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IC Packaging Market in Taiwan 2015-2019

  • July 2015
  • -
  • Infiniti Research Limited
  • -
  • 63 pages

About IC Packaging
ICs manufactured in the global semiconductor industry are delicate and vulnerable to contamination. To eliminate such eventualities, silicon chips or ICs are protected using packaging materials. Wafer-level packaging is one such packaging that involves the packaging of individual ICs using best-fit packaging processes during the semiconductor production process.
Technavio's analysts forecast the IC packaging market in Taiwan to grow at a CAGR of 2.5% over the period 2014-2019.

Covered in this Report
This report covers the present and future scenarios of the IC packaging market in Taiwan for the period 2015-2019. Technavio uses 2014 as the base year and provides data for the 12 trailing months. To calculate market size, analysts considered the revenue generated by IC packaging vendors in Taiwan. The ICs from both domestic semiconductor and global semiconductor packaging companies were considered for calculating the market size.
However, the following were not considered while calculating market size:
- Revenue from testing services
- Sales of semiconductor IC packaging equipment
- Sales of packaging materials
Technavio's report, IC Packaging Market in Taiwan 2015-2019, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the landscape of the IC packaging market in Taiwan and its growth prospects in the coming years. The report includes a discussion on the key vendors operating in this market.
Key Vendors
- Advanced Semiconductor Engineering
- Powertech Technology
- Siliconware Precision Industries
Other Prominent Vendors

- Amkor Technology
- ChipMOS Technologies
- Greatek Electronics
- King Yuan ELECTRONICS
- Orient Semiconductor Electronics
- STATS ChipPAC
- UTAC


Market Driver
- Rise in Demand for Smartphones and Tablets
- For a full, detailed list, view our report
Market Challenge
- Need for High Capital Investment
- For a full, detailed list, view our report
Market Trend
- Short Replacement Cycle of Portable Electronic Devices
- For a full, detailed list, view our report

Key Questions Answered in this Report
- What will the market size be in 2019 and what will the growth rate be?
- What are the key market trends?
- What is driving this market?
- What are the challenges to market growth?
- Who are the key vendors in this market space?
- What are the market opportunities and threats faced by the key vendors?
- What are the strengths and weaknesses of the key vendors?

Table Of Contents

IC Packaging Market in Taiwan 2015-2019
01. Executive Summary
02. List of Abbreviations
03. Scope of the Report
03.1 Market Overview
03.2 Product Offerings
04. Market Research Methodology
04.1 Market Research Process
04.2 Research Methodology
05. Introduction
06. Country Overview
07. Industry Overview
07.1 Semiconductor Industry Overview
07.1.1 Semiconductor Value Chain
07.2 Structure of Semiconductor Market
07.3 Global Semiconductor Market Overview
08. Market Landscape
08.1 Market Overview
08.2 Market Size and Forecast
08.3 End-user Segmentation
08.3.1 Communications Segment
08.3.2 Consumer Electronics Segment
08.3.3 Computer Segment
08.4 Five Forces Analysis
09. Buying Criteria
10. Market Growth Drivers
11. Drivers and their Impact
12. Market Challenges
13. Impact of Drivers and Challenges
14. Market Trends
15. Trends and their Impact
16. Vendor Landscape
16.1 Competitive Scenario
16.2
Key Vendors
16.2.1 Advanced Semiconductor Engineering
16.2.2 Silicon Precision Industries
16.2.3 Powertech Technology
16.3 Other Prominent Vendors
16.3.1 Amkor Technology
16.3.2 ChipMOS Technologies
16.3.3 Greatek Electronics
16.3.4 King Yuan ELECTRONICS
16.3.5 Orient Semiconductor Electronics
16.3.6 STATS ChipPAC
16.3.7 UTAC
17. Key Vendor Analysis
17.1 Advanced Semiconductor Engineering
17.1.1 Key Facts
17.1.2 Business Overview
17.1.3 Business Segmentation by Revenue 2013
17.1.4 Business Segmentation by Revenue 2012 and 2013
17.1.5 Geographical Segmentation by Revenue 2013
17.1.6 Business Strategy
17.1.7 Recent Developments
17.1.8 SWOT Analysis
17.2 SPIL
17.2.1 Key Facts
17.2.2 Business Overview
17.2.3 Business Segmentation by Revenue 2013
17.2.4 Business Segmentation by Revenue 2012 and 2013
17.2.5 Geographical Segmentation by Revenue 2013
17.2.6 Business Strategy
17.2.7 Recent Developments
17.2.8 SWOT Analysis
17.3 Powertech Technology
17.3.1 Key Facts
17.3.2 Business Overview
17.3.3 Business Strategy
17.3.4 SWOT Analysis
18. Other Reports in this Series


List of Exhibits
Exhibit 1: Market Research Methodology
Exhibit 2: Workflow: Semiconductor IC Production and Packaging
Exhibit 3: GDP Composition of Taiwan by Sector of Origin 2014
Exhibit 4: GDP Composition of Taiwan by End-user 2014
Exhibit 5: Semiconductor Value Chain
Exhibit 6: Front-end Processes
Exhibit 7: Back-end Processes
Exhibit 8: Structure of Semiconductor Market
Exhibit 9: Global Semiconductor Market
Exhibit 10: Global SATS Market Segmentation 2014
Exhibit 11: IC Packaging Market in Taiwan 2014-2019 ($ billions)
Exhibit 12: IC Packaging Market in Taiwan by End-user Applications 2014
Exhibit 13: Buying Criteria for Communications Segment
Exhibit 14: Buying Criteria for Consumer Electronics Segment
Exhibit 15: Buying Criteria for Computer Segment
Exhibit 16: Buying Criteria for Others
Exhibit 17: Vendor Ranking of IC Packaging Market in Taiwan
Exhibit 18: Advanced Semiconductor Engineering: Business Segmentation by Revenue 2013
Exhibit 19: Advanced Semiconductor Engineering: Business Segmentation by Revenue 2012 and 2013 (US$ million)
Exhibit 20: Advanced Semiconductor Engineering: Geographical Segmentation by Revenue 2013
Exhibit 21: SPIL: Business Segmentation by Revenue 2013
Exhibit 22: SPIL: Business Segmentation by Revenue 2012 and 2013 (US$ million)
Exhibit 23: SPIL: Geographical Segmentation by Revenue 2013

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