Table of Contents
Chemical mechanical planarization (CMP) is an enabling technology in the wafer fabrication of integrated circuits and has been widely used in the wafer manufacturing process in different electronic devices such as semiconductors, optoelectronics, and optics for reducing chip size & improving performance. Continuous research & development efforts and associated technological breakthroughs in the area of cost-effective production & processing have fueled its market growth in the last decade and growth is expected to continue in the near future. The global CMP market was valued at USD 3.32 billion in 2014 and is expected reach USD 4.94 billion by 2020, at a CAGR of 6.83% from 2015 to 2020. Growing need of CMP for wafer planarization, high demand for consumer electronic products, and increasing use of micro-electro-mechanical systems (MEMS) are expected to drive the growth of the CMP market during the forecast period. The global CMP market is quite competitive, with the presence of prominent CMP equipment manufacturers and consumable suppliers. The major CMP equipment manufacturer are Applied Materials, Inc. (U.S.), Ebara Corporation (Japan), Strasbaugh Inc. (U.S.), Lam Research Corporation(U.S.), and Lapmaster Wolters GmbH(Germany),while some of the key CMP consumable suppliers are Cabot Microelectronics Corporation (U.S.), Fujimi Incorporated (Japan), Dow Electronic Materials (U.S.), Hitachi Chemical Company, Ltd. (Japan), and Air Products & Chemicals, Inc. (U.S.).
This market research study provides detailed qualitative and quantitative analysis of the global chemical mechanical planarization market and would also help buyers to get key insights about the CMP market. It provides a comprehensive review of major market drivers, restraints, opportunities, challenges, and key issues in the market. The CMP market is further segmented and forecast for major geographic regions such as North America, Europe, Asia-Pacific, and Rest of the World. Major countries with the market revenues are covered for each of the region. Competitive scenario and market share of the top players in the market has been discussed in detail. The top players of the industry are profiled in detail with their recent developments and other strategic industry activities.
Scope of the report
This research report categorizes the global chemical mechanical planarization market, based on type, technology, application, and geography; it also covers the market size forecast and analyzing trends in each of the submarkets.
On the Basis of Type:
The global chemical mechanical planarization market has been subsegmented into CMP consumable & CMP equipment market. The CMP consumable market is further classified into slurry, pad, pad conditioner, and others.
On the Basis of Technology:
The chemical mechanical planarization market segmented on the basis of technology is split into three different types such as leading edge, more than Moore’s, and emerging on the basis of wafer size, processing nodes, and type of material used for the CMP process.
On the Basis of Application:
The chemical mechanical planarization market segmented on the basis of application is classified into different applications such as IC manufacturing, MEMS & NEMS, and optics among others.
On the Basis of Geography:
The regions considered in the report include the North America, Europe, APAC, and Rest of the World. This segmentation helps to analyze the global scenario for the CMP market by various regions.
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