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This report reflects the progress in the development of short-range radio (with maximum transmission distance of 30-100 feet) and ultra-short-range communications devices (with maximum transmission distance of - 5-10 centimeters). The report updates and revises Practel reports issued in 2008-2012.

In particular, the following technologies and related markets were addressed:

Bluetooth (BT)
ZigBee
UWB
Z-Wave
IEEE802.11n
Near Field Communications
TransferJet.
The report emphasizes one of the important technological trends: advanced manufacturing methods and microminiaturization allow the creation of multimodal devices. Such devices implement several technologies on one chipset, which effectively integrates common elements serving different radios. The report also shows the role of ultra-short-range communications: used as an independent technique or together with short-range radios.

The report contains a detailed survey of WPAN/WLAN equipment vendors specializing in the production of the discussed communications equipment.

Table Of Contents

Progress in Short-range Wireless Communications Developments: Marketing and Technological Trends
1.0. Introduction

1.0. Introduction

1.1. General
1.2. NFC Specifics
1.3. TransferJet
1.4. Short-range Radio Specifics
1.5. Report Structure
1.6. Methodology
1.7. Intended Audience
2.0. Short-reach Radio: Technologies and Markets

2.1. Ultra Wideband
2.1.1. Downturn
2.1.2. General: History
2.1.3. Benefits
2.1.4. Definition
2.1.5. Rates
2.1.6. Spectrum Allocation
2.1.7. Regulations
2.1.8. Major Features
2.1.9. Standards
2.1.9.1. Multiband OFDM
2.1.9.2. DS-UWB
2.1.9.3. Groups
2.1.9.4. ECMA
2.1.9.4.1. PHY
2.1.9.5. WiNET
2.1.9.6. EC-ETSI
2.1.9.7. IEEE 802.15.4a - 2007
2.1.9.8. IEEE 802.15.4f
2.1.10. Major Applications
2.1.10.1. Example: Characteristics and Requirements: WSN-UWB
2.1.11. Market Estimate
2.1.11.1. General
2.1.11.2. Geographical Segmentation
2.1.11.3. Forecast
2.1.12. Industry
Alereon (chipsets)
Camero (radar, equipment for first responders)
Decawave
Gefen (HDMI Extender)
General Atomics (Chipsets)
Gemtek
Multispectral (Zebra)-Sensors
Pulse~ Link (Chipsets)
RealTek (IC)
Samsung (WUSB)
Sensiotec (Sensor/Radar Health Care)
Time Domain (Chipsets-fusion of communications and radar)
TiaLinx (Sensor)
Ubisense (RFID-tracking)
Veebeam (Device)
Wisair (WUSB-chipsets)
2.2. Z-Wave
2.2.1. General
2.2.2. Z-Wave Alliance
2.2.3. Benefits
2.2.4. Details
2.2.4.1. General
2.2.4.2. Characteristics
2.2.4.2.1. ITU G.9959 (2/2012)
2.2.5. ZigBee and Z-Wave
2.2.6. Advanced Energy Control Framework
2.2.6.1. Z-wave and Smart Metering
2.2.7. Summary
2.2.8. Selected Vendors
Aeon Labs (Aeotec)
Mi Casa Verde
Sigma Designs
There
2.2.9. Pricing
2.2.10. Market Estimate: Z-wave Products for HAN
2.2.10.1. Model
2.2.10.2. Results
2.3. ZigBee
2.3.1. General
2.3.2. Details
2.3.2.1. Major Features
2.3.3. Device Types
2.3.4. Protocol Stack
2.3.4.1. Physical and MAC layers - IEEE802.15.4
2.3.4.2. Frame
2.3.4.3. Upper Layers
2.3.5. Interoperability
2.3.6. Security
2.3.7. Platform Considerations
2.3.8. Battery Life
2.3.9. ZigBee Technology Benefits and Limitations
2.3.10. Standardization Process
2.3.10.1. ZigBee Alliance
2.3.10.2. Objectives
2.3.10.3. Smart Energy Profile-ICT for Smart Grid
2.3.10.3.1. Further Developments
2.3.10.4. Features-Energy Service Portal
2.3.10.5. ZigBee IP
2.3.11. 802.15.4 - ZigBee Basis
2.3.11.1. IEEE 802.15.4 Radio - Details
2.3.12. Application Specifics - Profiles
2.3.12.1. Applications - General
2.3.12.2. Home
2.3.12.3. PC
2.3.12.4. Manufacturing
2.3.12.5. WSN-UGS and ZigBee
2.3.12.6. “Green” ZigBee
2.3.13. Market
2.3.13.1. Expectations
2.3.13.2. Segments
2.3.13.3. Forecast
2.3.14. Industry
Amber (RF Modules)
Atmel (Chipsets)
CEL (Modules)
Chipcon - TI (Chipsets)
Cirronet-RFM (Modules-Industrial Applications)
Digi (Radios, Routers, Energy Management)
Ember - Silicon Labs (Chipsets)
EnergyHub (Smart Home)
GreenPeak (WSN)
Helicomm (Modules)
Jennic - NXP (Chipsets-Modules)
Freescale (Chipsets)
Libelium (Router)
Nuri Telecom (AMR Application)
Renesas Electronics (Platforms, AMR)
Silicon Laboratories (Chipsets, Modules)
Synapse (Modules, Protocols)
Telegesis (Integrator, Modules)
TI (Chipsets)
2.4. IEEE 802.15.1 (Bluetooth-BT)
2.4.1. BT Protocol Stack
2.4.1.1. Transport layer
2.4.1.1.1. Radio Layer
2.4.1.1.2. Baseband and Link Manager Layers
2.4.1.2. Middleware Layer
2.4.2. Profiles
2.4.2.1. Power Consumption - ULP
2.4.2.2. Medical Profile
2.4.3. Bluetooth Security
2.4.4. Highlights
2.4.4.1. The Standard:
2.4.4.2. The Technology:
2.4.5. Evolution
2.4.5.1. BT v2.1
2.4.5.2. BT v3.0
2.4.5.3. BT v4.0 and Up
2.4.6. Market Estimate
2.4.7. BT Industry-HDP
Bluegiga
Cambridge Consultants
CSR
iFoundry-Nestronics
Laird Technologies
Nonin
Nordic Semiconductor
Stollmann
2.5. IEEE 802.11n WLAN
2.5.1. Major Enhancements
2.5.1.1. General
2.5.1.2. MIMO
2.5.1.2.1. “True MIMO”
2.5.1.2.2. BeamFlex
2.5.1.2.3. Atheros
2.5.1.3. Spatial Division Multiplexing
2.5.1.4. OFDM
2.5.1.5. Channel Bonding
2.5.1.6. Packet Aggregation
2.5.2. Features
2.5.2.1. Specifics
2.5.2.2. Channel Bandwidth
2.5.3. Adaptation
2.5.4. Benefits and Applications
2.5.4.1. Benefits
2.5.4.2. Applications
2.5.5. Market
2.5.5.1. General Drivers
2.5.5.2. Market Forecast
2.5.5.2.1. Model Assumptions
2.5.5.2.2. Forecast
2.5.5.2.2.1. Chipsets
2.5.6. Industry
Aerohive (AP)
Aruba (AP)
Buffalo (Router, AP)
Belkin (Router, Adaptor)
Broadcom (Chipsets; combo)
Cisco (AP)
CSR (Chips)
D-Link (Router, Adapter)
Encore (Adapter, router)
Edimax (Router, Adapter)
Extreme (AP)
Extricom (AP)
Gemtek (Router)
HP (AP)
Intel (Chipsets)
Marvell (Chipsets)
Meru (Family of Products)
Motorola (Tools, AP)
NEC (Router)
Netgear (Router, AP)
Qualcomm Atheros
RedPine (Chipsets)
Ruckus (AP)
Ralink (Chipsets)
Siemens (AP)
TrendNet (Routers, AP)
ZyXel (AP, Router, Adapter)
3.0. Ultra-short Reach Wireless Communications

3.1. Near Field Communications
3.1.1. General
3.1.2. Characteristics
3.1.3. Standardization
3.1.3.1. General
3.1.3.2. ECMA -340
3.1.3.3. ISO
3.1.3.4. NFC Forum
3.1.3.4.1. General
3.1.3.4.2. Specifications
3.1.3.5. Summary
3.1.4. Single Wire Protocol
3.1.5. Host Controller Interface
3.1.6. Security
3.1.7. Comparison
3.1.7.1. Bluetooth
3.1.7.2. RFID
3.1.8. Applications
3.1.8.1. General
3.1.8.2. Primary Users
3.1.8.3. Mobile Phone - Major Application
3.1.8.3.1. Example
3.1.8.4. Danger
3.1.8.5. WPAN Applications
3.1.8.6. Smart Poster
3.1.8.7. NFC and Wi-Fi
3.1.8.8. NFC and UWB
3.1.9. Trials
3.1.10. NFC Market
3.1.10.1. General
3.1.10.2. Market Drivers
3.1.10.3. Estimate
3.1.11. Industry
Alvin
Arygon (Identive Technologies)
Infineon
Innovision
Inside Secure
Legic
Mocapay
Motorola Solutions
NEC
Nokia
Nexperts
NXP
OTI
Qualcomm Atheros
Reslink
STmicroelectronics
TI
Toppan Forms
Twinlinx
UPM Raflatac
Zenius
3.1.12. Major Developmental Trends
3.2. TransferJet
3.2.1. General
3.2.2. Basis
3.2.2.1. Goal and Development
3.2.3. Technology
3.2.4. Major Features
3.2.5. ECMA/ISO
3.2.7. Applications and Industry
3.2.8. Industry
Allion
Murata
SONY
Toshiba
4.0. Conclusions

Attachment I: NFC Tags Types

List of Figures:

Figure 1: Illustration - UWB Spectrum
Figure 2: Global Regulations
Figure 3: DS-UWB Spectrum Characteristics
Figure 4: Spectrum Regulations-UWB
Figure 5: ECMA - Architectural Reference Model
Figure 6: TAM: Global UWB IC Revenue ($B)
Figure 7: TAM: Global UWB IC (Unit Bil)
Figure 8: TAM: U.S. Small SH Z - Wave IC ($US Mil)
Figure 9: TAM: U.S. Large SH Z - Wave IC ($US Mil)
Figure 10: ZigBee Protocol Stack
Figure 11: Profiles
Figure 12: TAM: U.S. ZigBee Modules Sales ($B)
Figure 13: TAM: U.S. ZigBee Modules Sales (Mil. Units)
Figure 14: ZigBee Market Segmentation (2010)
Figure 15: ZigBee Market Segmentation (2014) - Projection
Figure 16: Bluetooth Protocol Stack
Figure 17: Piconets Illustration
Figure 18: BT ULP Layers
Figure 19: TAM: BT Modules Shipped (Bil. Units)
Figure 20: TAM: BT Modules Shipped ($B)
Figure 21: BT Market Geographical Segmentation
Figure 22: Two-antenna MIMO system with two-stream SDM example
Figure 23: 802.11 Protocol Family MAC Frame Structure
Figure 24: TAM: Worldwide Legacy Wi-Fi Chipsets Sales (Unit Bil)
Figure 25: TAM: 802.11n Chipsets Worldwide Sales (Unit Bil)
Figure 26: TAM: Wi-Fi Chipsets Worldwide Sales ($B)
Figure 27: Market Geography: IEEE 802.11n
Figure 28: Standardization
Figure 29: NFC ECMA and ISO Standards
Figure 30: ISO Protocols
Figure 31: NFC Forum Activities
Figure 32: Mobile Phone with NFC
Figure 33: TAM: Sales - Cell Phones with NFC Global (Mil. Units)
Figure 34: NFC-able Cell Phone Rate of Penetration (%)
Figure 35: TAM: Global Sales - NFC ICs ($B)
Figure 36: NFC Market Geography
Figure 37: TransferJet Communication Channel
Figure 38: TransferJet Applications

List of Tables:

Table 1: List of FCC Regulations
Table 2: China - Regulations
Table 3: Korea - Regulations
Table 4: Japan - Regulations
Table 5: Europe - Regulations
Table 6: MB-OFDM UWB Frequencies Designation
Table 7: Comparison: DS-UWB and MB-OFDM
Table 8: ETSI Documents
Table 9: Standard: Characteristics
Table 10: Z-Wave and ZigBee
Table 11: Z-wave Products Retail Pricing
Table 12: ZigBee Parameters
Table 13: ZigBee Smart Energy Profile Feature Set
Table 14: Bluetooth Profiles
Table 15: Wi-Fi Transfer Rates
Table 16: 802.11n Advantages
Table 17: Channels Utilization
Table 18: NFC Features
Table 19: NFC History
Table 20: NFC Development
Table 21: Bluetooth and NFC
Table 22: TransferJet Major Characteristics

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