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Design Analysis Nokia Solutions Networks FSME LTE Baseband Unit

  • November 2014
  • -
  • EJL Wireless Research LLC
  • -
  • 85 pages

This report covers the design analysis of a Nokia Solutions Networks FSME LTE digital baseband unit. This unit is part of the Flexi eNodeB system. The unit was manufactured in Q3 of 2010.

Executive Summary

This report is a design “teardown” analysis of a Nokia Networks (formerly Nokia Siemens Networks/Nokia Solutions Networks) multi-mode W-CDMA/LTE baseband system module. The baseband processing "digital Unit" supports both W-CDMA and LTE technology. The analysis covers the entire system including the signal processing functions. A simplified mechanical analysis of the unit along with detailed bill of materials analysis is presented in this report. The Nokia product name is FSME. The Nokia P/N for this unit is 083833A.104 FSME Core. The Nokia P/N for the metal case is 471469A.104. We believe this particular unit was manufactured in China. We are aware of other units being manufactured in Germany and possibly in India.

Key Findings:

Separate sector cards for baseband processing

Standard DSPs for high capacity LTE user support and throughput

Advanced power management for ASICs, DSPs, and FPGAs

Component and semiconductor suppliers mentioned in this report include: Amphenol, AVX, Epson Toyocomm, Fairchild Semiconductor, Infineon Technologies, Molex, NXP Semiconductors, Pulse Electronics, Samsung Semiconductors, STMicroelectronics, Texas Instruments, and Vishay Semiconductors

Features

Complete Part Number/Marking
Component Manufacturer Identification
Function Component Description

Important Note:

This particular unit was built in Q3 2010, given the date codes present on many of the semiconductor integrated circuits contained within the unit as well as on the front panel of the unit. As such, some of the components, both active and passive, may have been updated or replaced by more recent part numbers. The majority of the components contained within the bill of materials analysis are RoHS compliant. We believe that the overall system and functionality presented has not changed dramatically compared to the latest version of this unit. Where possible, all components, both passive and active, have been identified with the manufacturer’s part number within the bill of materials analysis.
This analysis does not include any pricing information or estimated costs on the mechanical design or for any passive or active components contained within the system.
All dimensions, unless otherwise specifically stated, are in metric format.

Table Of Contents

Design Analysis Nokia Solutions Networks FSME LTE Baseband Unit
EXECUTIVE SUMMARY 6
Active/Passive Component Summary 6
Important Note: 6
CHAPTER 1: NOKIA FLEXI MULTIRADIO BTS SYSTEM 7
Overview of Nokia Flexi Product Offering 7
CHAPTER 2: FSME MECHANICAL ANALYSIS 13
Mechanical Analysis 13
CHAPTER 3: FLEXI POWER DISTRIBUTION AND FUSES MODULE (FPFB) 24
CHAPTER 4: FCM SUB SYSTEM 38
CHAPTER 5: FSP SUB SYSTEM 58
CHAPTER 6: FAN UNIT 73
APPENDIX A - PASSIVE CASE SIZE ANALYSIS 76
APPENDIX B - ACTIVE COMPONENT MARKET SHARE ANALYSIS 80

TABLES

Table 1: FPFB Bill of Materials 34
Table 2: FCM PCB Top Bill of Materials 51
Table 3: FCM PCB Top Missing Component Bill of Materials 54
Table 4: FCM PCB Bottom Bill of Materials 55
Table 5: FCM PCB Bottom Missing Component Bill of Materials 57
Table 6: FCM PCB Bottom Missing Connector Bill of Materials 57
Table 7: FSP Top Bill of Materials 66
Table 8: FSP Top View Missing Component Bill of Material 68
Table 9: FSP Bottom Bill of Materials 69
Table 10: FSP Bottom Missing Component Bill of Materials 70
Table 11: FSP Bottom Missing Component, Area A Bill of Materials 71
Table 12: FSP Bottom Missing Connector Bill of Materials 72
Table 13: Passive Component Case Size Distribution by System Subsection 77
Table 14: Identified Passive Component Supplier Distribution by System Subsection 78
Table 15: Active/Passive Component Distribution by System Subsection 79
Table 16: Active Semiconductor/Component Vendor Distribution by System Subsection 81

EXHIBITS

Exhibit 1: Nokia Flexi Macro Cell Indoor/Outdoor BTS System Cabinets, FCIA (L) and FCOA (R) 8
Exhibit 2: Flexi FSMx System Module w/Case, Front/Back Covers and External Cable Entry Covers 8
Exhibit 3: Nokia FSME System Block Diagram 10
Exhibit 4: FSME System Module Interfaces w/FPFB Power Module (L) and Transport Sub-module (R) 12
Exhibit 5: FSME Unit, Front 13
Exhibit 6: FSME Front Panel Interface Ports 14
Exhibit 7: FSME Unit, Front View 14
Exhibit 8: FSME Unit, Back View (Fan Unit Removed) 15
Exhibit 9: FSME Unit, Left Side View 15
Exhibit 10: FSME Unit, Right Side View 15
Exhibit 11: FSME Unit, Bottom View 16
Exhibit 12: FSME Unit, Top View 16
Exhibit 13: FSM Top Frame, External View 17
Exhibit 14: FSM Top Frame, Internal View w/PCBs 18
Exhibit 15: FSM Top Frame, Internal View w/o PCBs 19
Exhibit 16: FSM Bottom Shield, External View 20
Exhibit 17: FSM Bottom Frame, Internal View w/PCBs 21
Exhibit 18: FSM Bottom Frame, Internal View w/o PCBs 22
Exhibit 19: FSME System, Exploded Side View 23
Exhibit 20: FSME System, FCM+FSP Boards 23
Exhibit 21: FPFB Interface Diagram 24
Exhibit 22: FPFB Interface Panel w/Protective Covers 25
Exhibit 23: FPFB Interface Panel w/o Protective Covers 25
Exhibit 24: FPFB Top View (L) and Bottom View (R) 26
Exhibit 25: FPFB Cover, External View (L) and Internal View (R) 27
Exhibit 26: Aluminum Recycling Code 27
Exhibit 27: FPFB Internal View of Frame w/ PCB 28
Exhibit 28: FPFB Frame Internal View w/o PCB 29
Exhibit 29: FPFB Power Bus Bar Component Diagram 30
Exhibit 30: FPFB PCB Top View 31
Exhibit 31: FPFB PCB Top View Component Diagram 32
Exhibit 32: FPFB PCB Bottom View Component Diagram 33
Exhibit 33: FPFB Connector Card to System Module 37
Exhibit 34: FCM PCB Dimensions 38
Exhibit 35: FCM to FSP Connector Card Type 1 39
Exhibit 36: FCM to FSP Connector Card Type 2 39
Exhibit 37: FCM PCB Top View, Component Diagram 40
Exhibit 38: FCM PCB Top View, Areas A and B 42
Exhibit 39: FCM PCB Top View, Area A Component Diagram 43
Exhibit 40: FCM PCB Top View, Area B Component Diagram 44
Exhibit 41: FCM PCB Top View, Missing Components Diagram 45
Exhibit 42: FCM PCB Bottom View, Component Diagram 47
Exhibit 43: FCM PCB Bottom View, Missing Components Diagram 48
Exhibit 44: FCM PCB Bottom View, Missing Connector Component Diagram 49
Exhibit 45: FCM Block Diagram 50
Exhibit 46: FSP PCB Dimensions 58
Exhibit 47: FSP Top View, Component Diagram 59
Exhibit 48: FSP Top View, Missing Component Diagram 60
Exhibit 49: FSP Bottom View, Component Diagram 61
Exhibit 50: FSP Bottom View, Missing Component Diagram 62
Exhibit 51: FSP Bottom View, Missing Components, Area A 63
Exhibit 52: FSP Bottom View, Missing Connector Component Diagram 64
Exhibit 53: FSME FSP Baseband Processing Block Diagram 65
Exhibit 54: Plastic Recycling Code 73
Exhibit 55: Fan11 Unit, External View 73
Exhibit 56: Fan11 Unit, Internal View 74
Exhibit 57: Fan11 Unit, Bottom View 74
Exhibit 58: Fan11 Cable Connector Interface Plate, External View (L) and Internal View (R) 75
Exhibit 59: Passive Component Case Size Distribution 76
Exhibit 60: Identified Passive Component Market Share by Vendor 79
Exhibit 61: Active Semiconductor Component Share 80
Exhibit 62: High Pin Count IC vs. Discretes 82
Exhibit 63: Active Semiconductor Market Share by Vendor 83
Exhibit 64: High Pin Count (64+) Active Semiconductor Market Share by Vendor 84

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