Global and China Advanced Packaging Industry Report, 2012-2013

  • May 2013
  • -
  • Research In China
  • -
  • 160 pages

In 2012, global semiconductor sales fell 2.7%; semiconductor equipment spending dropped by 15% to US$36.9 billion from US$43.5 billion in 2011. The semiconductor market in 2013 is also not optimistic, accompanied by recession of the world’s emerging economies and Europe’s sluggish recovery. U.S. and Japanese markets are relatively better, while China, as the world’s largest semiconductor market, has witnessed lower-than-expected economic growth, the global economy is yet to show signs of recovery.

In spite of the overall decline in semiconductor industry, the foundry field still grows. In 2012, the global semiconductor foundry market reached total value of US$34.6 billion, an increase of 6.5% over 2011. With the growth slowdown of smart phones and tablet PCs, it is expected that the foundry market in 2013 will increase by just 1.6% to exceed about US$35.2 billion.

With foundries as main customers, advanced packaging vendors were therefore essentially flat or slightly enhanced in 2012, the same expected in 2013. The fall in price of gold, the indispensable raw material for advanced packaging vendors, especially LCD Driver IC packaging companies, will improve the profit margin of advanced packaging vendors in 2013.

Vendors located in Malaysia and Singapore all showed decline, on account of the decreasing revenue of foundries in this region. Taiwanese peers saw moderate growth except memory package, chiefly benefiting from the strong drive of TSMC and UMC. South Korean companies were boosted by Samsung.

Among Japanese companies, J-devices experienced the highest growth, mainly owing to the back-end packaging business purchased from Fujitsu. In January, 2013, Japan’s largest semiconductor vendor – Renesas also sold three back-end packaging factories to J-devices, which would usher in amazing growth in the coming year, with expected annual revenue in FY2013 and FY2017 outnumbering JPY100 billion and JPY250 billion, respectively.

Taiwan-based Chipbond, the world’s largest LCD Driver IC packaging vendor, will be another eye-catching performer in 2013. The significantly enhanced screen resolution of mobile phone and tablet PC will greatly raise Chipbond’s earnings, and the decline in gold prices makes it the biggest beneficiary. In order to further improve the industrial chain layout, Chipbond acquired the COF substrate vendor - SIMPAL Electronics on May 2, 2013.

In addition, Chipbond is the advanced packaging vendor with the highest operating margin, i.e. 16.7% in 2011 and 21.9% in 2012, but also the unique one with operating margin growth. ASE closely followed in terms of operating margin, who benefitted from its large customer TSMC that produced the world’s state-of-the-art IC.

Chinese Mainland counterparts performed poorly, although JECT’s revenue saw substantial growth, yet its operating margin fell sharply from 1.8% in 2011 to 0.2% in 2012, slipping to the edge of loss.

Global and China Advanced Packaging Industry Report, 2012-2013 covers the followings:
1. Global Semiconductor Industry Overview;
2. IC Manufacturing Industry Overview;
3. IC Downstream Industry Market Overview;
4. Advanced Packaging Industry and Market;
5. 23 Advanced Packaging Vendors

Table Of Contents

Table of Contents

1. Global Semiconductor Industry
1.1 Overview
1.2 China IC Market

2. Semiconductor Industry Pattern
2.1 Analog Semiconductor
2.2 MCU
2.3 DRAM Industry
2.3.1 Status Quo
2.3.2 Market Share of DRAM Vendors
2.3.3 Market Share of Mobile DRAM Vendors
2.4 NAND Flash
2.5 Compound Semiconductor Industry

3. IC Manufacturing
3.1 Overview
3.2 Foundry
3.3 MEMS Foundry
3.4 China Foundry Industry
3.5 Foundry Market
3.5.1 Global Mobile Phone Market Size
3.5.2 Market Share of Mobile Phone Brands
3.5.3 Smartphone Market and Industry
3.5.4 PC Market
3.6 IC Manufacturing and Packaging and Testing Equipment Market
3.7 Semiconductor Materials Market

4. Packaging and Testing Market and Industry
4.1 Market Size
4.2 Industry Pattern
4.3 WLCSP Market
4.4 TSV Packaging
4.5 FLIP-CHIP
4.6 Semiconductor Testing
4.7 Global Vendor Ranking

5. Packaging and Testing Vendors
5.1 ASE
5.2 Amkor
5.3 SPIL
5.4 STATS ChipPAC
5.5 PTI
5.6 Greatek
5.7 ChipMOS
5.8 KYEC
5.9 Unisem
5.10 FATC
5.11 JECT
5.12 UTAC
5.13 Lingsen Precision
5.14 Nantong Fujitsu Microelectronics
5.15 Walton Advanced Engineering
5.16 Chipbond
5.17 J-DEVICES
5.18 MPI
5.19 STS Semiconductor
5.20 Signetics
5.21 Hana Micron
5.22 Nepes
5.23 Tian Shui Hua Tian Technology



Selected Charts

Global IC Market Size, 1989-2016
Global Semiconductor ASP, Q4 1990-Q2 2013
Semiconductor Book-to-Bill Ratio, Jan. 2011-Mar. 2013
Global Wafer Capacity Change, 1994-2012
Ranking of the World’s Top 25 Semiconductor Vendors by Sales, 2011
Ranking of the World’s Top 25 Semiconductor Vendors by Sales, 2012
Market Share of Leading Analog Semiconductor Vendors, 2011
Market Share of Catalog Analog Semiconductor Vendors, 2011
Ranking of Top 10 Analog Semiconductor Vendors, 2011
Ranking of MCU Vendors, 2011
Global DRAM and NAND Market Size, 2008-2016E
CAPEX of DRAM Industry, 2000-2013
Global DRAM Shipments, 2000-2013
DRAM Contract Price Change, Jul. 2012-Mar. 2013
DRAM Supply and Demand, Q1 2010-Q4 2014
PC DRAM Supply and Demand, Q1 2010-Q4 2014
DRAM Downstream Market Distribution, 2009-2014
Demand for System Memory, 2001-2013
Ranking of Branded DRAM Vendors by Revenue, Q4 2011
Ranking of Branded DRAM Vendors by Revenue, Q4 2012
Mobile DRAM Market Share, 2009-2011
Mobile DRAM Market Share, 2012
Market Share of Branded NAND Flash Vendors, 2012
NAND Downstream Market Distribution, 2009-2014
GaAs Industry Chain
Main Vendors in GaAs Industry Chain
Ranking of Global GaAs Vendors by Revenue, 2011-2012
Global Installed Fab Capacity by Minimum Geometry, Dec. 2012
Global Installed Fab Capacity by Product Type, Dec. 2012
Global 12-Inch Wafer Capacity, 2011
Global 12-Inch Wafer Capacity, 2013
Global 12-Inch Fab Capacity by Region, 1999-2012
Fab Expenditure by Product, Q4 2011-Q4 2012
Global Installed Wafer Capacity by Product, Q1 2010-Q4 2013
Global Wafer Equipment Spending by Region, 2010-2012
Ranking of World Foundries by Sales, 2005-2012
Operating Margin of the World’s Leading Foundries, 2005-2012
Ranking of the World’s Top 30 MEMS Vendors by Revenue, 2011
Ranking of the World’s Top 20 MEMS Foundries, 2012
China Foundry Sales, 2011
Ranking of the World’s Top 25 IC Design Companies, 2011
Average IC Cost per Phone, 2008-2016
Global Mobile Phone Shipments, 2007-2014
Global CDMA/WCDMA Mobile Phone Shipments by Region, 2010-2013
Quarterly Shipments of the World’s Top Mobile Phone Brands, 2010-2011
Shipments of the World’s Leading Mobile Phone Vendors, 2011-2012
Global Smartphone Operating System Distribution, Q4 2012
Shipments of China’s Leading Smartphone Vendors, 2011-2012
Global PC CPU/GPU Shipments, 2008-2013
Output of Leading Tablet PC Vendors, 2012 vs. 2013
Southeast Asia Fab Equipment Spending by Product Type, 2012-2014
Southeast Asia Capacity by Product, 2011-2014
Global Wafer Equipment Investment Scale, 2007-2016
Global WLP Equipment Spending, 2011-2016
Global Die Packaging Equipment Spending, 2011-2016
Global Automated Testing Equipment Spending, 2011-2016
CAPEX of the World’s Top 10 Semiconductor Vendors, 2011-2012
CAPEX of the World’s Top 10 Semiconductor Vendors, 2013
Global Semiconductor Materials Market by Region, 2010-2013
Global Semiconductor Back-end Equipment Spending by Region, 2010-2012
OSAT Market Size, 2006-2014
Distribution of Global IC Package Type Shipments, 2007
Distribution of Global IC Package Type Shipments, 2010
Distribution of Global IC Package Type Shipments, 2012
Distribution of Global IC Package Type Shipments, 2016
Global Packaging and Testing Market by Technology, 2007 vs. 2011 vs. 2015
Global OSAT Output Value by Region, 2012
Global OSAT Output Value by Region, 2014
Revenue of Taiwan Packaging and Testing Industry, 2007-2011
WLCSP Market Size, 2010-2016
WLCSP Shipments by Application, 2010-2016
Mobile Phone CPU/GPU Package Roadmap
FC Packaging Downstream Market Distribution, 2012
FC-BGA Technology Trends, 2002-2019
Revenue and Operating Margin of the World’s Top 24 Packaging and Testing Vendors, 2008-2012
Organizational Structure of ASE
Revenue and Gross Margin of ASE, 2005-2013
Revenue of ASE by Business, 2010-2012
Copper Wire Bonding Revenue of ASE, Q1 2010-Q4 2011
Copper Wire Bonding Conversion Rate of ASE, Q1 2010-Q4 2011
Copper Wire Bonding Revenue of ASE by Region, Q1 2010-Q4 2011
Copper Wire Bonding Revenue of ASE by Client, Q1 2010-Q4 2011
Revenue and Gross Margin of ASE Packaging, Q1 2010-Q1 2013
Revenue of ASE Packaging by Type, Q1 2011-Q1 2013
Revenue and Gross Margin of ASE Tests, Q1 2010-Q1 2013
Revenue of ASE Tests by Business, Q1 2010-Q1 2012
Revenue, Gross Margin and Operating Margin of ASE Material, Q1 2010-Q1 2013
CAPEX and EBITDA of ASE, Q1 2010-Q1 2013
ASE’s Top 10 Clients, Q1 2012
Revenue of ASE by Application, Q1 2013
ASE Presence in China
Package Type of ASE Shanghai
Revenue of ASE Shanghai, 2004-2011
Revenue, Gross Margin and Operating Margin of Amkor, 2005-2011
Revenue of Amkor by Package Type, 2007-2012
Revenue of Amkor by Package Type, Q4 2008-Q4 2012
Shipments of Amkor by Package Type, Q4 2008-Q4 2012
CSP Revenue of Amkor by Application, 2011
BGA Package Revenue of Amkor by Application, 2011
Leadframe Package Revenue of Amkor by Application, Q3 2011
Revenue and Shipments of Amkor by Region, Q3 2011
Revenue and Shipments of Amkor by Region, 2012
Capacity Utilization of Amkor’s Packaging Business, Q1 2008-Q1 2013
Revenue of Amkor by Application, Q1 2011-Q1 2013
Cost Structure of Amkor, 2011-2012
Organizational Structure of SPIL
Revenue, Gross Margin and Operating Margin of SPIL, 2003-2013
Monthly Revenue and Growth of SPIL, Mar. 2011-Mar. 2013
Revenue of SPIL by Region, 2005-Q4 2012
Revenue of SPIL by Application, 2005-Q4 2012
Revenue of SPIL by Business, 2005-Q4 2012
Capacity of SPIL, Q1 2006 vs. Q2-Q3 2007 vs. Q3-Q4 2011
Copper/Ag Alloy Revenue Quarterly, Q3 2011-Q4 2012
Revenue and Gross Margin of STATS ChipPAC, 2004-2013
Revenue of STATS ChipPAC by Package Type, 2006-Q1 2012
Revenue of STATS ChipPAC by Application, 2006-Q1 2013
Revenue of STATS ChipPAC by Region, 2006-2013
Revenue and Operating Margin of PTI, 2006-2013
Monthly Revenue and Growth Rate of PTI, Mar. 2011-Mar. 2013
PTI Factories
TSV Solutions of PTI
Revenue of PTI by Business, Q4 2012
Revenue of PTI by Product, Q4 2012
Revenue, Gross Margin and Operating Margin of Greatek, 2005-2013
Revenue of Greatek by Technological Type, 2007-2010
Monthly Revenue and Growth Rate of Greatek, Mar. 2011-Mar. 2013
Revenue and Gross Margin of ChipMOS, 2003-2013
Revenue of ChipMOS by Business, 2010-2012
Revenue of ChipMOS by Product, 2010-2012
Utilization Rate and EBITDA Margin of ChipMOS, 2009-2012
Cash Flow and CAPEX of ChipMOS, 2009-2012
Revenue of ChipMOS by Client, 2011
Revenue of ChipMOS by Region, 2006-2011
Revenue and Gross Margin of KYEC, 2002-2013
Monthly Revenue of KYEC, Mar. 2011-Mar. 2013
KYEC Plants
KYEC Testing Platforms
Revenue and EBITDA of Unisem, 2006-2013
Revenue and EBITDA of Unisem, Q1 2010-Q4 2012
Revenue of Unisem by Product, 2012
Revenue of Unisem by Market, 2012
Organizational Structure of Formosa Plastics Group
Organizational Structure of FATC
Revenue and Operating Margin of FATC, 2006-2013
Monthly Revenue of FATC, Mar. 2011-Mar. 2012
Revenue and Operating Margin of JECT, 2006-2013
Output and Sales Volume of JECT, 2011-2012
Testing Cost Structure of JECT, 2011-2012
Package Cost Structure of JECT, 2011-2012
JCET ROADMAP
Revenue of JCET by Region, 2011
Revenue and Operating Margin of LINGSEN, 2007-2013
Monthly Revenue of LINGSEN, Mar. 2011-Mar. 2013
Revenue and Growth Rate of Nantong Fujitsu Microelectronics, 2006-2011
Net Income and Growth Rate of Nantong Fujitsu Microelectronics, 2006-2011
Quarterly Revenue and Growth Rate of Nantong Fujitsu Microelectronics, 2006-2011
Quarterly Net Income and Growth Rate of Nantong Fujitsu Microelectronics, 2006-2011
Quarterly Gross Margin of Nantong Fujitsu Microelectronics, 2006-2011
Quarterly A, S, RandD of Nantong Fujitsu Microelectronics, 2006-2011
Revenue and Operating Margin of Walton Advanced Engineering, 2007-2013
Monthly Revenue and Growth Rate of Walton Advanced Engineering, Mar. 2011-Mar. 2013
Revenue and Operating Margin of Chipbond, 2006-2013
Monthly Revenue and Growth Rate of Chipbond, Mar. 2011-Mar. 2013
Revenue of Chipbond by Business, 2012
Revenue of Chipbond by Product, Q4 2009-Q1 2012
Revenue of Chipbond by Market, 2012
Organizational Structure of J-DEVICES
Revenue and PBT of MPI, FY2007-FY2013
Revenue of MPI by Region
Revenue of Carsem by Product, Q1 2011-Q1 2012
Organizational Structure of STS Semiconductor
Revenue and Operating Margin of STS Semiconductor, 2006-2013
Revenue of STS Semiconductor by Product, Q1 2012-Q4 2013
Shareholder Structure of Signetics
Revenue and Operating Margin of Signetics, 2007-2013
Capacity Utilization and Operating Margin of Signetics, Q1 2010-Q4 2012
Revenue of Signetics by Product, 2011
Revenue of Signetics by Client, 2011
Revenue of Signetics by Technology, Q1 2012-Q4 2013
Revenue and Operating Margin of Hana Micron, 2006-2013
Revenue of Hana Micron by Client, 2011
Revenue of Hana Micron by Market, Q1 2012-Q4 2013
Revenue and Operating Margin of Nepes, 2007-2013
Quarterly Revenue and Operating Margin of Nepes, 2012-2013
Quarterly Revenue of Nepes by Division, 2012-2013
Revenue and Operating Margin of Tian Shui Hua Tian Technology, 2006-2013

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