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  4. > Electronic Thermal Management - Technologies, Materials, Devices, New Developments, Industry Structure and Global Markets

“Thermal management” denotes the array of problem-solving design tools and material technologies that systems manufacturers apply to regulate the unwanted heat caused by the normal functioning of an electronic system. Increasing power densities and decreasing transistor dimensions are hallmarks of modern computer chips. Both trends are increasing the thermal management challenge within the chip and surrounding packaging, as well as accelerating research progress on high conductivity materials.

Dramatic changes are underway in the computer, telecommunications and consumer electronics industries. There is a trend toward systems “convergence,” combining computer, telecommunications and consumer system functions all into one system. There is also a trend toward micro-miniaturization and microsystem technologies integrating digital, optical, radio frequency and microelectromechanical systems (MEMS) devices. Microsystem packaging is at the heart of all of these products, since it is this technology that provides the system integration in addition to controlling the size, performance, reliability and cost of the final microsystem.

High-density packaging has been the trend in electronic circuits during the last decade, and that will continue for at least the next five years. In 2013, a typical megaprocessor could pack a staggering 41 million transistors onto a single chip. Running flat out, that chip would dissipate 130 watts of heat – more than a bright household light bulb – from an area the size of a postage stamp.

The trend line of the thermal management industry aligns with the developments of technology in the semiconductor, microprocessor and computer industries. For every advance in performance of these systems, there is a corresponding increase in the operating heat generated by the system. To simply say, however, that demands for thermal management products have increased as the requirements of applications have increased, does not do justice to the unique character of this industry. It is probably more accurate to state that the development of thermal management as an industry is the result of a synergy of solutions constantly engineered to manage excess heat in today’s electronic systems.

STUDY GOAL AND OBJECTIVES

The goal of this iRAP report is to provide an up-to-date analysis of recent developments and current trends in the global thermal management marketplace. The identification of significant drivers of revenue growth in specific product categories is an additional aim. The objective of this kind of systematic research is to quantify the projected impact of the forces — from within and from outside — at work on this industry today.

Products in this report have been grouped into four segments – hardware, software, interfaces and substrates. Product sub-segments within the hardware segment include heat sinks, fans and blowers, fan sinks, heat pipes, and cold plates – chosen because they are established technologies and represent revenue markets of significant size. The software segment focuses on modeling and analysis of the thermal characteristics of an electronic system. While the interface product line primarily attaches the heat sink to the system, several other product sub-segments in this technology are being applied to dissipate heat in applications where there is no room for a conventional heat sink. The categories of interfaces covered in this segment are thermal grease, thermal compounds, thermal pads, adhesive films and tapes, and epoxy. Finally, the report looks at substrates, focusing on two emerging package and component level products, thermally enhanced packages and heat spreaders.

Besides targeting the conventional market of thermal management products and solutions related to electronics usage in computers, telecomm, automotive, consumer, medical/office and industrial/military equipment, the report addresses electronics used in new applications such as high-power LEDs, power circuits used in renewal power (wind and solar) stations, high-performance embedded computing (HPEC) working at more than 5GHz frequency, and the growing industrial usage of electronics in laser machining and industrial robots.

The report also briefly discusses recent research work done on cooling solutions to address complex heat issues arising in commercialization of new three-dimensional integrated circuit (3DIC) chips intended for use in computers, tablets, cellular phones, set-top boxes, LCD monitors, digital cameras and video game consoles.

REASONS FOR DOING THE STUDY

Development within the thermal industry is one of the most interesting sub-plots of the rapid innovation in the high-tech area. As the drive to achieve higher levels of device integration while reducing cost, size and complexity continues, the issue of managing heat and power dissipation has become very significant. Economic and market forces also are important factors. Consequently, current trends (market and technology), as well as potential breakthroughs in the near- and long-term future, become very important.

CONTRIBUTIONS OF THE STUDY

The information presented here is for suppliers participating in the thermal management market with a vital interest in the market potential of a specific technology in one of the product segment markets. This study should also be of interest to companies in the electronic materials, software and other industries, that have an interest in the potential of their products in a thermal management application. In addition, because of this report’s business focus, it should be of use to executives and business managers as an up-to-the-minute guide to current conditions that are expected to be significant in tomorrow’s markets.


FORMAT AND SCOPE

The scope of this report is broad, and covers several product areas. The individual materials, hardware and software product segments are presented in terms of market size and revenue trends. The revenue forecasts are explained in terms of the key market issue for a specific product segment, and are projected for five years from 2013 to 2018. The application section features forecasts for the most important applications by product. The technology discussion concentrates on trends that will develop more significantly during the forecast period. The report also includes a discussion on the competitive aspects of each product segment, along with several successful suppliers’ strategies in the market. A current industry directory, a survey of U.S. thermal management patents from Jan. 2010 to Jan. 2014, and profiles of a selection of the leading thermal management suppliers are also included.


TO WHOM THE STUDY CATERS

The study will benefit existing and new manufacturers of electronic thermal management products, service providers and solution providers. This study also provides a technical overview of electronic thermal management products, service providers and solution providers, especially recent technology developments and existing barriers. Therefore, audiences for this study include marketing executives, business unit managers and other decision makers working in the area of electronic thermal management, as well as those in companies peripheral to these businesses.

REPORT SUMMARY

The thermal management industry is moving toward comprehensive solutions to cool electronics. As a result, the dynamic in this market has not been one where there is a move toward a single technology or product that replaces others. The tendency is for systems designers to look at the entire problem and evaluate multiple options and combinations for a solution.

There are four main segments in thermal management technologies – hardware, software, interfaces, and substrates.

Components of thermal management pave the way for the electronics industry to develop high-performance applications. This report examines the range of thermal management products and solutions in the market today.
The worldwide market for thermal management products is predicted to grow from about $8.8 billion in 2013 to $15.56 billion by 2018, at an average annual growth rate (CAGR) of 12.1%.

Table Of Contents

Electronic Thermal Management - Technologies, Materials, Devices, New Developments, Industry Structure and Global Markets
INTRODUCTION 1
STUDY GOALS AND OBJECTIVES 2
REASONS FOR DOING THE STUDY 2
CONTRIBUTIONS OF THE STUDY 3
SCOPE AND FORMAT 3
METHODOLOGY 3
INFORMATION SOURCES 4
WHOM THE STUDY CATERS TO 5
AUTHOR'S CREDENTIALS 5
EXECUTIVE SUMMARY 7
SUMMARY TABLE WORLDWIDE REVENUE FOR THE THERMAL MANAGEMENT MARKET, 2013 AND 2018 8
SUMMARY FIGURE WORLDWIDE REVENUES FOR THE THERMAL MANAGEMENT MARKET, 2013 AND 2018 8
INDUSTRY OVERVIEW 11
AN OVERVIEW OF THERMAL MANAGEMENT 12
INDUSTRY DRIVERS 13
TABLE 1 NEW ELECTRONICS DEVELOPMENTS IMPACTING
THERMAL MANAGEMENT PRODUCTS, 2013-2018 13
TABLE 1 NEW ELECTRONICS DEVELOPMENTS IMPACTING
TECHNOLOGY 16
PHYSICAL ISSUES 17
FIGURE 1 MAJOR CAUSES OF ELECTRONIC FAILURE 17
MARKET OVERVIEW 18
TABLE 2 WORLD THERMAL MANAGEMENT REVENUE ACCORDING
TO PRODUCT CATEGORIES, 2013 AND 2018 18
INDUSTRY DRIVERS AND STRUCTURE 18
FIGURE 2 TECHNOLOGY NEEDS AS A DRIVER FOR THERMAL MANAGEMENT 20
INDUSTRY STRUCTURE 21
MERGERS AND ACQUISITIONS 23
TABLE 3 MERGERS, ACQUISITIONS AND NEW FUNDINGS IN ELECTRONICS THERMAL MANAGEMENT FROM 2008 THROUGH 2013 23
TABLE 4 RESEARCH ORGANIZATIONS AND COMPANIES ACTIVELY ENGAGED IN ELECTRONIC THERMAL MANAGEMENT IN 2013 24
TABLE 5 LEADING THERMAL CONSULTANTS AND INTEGRATORS 25
TECHNOLOGY OVERVIEW 26
THERMAL MANAGEMENT 26
EFFECTIVE THERMAL DESIGN FOR ELECTRONIC SYSTEMS 26
CONCEPT DEVELOPMENT PHASE PROCESS AND THERMAL TOOLS 27
DETAILED DESIGN PHASE PROCESS AND THERMAL TOOLS 27
HARDWARE TEST PHASE PROCESS AND THERMAL TOOLS 28
TECHNICAL PROPERTIES 29
TABLE 6 THERMAL PROPERTIES OF MATERIALS 30
ELECTRONIC THERMAL MANAGEMENT MATERIALS 30
COMPOSITES 30
TABLE 7 METAL MATRIX COMPOSITES 31
CERAMICS 31
ALUMINA (Al2O3) 32
ALUMINUM NITRIDE (AlN) 32
SILICON CARBIDE (SiC) 32
ALUMINUM SILICON CARBIDE (AlSiC) 33
BERYLLIUM OXIDE (BeO) 33
OTHER THERMAL MANAGEMENT MATERIALS 33
CONDUCTORS 34
HIGH PERFORMANCE THERMAL MANAGEMENT MATERIALS 35
ADVANCED THERMAL SOLUTIONS IN PRACTICE IN 2013 37
FIGURE 3 LIQUID COOLING LOOP FOR HIGH PERFORMANCE ELECTRONICS 38
CASE STUDY 1: THERMOELECTRIC COOLERS IN MODULE COOLING ENHANCEMENT 39
CASE STUDY 2: SIGNIFICANCE IN CONTEMPORARY DATA CENTERS 39
CASE STUDY 3: COOLING METHODS FOR INDUSTRIAL ELECTRONICS 40
CASE STUDY 4: HIGH-POWER LEDS 40
FIGURE 4 TYPICAL USAGE OF FAN-COOLED HEAT SINK IN HIGH-POWER LED ASSEMBLY 42
CASE STUDY 5: WIND POWER GENERATION 42
CASE STUDY 6: SOLAR GRID-CONNECTED PHOTOVOLTAIC (PV) GENERATION 42
GLOBAL ELECTRONIC THERMAL MANAGEMENT MARKETS 43
THERMAL MANAGEMENT PRODUCT CATEGORIES AND MARKETS 43
PRODUCT SUMMARY FORECASTS 43
TABLE 8 GLOBAL REVENUE BY PRODUCT CATEGORY, 2013 AND 2018 44
FIGURE 5 GLOBAL REVENUE BY PRODUCT CATEGORY, 2013 AND 2018. 44
GLOBAL AND REGIONAL TRENDS FOR THERMAL MANAGEMENT 45
TABLE 9 GLOBAL REVENUE BY REGION, 2013 AND 2018 46
FIGURE 6 WORLD THERMAL MANAGEMENT REVENUE BY REGION, 2013 AND 2018 46
NORTH AMERICA 47
EUROPE 47
ASIA/PACIFIC 48
JAPAN 48
THERMAL MANAGEMENT END USE APPLICATION TRENDS AND MARKETS 48
TABLE 10 GLOBAL HARDWARE REVENUE BY APPLICATION, 2013 AND 2018 49
FIGURE 7 GLOBAL REVENUE BY APPLICATION, 2013 AND 2018 49
COMPUTERS 50
TABLE 11 GLOBAL REVENUE - COMPUTER APPLICATIONS, 2013 AND 2018 50
TELECOM 50
TABLE 12 GLOBAL REVENUE - TELECOM APPLICATIONS, 2013 AND 2018 51
Telecom and network industry challenges 51
AUTOMOTIVE INDUSTRY 52
TABLE 13 GLOBAL REVENUE - AUTOMOTIVE APPLICATIONS, 2013 AND 2018 53
CONSUMER PRODUCTS 53
TABLE 14 GLOBAL REVENUE - CONSUMER PRODUCTS, 2013 AND 2018 55
MEDICAL/OFFICE EQUIPMENT 55
TABLE 15 GLOBAL REVENUE - MEDICAL/OFFICE APPLICATIONS, 2013 AND 2018 56
INDUSTRIAL/MILITARY EQUIPMENT 56
TABLE 16 GLOBAL REVENUE - INDUSTRIAL/MILITARY
APPLICATIONS, 2013 AND 2018 57
INDUSTRY STUCTURE MARKET SHARES 57
THERMAL MANAGEMENT HARDWARE MARKET 58
TABLE 17 GLOBAL HARDWARE REVENUES, 2013 AND 2018 58
Global and regional trends for thermal management hardware 58
TABLE 18 GLOBAL HARDWARE REVENUE BY REGION, 2013 AND 2018 59
Thermal management hardware end use application trends 59
TABLE 19 GLOBAL HARDWARE REVENUE BY APPLICATION, 2013 AND 2018 60
Thermal management hardware sub-product categories 60
TABLE 20 GLOBAL HARDWARE REVENUE BY SUB-PRODUCTS, 2013 AND 2018 61
FIGURE 8 GLOBAL HARDWARE REVENUE BY SUB-PRODUCTS, 2013 AND 2018 61
Fans and blowers: overview 62
TABLE 21 FANS AND BLOWERS END USE APPLICATIONS, 2013 AND 2018 63
Heat sinks: overview 64
TABLE 22 HEAT SINKS END USE APPLICATIONS, 2013 AND 2018 64
Heat pipes: overview 65
TABLE 23 HEAT PIPES END USE APPLICATIONS, 2013 AND 2018 66
Fan sinks: overview 66
TABLE 24 FAN SINKS END USE APPLICATIONS, 2013 AND 2018 67
Cold plates: overview 68
TABLE 25 COLD PLATES END USE APPLICATIONS, 2013 AND 2018 69
Thermoelectric coolers: overview 71
TABLE 26 THERMOELECTRIC COOLERS END USE APPLICATIONS, 2013 AND 2018 72
New developments in hardware 73
FIGURE 9 LIQUID COOLING OF ELECTRONICS SYSTEMS 74
TABLE 27 MAJOR DEVELOPMENTS IN HARDWARE IN ELECTRONICS THERMAL MANAGEMENT PRACTICES 75
THERMAL MANAGEMENT SOFTWARE 79
WORLDWIDE MARKET FORECAST 79
TABLE 28 GLOBAL SOFTWARE REVENUES, 2013 AND 2018 79
THERMAL SOFTWARE MODELING OPTIONS 80
GLOBAL AND REGIONAL TRENDS FOR THERMAL MANAGEMENT SOFTWARE 81
TABLE 29 SOFTWARE REVENUE BY REGION, 2013 AND 2018 81
THERMAL MANAGEMENT SOFTWARE END USE APPLICATION TRENDS 82
TABLE 30 SOFTWARE REVENUE BY APPLICATION, 2013 AND 2018 82
FIGURE 10 SOFTWARE REVENUE BY APPLICATION, 2013 AND 2018 83
TABLE 31 COMPUTER APPLICATIONS SOFTWARE SHARES, 2013 AND 2018 84
THERMAL MANAGEMENT SOFTWARE SUB-PRODUCT CATEGORIES 84
TABLE 32 SOFTWARE REVENUE BY SUB-PRODUCTS, 2013 AND 2018 85
CFD: overview 85
TABLE 33 CFD END USE APPLICATIONS, 2013 AND 2018 86
CHT: overview 86
TABLE 34 CHT END USE APPLICATIONS, 2013 AND 2018 87
Circuit design: overview 87
TABLE 35 CIRCUIT DESIGN END USE APPLICATIONS, 2013 AND 2018 88
Power management: overview 88
TABLE 36 POWER MANAGEMENT END USE APPLICATIONS, 2013 AND 2018 89
Other software: overview 89
TABLE 37 OTHER SOFTWARE END USE APPLICATIONS, 2013 AND 2018 90
TECHNOLOGY TRENDS IN THERMAL MANAGEMENT SOFTWARE 90
TABLE 38 NEW DEVELOPMENTS IN SOFTWARE RELATED TO ELECTRONIC THERMAL MANAGEMENT 90
SOFTWARE INDUSTRY STRUCTURE AND MARKET SHARES 91
TABLE 39 MARKET SHARES OF MAJOR VENDORS - GLOBAL SOFTWARE MARKET FOR THERMAL MANAGEMENT, 2013 92
FIGURE11 MAJOR VENDORS IN THE GLOBAL THERMAL MANAGEMENT
SOFTWARE MARKET, 2013 92
THERMAL MANAGEMENT INTERFACE MATERIALS 93
WORLDWIDE MARKET FORECAST 93
TABLE 40 GLOBAL INTERFACE REVENUES, 2013 AND 2018 93
GLOBAL AND REGIONAL TRENDS FOR THERMAL MANAGEMENT INTERFACE 94
TABLE 41 INTERFACE REVENUE BY REGION, 2013 AND 2018 94
THERMAL MANAGEMENT INTERFACE END USE APPLICATION TRENDS 94
TABLE 42 GLOBAL INTERFACE REVENUE BY APPLICATION, 2013 AND 2018 96
FIGURE 12 GLOBAL INTERFACE REVENUE BY APPLICATION, 2013
AND 2018 96
THERMAL MANAGEMENT INTERFACE SUB-PRODUCT CATEGORIES 97
TABLE 43 GLOBAL THERMAL MANAGEMENT INTERFACE
REVENUE BY SUB-PRODUCTS, 2013 AND 2018 98
Thermal grease: overview 99
TABLE 44 GLOBAL GREASE END USE APPLICATIONS, 2013 AND 2018 99
Thermal compounds: overview 100
TABLE 45 GLOBAL THERMAL COMPOUND END USE
APPLICATIONS,2013 AND 2018 101
Thermal pads: overview 101
TABLE 46 GLOBAL THERMAL PADS END USE APPLICATIONS, THROUGH 2018 102
Adhesive film and tape: overview 102
TABLE 47 GLOBAL ADHESIVE FILM AND TAPE END USE APPLICATIONS,2013 AND 2018 103
Epoxy: overview 103
TABLE 48 GLOBAL EPOXY END USE APPLICATIONS, 2013 TO 2018 104
TECHNOLOGY TRENDS IN THERMAL MANAGEMENT INTERFACE 105
TABLE 49 EXAMPLES OF THERMAL INTERFACE PROPERTIES 105
TRENDS IN THERMAL MANAGEMENT INTERFACE 106
TABLE 50 NEW DEVELOPMENTS IN THERMAL INTERFACE MATERIALS RELATED TO ELECTRONIC THERMAL MANAGEMENT IN 2013 106
TIM INDUSTRY STUCTURE AND MARKET SHARES 107
TABLE 51 MARKET SHARES OF MAJOR VENDORS - GLOBAL INTERFACE MARKET, 2013 107
FIGURE 13 TOP VENDORS - GLOBAL INTERFACE MARKET, 2002 108
THERMAL MANAGEMENT SUBSTRATES 109
WORLDWIDE MARKET FORECAST 109
TABLE 52 GLOBAL THERMAL MANAGEMENT SUBSTRATE REVENUES, THROUGH 2018 109
GLOBAL AND REGIONAL TRENDS FOR SUBSTRATE 109
TABLE 53 SUBSTRATE REVENUE BY REGION, 2013 AND 2018 110
SUBSTRATE END USE APPLICATION TRENDS 110
TABLE 54 GLOBAL SUBSTRATE REVENUE BY APPLICATION, THROUGH 2018 ($ MILLIONS) 111
FIGURE 14 GLOBAL SUBSTRATE REVENUE BY APPLICATION, 2013 AND 2018 112
THERMAL MANAGEMENT SUBSTRATE SUB-PRODUCT CATEGORIES 113
TABLE 55 SUBSTRATE REVENUE BY SUB-PRODUCTS, THROUGH 2018 114
Thermally-enhanced packages: overview 114
TABLE 56 GLOBAL THERMALLY-ENHANCED PACKAGES END
USE APPLICATIONS, 2013 AND 2018 115
Heat spreader: overview 116
Heat spreader: overview (CONT.) 117
TABLE 57 GLOBAL THERMAL MANAGEMENT HEAT SPREADERS
END-USE APPLICATIONS, THROUGH 2008 118
Technology trends in substrates 118
TABLE 58 NEW DEVELOPMENTS IN THERMAL SUBSTRATES MATERIALS RELATED TO ELECTRONIC THERMAL MANAGEMENT IN 2013 118
INDUSTRY STUCTURE MARKET SHARES 119
TABLE 59 MARKET SHARES OF MAJOR VENDORS - GLOBAL SUBSTRATE MARKET, 2013 120
FIGURE 15 MARKET SHARES OF MAJOR VENDORS - GLOBAL SUBSTRATE MARKET, 2013 120
PATENTS AND PATENT ANALYSIS 121
TABLE 60 NUMBER OF U.S. THERMAL MANAGEMENT PATENTS, 2010-2014 121
OVERVIEW OF U.S. PATENT ACTIVITY IN THERMAL MANAGEMENT 121
TABLE 61 NUMBER OF U.S. ELECTRONIC THERMAL
MANAGEMENT PATENTS ASSIGNED BY REGION, FROM
JANUARY 2010 THROUGH FEBRUARY 2014 122
PATENTS: THERMAL MANAGEMENT HARDWARE 122
TABLE 62 TOP U.S. ELECTRONIC THERMAL MANAGEMENT HARDWARE PATENT ASSIGNEES, JANUARY 2010 TO FEBRUARY 2014 123
FIGURE 16 TOP U.S. ELECTRONIC THERMAL MANAGEMENT HARDWARE PATENT ASSIGNEES, JANUARY 2010 TO FEBRUARY 2014 123
PUMP AND FAN CONTROL CONCEPTS IN A COOLING SYSTEM 124
SEMICONDUCTOR PACKAGE THERMAL TAPE WINDOW FRAME FOR HEAT SINK ATTACHMENT 124
THERMOELECTRIC DEVICES INCLUDING THERMOELECTRIC ELEMENTS HAVING OFF-SET METAL PADS AND RELATED STRUCTURES, METHODS, AND SYSTEMS 124
ASSEMBLIES AND METHODS FOR DISSIPATING HEAT FROM
HANDHELD ELECTRONIC DEVICES 125
COOLING SYSTEMS INCORPORATING HEAT EXCHANGERS AND THERMOELECTRIC LAYERS 125
ASSEMBLIES AND METHODS FOR DISSIPATING HEAT FROM HANDHELD ELECTRONIC DEVICES 126
HEAT SINK FOR LED LIGHT BULB 126
BONDED METAL AND CERAMIC PLATES FOR THERMAL MANAGEMENT OF OPTICAL AND ELECTRONIC DEVICES 126
HEAT SINK BASE PLATE WITH HEAT PIPE 127
MICROHEAT EXCHANGER FOR LASER DIODE COOLING 127
DEVICE AND METHODOLOGY FOR THE REMOVAL OF HEAT FROM AN EQUIPMENT RACK BY MEANS OF HEAT EXCHANGERS MOUNTED TO A DOOR 127
SYSTEMS AND ASSOCIATED METHODS FOR CONTROLLABLY COOLING COMPUTER COMPONENTS 128
CLAMP-TYPE HEAT SINK FOR MEMORY 128
METHODS OF FORMING EMBEDDED THERMOELECTRIC COOLERS WITH ADJACENT THERMALLY CONDUCTIVE FIELDS 129
HOLISTIC THERMAL MANAGEMENT SYSTEM FOR A
SEMICONDUCTOR CHIP 129

HEAT SINK FOR MEMORY AND MEMORY DEVICE HAVING HEAT SINK 129
SOLAR POWER SYSTEM WITH TOWER TYPE HEAT DISSIPATING STRUCTURE 130
THERMALLY CONDUCTIVE STRUCTURE OF LED AND MANUFACTURING METHOD THEREOF 130
AIRFLOW INTAKE SYSTEMS AND ASSOCIATED METHODS FOR USE WITH COMPUTER CABINETS 131
METHOD OF FABRICATING HIGH SURFACE TO VOLUME RATIO STRUCTURES AND THEIR INTEGRATION IN MICROHEAT EXCHANGERS FOR LIQUID COOLING SYSTEM 131
OPTIMAL SPREADER SYSTEM, DEVICE AND METHOD FOR FLUID COOLED MICRO-SCALED HEAT EXCHANGE 131
METHODOLOGY OF COOLING MULTIPLE HEAT SOURCES IN A PERSONAL COMPUTER THROUGH THE USE OF MULTIPLE FLUID-BASED HEAT EXCHANGING LOOPS COUPLED VIA MODULAR BUS-TYPE HEAT EXCHANGERS 132
HEAT DISSIPATION DEVICE 132
METHODS OF FORMING THERMOELECTRIC DEVICES USING ISLANDS OF THERMOELECTRIC MATERIAL AND RELATED STRUCTURES 133
THERMAL MANAGEMENT SOFTWARE PATENTS 133
TABLE 63 TOP U.S. ELECTRONIC THERMAL MANAGEMENT SOFTWARE PATENT ASSIGNEES, JANUARY 2010 THROUGH FEBRUARY 2014 133
FIGURE 17 TOP U.S. ELECTRONIC THERMAL MANAGEMENT SOFTWARE PATENT ASSIGNEES, JANUARY 2010 THROUGH FEBRUARY 2014 134
THERMAL ANALYSIS 134
SYSTEM AND METHOD FOR ACCESSING A MULTIPHYSICS MODELING SYSTEM VIA A DESIGN SYSTEM USER INTERFACE 135
MODEL-BASED FILL 135
MODEL-BASED DESIGN VERIFICATION 135
MODELING AND SIMULATION METHOD 136
METHOD AND APPARATUS FOR MULTI-DIE THERMAL ANALYSIS 136
REDUCING THE SIZE OF A MODEL USING VISIBILITY FACTORS 136
SIMULATION AND CORRECTION OF MASK SHADOWING EFFECT 137
METHOD FOR ASSEMBLING THE FINITE ELEMENT
DISCRETIZATION OF ARBITRARY WEAK EQUATIONS 137
SELECTIVELY REDUCING THE NUMBER OF CELL EVALUATIONS IN A HARDWARE SIMULATION 138
LOCALLY UPDATING A THREE-DIMENSIONAL MODEL 138
SYSTEMS, METHODS, AND TOOLS FOR PROOFING A
COMPUTER-AIDED DESIGN OBJECT 138
PROCESS FOR DISPLAYING OBJECTS OF A PLM DATABASE AND APPARATUS IMPLEMENTING THIS PROCESS 139
PATENTS: THERMAL MANAGEMENT INTERFACE 139
TABLE 64 TOP U.S. ELECTRONIC THERMAL MANAGEMENT INTERFACE MATERIALS PATENT ASSIGNEES, JANUARY 2010 TO FEBRUARY 2014 140
FIGURE 18 TOP U.S. ELECTRONIC THERMAL MANAGEMENT INTERFACE MATERIALS PATENT ASSIGNEES, JANUARY 2010 TO FEBRUARY 2014 140
THERMAL INTERFACE MATERIAL WITH THIN TRANSFER FILM OR METALLIZATION 141
THERMALLY CONDUCTIVE DEVICE WITH A THERMAL INTERFACE MATERIAL 141
METHOD AND SYSTEM FOR ALIGNMENT OF GRAPHITE NANOFIBERS FOR ENHANCED THERMAL INTERFACE MATERIAL PERFORMANCE 141
SYSTEM INCLUDING THERMAL CONTROL UNIT HAVING CONDUIT FOR DISPENSE AND REMOVAL OF LIQUID THERMAL INTERFACE MATERIAL 142
THERMAL INTERFACE MATERIALS AND METHODS FOR MAKING THEREOF 142
REINFORCED RESIN-DERIVED CARBON FOAM 143
FLEXIBLE GRAPHITE FLOORING HEAT SPREADER 143
THERMAL INTERFACE MATERIAL AND SEMICONDUCTOR COMPONENT INCLUDING THE THERMAL INTERFACE MATERIAL 143
UNIFORM GRAPHITE PLATE 144
HIGH STRENGTH MONOLITHIC CARBON FOAM 144
THERMAL MANAGEMENT OF ELECTRONIC DEVICES 144
HIGHLY THERMALLY-CONDUCTIVE MOLDABLE THERMOPLASTIC COMPOSITES AND COMPOSITIONS 145
HEAT SPREADER FOR PLASMA DISPLAY PANEL 145
METHOD FOR PACKAGING THERMAL INTERFACE MATERIALS 145
THERMAL INTERFACE WITH NON-TACKY SURFACE 146
CARBON FOAM EVAPORATOR 146
DIMENSIONALLY STABLE, LEAK-FREE GRAPHITE SUBSTRATE 146
CARBON FOAM CORE PANELS 146
METHOD AND ARRANGEMENT FOR COOLING A SUBSTRATE, PARTICULARLY A EMICONDUCTOR 147
CARBON FOAM WITH SUPPLEMENTAL MATERIAL 147
HEAT SPREADING CIRCUIT ASSEMBLY 147
LAYOUT OF POWER SEMICONDUCTOR CONTACTS ON A COOLING SURFACE 148
ENHANCED DIRECTIONAL CONDUCTIVITY OF GRAPHITIZABLE FOAM 148
SANDWICHED THERMAL SOLUTION 148
AREA WEIGHT UNIFORMITY FLEXIBLE GRAPHITE SHEET MATERIAL 149
CARBON FOAM STRUCTURAL INSULATED PANEL 149
THERMALLY AND ELECTRICALLY CONDUCTIVE INTERCONNECT STRUCTURES 149
REINFORCED RESIN-DERIVED CARBON FOAM 150
THERMOFORMED PLATFORM 150
HEAT SPREADER FOR DISPLAY PANEL 150
HIGH PURITY NUCLEAR GRAPHITE 151
LOW CTE HIGHLY ISOTROPIC GRAPHITE 151
PATENTS: THERMAL MANAGEMENT SUBSTRATES 151
TABLE 65 TOP U.S. ELECTRONIC THERMAL MANAGEMENT SUBSTRATES PATENT ASSIGNEES, JANUARY 2010 TO
FEBRUARY 2014 152
FIGURE 19 TOP U.S. ELECTRONIC THERMAL MANAGEMENT SUBSTRATES PATENT ASSIGNEES, JANUARY 2010 TO FEBRUARY 2014 153
HEAT SPREADER FOR CENTER GATE MOLDING 154
HEAT SPREADER AS MECHANICAL REINFORCEMENT FOR ULTRA-THIN DIE 154
USER-SERVICEABLE LIQUID DIMM COOLING SYSTEM 154
COOLING MEMORY MODULES USING COLD PLATE BLADES COUPLED TO THE MEMORY MODULES VIA CLIPS 155
THREE-DIMENSIONAL SEMICONDUCTOR ASSEMBLY BOARD
WITH BUMP/FLANGE SUPPORTING BOARD, CORELESS
SEMICONDUCTOR DEVICE WITH HEAT SPREADER 155
BUILD-UP CIRCUITRY AND BUILT-IN ELECTRONIC DEVICE 155
BALL GRID ARRAY PACKAGE WITH IMPROVED THERMAL CHARACTERISTICS 156
ON-CHIP HEAT SPREADER 156
SEMICONDUCTOR PACKAGE WITH THERMAL HEAT
SPREADER 156
ON-CHIP HEAT SPREADER 157
METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A POST/BASE HEAT SPREADER WITH AN ESD PROTECTION LAYER 157
SEMICONDUCTOR CHIP ASSEMBLY WITH BUMP/BASE HEAT SPREADER AND DUAL-ANGLE CAVITY IN BUMP 158
ENHANCED THERMAL MANAGEMENT OF 3-D STACKED DIE PACKAGING 158
HEAT DISSIPATION DEVICE 158
METHOD OF FORMING ELECTRONIC PACKAGE HAVING FLUID-CONDUCTING CHANNEL 159
SEMICONDUCTOR DEVICE THERMAL CONNECTION 159
BALL GRID ARRAY PACKAGE STACKING SYSTEM 160
BALL GRID ARRAY PACKAGE SYSTEM 160
DIE-UP BALL GRID ARRAY PACKAGE WITH DIE-ATTACHED HEAT SPREADER 160
PACKAGING OF INTEGRATED CIRCUITS WITH CARBON NANOTUBE ARRAYS TO ENHANCE HEAT DISSIPATION THROUGH A THERMAL INTERFACE 161
SILICON CARBIDE SEMICONDUCTOR DEVICE HAVING JUNCTION FIELD EFFECT TRANSISTOR AND METHOD FOR MANUFACTURING THE SAME 161
METHOD OF MANUFACTURING SILICON CARBIDE
SEMICONDUCTOR DEVICE 162
METHOD OF MANUFACTURING SILICON CARBIDE
SEMICONDUCTOR DEVICE 162
APPENDIX I - PROFILES OF COMPANIES PRODUCING AND SUPPLYING ELECTRONIC THERMAL MANAGEMENT HARDWARE 163
AAVID THERMAL TECHNOLOGIES 163
ADDA-TAIWAN 163
WAKEFIELD-VETTE 177
XCELAERO CORPORATION 178
APPENDIX II - PROFILES OF COMPANIES PRODUCING AND SUPPLYING ELECTRONIC THERMAL MANAGEMENT SOFTWARES 179
AAVID DESIGN 179
ADVANCED THERMAL SOLUTIONS, INC. 180
SYNOPSYS, INC. 185
THERMACORE, INC. 185
APPENDIX III - PROFILES OF COMPANIES PRODUCING AND SUPPLYING ELECTRONIC THERMAL MANAGEMENT INTERFACE MATERIALS 187
3M 187
AOS THERMAL COMPOUNDS 187
T-GLOBAL THERMAL TECHNOLOGY CO., LTD. 199
WAKEFIELD-VETTE, INC. 199
APPENDIX IV - PROFILES OF COMPANIES PRODUCING AND SUPPLYING ELECTRONIC THERMAL MANAGEMENT SUBSTRATES 200
AMKOR ELECTRONICS, INC. 200
ASAT 200
SUMITOMO ELECTRIC U.S.A., INC. 205
VISHAY SILICONIX 206

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“The printed electronics market growth driven by the growth of Internet of Things and various advantages” The printed electronics market was valued at USD 3.13 billion in 2015 and is expected to reach ...

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Automatic Power Factor Controller Market by Type, Component, Industry and Geography - Global Forecast to 2022

  • $ 5650
  • Industry report
  • September 2016
  • by MarketsandMarkets

“The APFC market to grow at a CAGR of 4.6% between 2016 and 2022” The global APFC market is estimated to be worth USD 4.78 billion by 2022, growing at a CAGR of 4.6% between 2016 and 2022. A key driving ...

Medical Electronics Market by Component, Application, Product, and by Geography - Global Forecast to 2022

Medical Electronics Market by Component, Application, Product, and by Geography - Global Forecast to 2022

  • $ 5650
  • Industry report
  • September 2016
  • by MarketsandMarkets

“The global medical electronics market to grow at a high rate” The global medical electronics market is expected to reach USD 4.41 billion by 2022, growing at a CAGR of 5.4% between 2016 and 2022. ...


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