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Global Die-level Packaging Equipment Market 2015-2019

  • July 2015
  • -
  • Infiniti Research Limited
  • -
  • 63 pages

About Die-level Packaging
ICs manufactured in the global semiconductor industry are delicate, and thus vulnerable to contamination causing malfunction. To prevent from such malfunctions, silicon chips or ICs are protected using packaging materials. Wafer-level packaging and die-level packaging are the most predominant packaging types. Wafer-level packaging involves the packaging of individual ICs through the best-fit packaging processes conducted in wafer-level manufacturing during the semiconductor production process, while die-level packaging involves packaging of each dice and not the wafer as a whole.
Technavio's analysts forecast the global die-level packaging equipment market to grow at a CAGR of 1.24% during 2014-2019.

Covered in this Report
This report covers the present scenario and growth prospects of the global die-level packaging equipment market for 2015-2019. To calculate the market size, the report considers revenue generated from the sales of die-level packaging equipment worldwide. However, the report does not consider the following while calculating the market size:
- Support or maintenance services offered for/with die-level packaging equipment
- Components used in the production of die-level packaging equipment
- Aftermarket sales of die-level packaging equipment
Technavio's report, Global Die-level Packaging Equipment Market 2015-2019, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects in the coming years. The report includes a discussion of the key vendors operating in this market.

Key Regions
- Americas
- APAC
- EMEA
Key Vendors
- ASM International
- BE Semiconductor Industries
- DISCO
- Kulicke & Soffa Industries
Other Prominent Vendors

- Advantest
- Cohu
- Hitachi High-Technologies
- Shinkawa
- TOWA


Market Driver
- Rise in Demand for Smartphones and Tablets
- For a full, detailed list, view our report
Market Challenge
- Rapid Changes in Technology
- For a full, detailed list, view our report
Market Trend
- Short Replacement Cycle of Portable Electronic Devices
- For a full, detailed list, view our report

Key Questions Answered in this Report
- What will the market size be in 2019 and what will the growth rate be?
- What are the key market trends?
- What is driving this market?
- What are the challenges to market growth?
- Who are the key vendors in this market space?
- What are the market opportunities and threats faced by the key vendors?
- What are the strengths and weaknesses of the key vendors?

Table Of Contents

Global Die-level Packaging Equipment Market 2015-2019
01. Executive Summary
02. List of Abbreviations
03. Scope of the Report
03.1 Market Overview
03.2 Product Offerings
04. Market Research Methodology
04.1 Market Research Process
04.2 Research Methodology
05. Introduction
06. Industry Overview
06.1 Semiconductor Industry Overview
06.1.1 Semiconductor Value Chain
06.2 Global Semiconductor Market
07. Market Landscape
07.1 Market Overview
07.2 Factors Influencing Demand for Semiconductors
07.3 Market Size and Forecast
07.4 Five Forces Analysis
08. Geographical Segmentation
08.1 Global Die-level Packaging Equipment Market by Geography 2014-2019
08.2 Global Die-level Packaging Equipment Market by Geography 2014-2019
08.3 Die-level Packaging Equipment Market in APAC
08.3.1 Market Size and Forecast
08.4 Die-level Packaging Equipment Market in Americas
08.4.1 Market Size and Forecast
08.5 Die-level Packaging Equipment Market in EMEA
08.5.1 Market Size and Forecast
09. Buying Criteria
10. Market Growth Drivers
11. Drivers and Their Impact
12. Market Challenges
13. Impact of Drivers and Challenges
14. Market Trends
15. Trends and Their Impact
16. Vendor Landscape
16.1 Competitive Scenario
16.2
Key Vendors
16.2.1 ASM International
16.2.2 BE Semiconductor Industries (Besi)
16.2.3 DISCO
16.2.4 Kulicke and Soffa Industries
16.3 Other Prominent Vendors
16.3.1 Cohu
16.3.2 TOWA
16.3.3 Shinkawa
16.3.4 Advantest
16.3.5 Hitachi High-Technologies
17. Key Vendor Analysis
17.1 ASM International
17.1.1 Key Facts
17.1.2 Business Overview
17.1.3 Product Portfolio
17.1.4 Geographical Segmentation by Revenue 2013
17.1.5 Business Strategy
17.1.6 SWOT Analysis
17.2 Besi
17.2.1 Key facts
17.2.2 Business overview
17.2.3 Geographical segmentation by revenue 2014
17.2.4 Recent developments
17.2.5 SWOT analysis
17.3 DISCO
17.3.1 Key Facts
17.3.2 Business Overview
17.3.3 Business Segmentation by Revenue 2014
17.3.4 Geographical Segmentation by Revenue 2014
17.3.5 SWOT Analysis
17.4 Kulicke and Soffa
17.4.1 Key Facts
17.4.2 Business Overview
17.4.3 Business Segmentation by Revenue 2014
17.4.4 Business Segmentation by Revenue 2013 and 2014
17.4.5 Geographical Segmentation by Revenue 2014
17.4.6 Business Strategy
17.4.7 Recent Developments
17.4.8 SWOT Analysis
18. Other Reports in this Series


List of Exhibits
Exhibit 1: Market Research Methodology
Exhibit 2: Workflow of Semiconductor IC Production and Packaging
Exhibit 3: Semiconductor Value Chain
Exhibit 4: Global Semiconductor Market
Exhibit 5: Global Die-level Packaging Equipment Market 2014-2019 ($ billions)
Exhibit 6: Global Die-level Packaging Equipment Market by Geography 2014
Exhibit 7: Global Die-level Packaging Equipment Market by Geography 2014-2019 (percentage share)
Exhibit 8: Global Die-level Packaging Equipment Market by Geography 2014-2019 ($ millions)
Exhibit 9: ASM International: Product Portfolio
Exhibit 10: ASM International: Geographical Segmentation by Revenue 2013
Exhibit 11: Besi: Geographical segmentation by revenue 2014
Exhibit 12: DISCO: Business Segmentation by Revenue 2014
Exhibit 13: DISCO: Geographical Segmentation by Revenue 2014
Exhibit 14: Kulicke and Soffa: Business Segmentation by Revenue 2014
Exhibit 15: Kulicke and Soffa: Business Segmentation by Revenue 2013 and 2014 ($ millions)
Exhibit 16: Kulicke and Soffa: Geographical Segmentation by Revenue 2014

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