figure 33: TAM: Sales - Cell Phones with NFC Global (Mil. Units)
Figure 34: NFC-able Cell Phone Rate of Penetration (%)
Figure 35: TAM: Global Sales - NFC ICs ($B)
Figure 36: NFC Market Geography
Figure 37: TransferJet Communication Channel
Figure 38: TransferJet Applications

List of Tables:

Table 1: List of FCC Regulations
Table 2: China - Regulations
Table 3: Korea - Regulations
Table 4: Japan - Regulations
Table 5: Europe - Regulations
Table 6: MB-OFDM UWB Frequencies Designation
Table 7: Comparison: DS-UWB and MB-OFDM
Table 8: ETSI Documents
Table 9: Standard: Characteristics
Table 10: Z-Wave and ZigBee
Table 11: Z-wave Products Retail Pricing
Table 12: ZigBee Parameters
Table 13: ZigBee Smart Energy Profile Feature Set
Table 14: Bluetooth Profiles
Table 15: Wi-Fi Transfer Rates
Table 16: 802.11n Advantages
Table 17: Channels Utilization
Table 18: NFC Features
Table 19: NFC History
Table 20: NFC Development
Table 21: Bluetooth and NFC
Table 22: TransferJet Major Characteristics

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