1. Market Research
  2. > Manufacturing
  3. > Electronics Manufacturing Market Trends
  4. > Global and China Automotive PCB Industry Report, 2014-2015

Global and China Automotive PCB Industry Report, 2014-2015

  • October 2015
  • -
  • Research In China
  • -
  • 115 pages

Summary

Table of Contents

Global and China Automotive PCB Industry Report, 2014-2015 highlights the followings:
1. Global and China’s automobile market and industry
2. Downstream market of automotive PCB
3. Automotive PCB Industry and Market
4. 19 Automotive PCB companies

Global automotive PCB market size was around USD4.96 billion in 2014, and is expected to grow by 6.5% to USD5.28 billion in 2015, compared with an overall global PCB market scale of roughly USD59.6 billion in 2014 and an estimated growth of 0.8% in 2015. Automotive PCB is the fastest-growing field in PCB industry, and will sustain the momentum until at least 2019.

In automotive PCB field, powertrain holds the largest proportion, about 32% for the time being, including mainly Engine Control Unit, Starter, Alternator, Transmission Control, Fuel Injection, and Power Steering. For xEV, complexity, high voltage, high current and high temperature of Inverter and Converter pose extremely high requirements on PCB. Powertrain seizes over 50%, followed by Body with about 25% (primarily Lighting, HVAC, Power Door & Seat, Keyless, and TPMS). LED lighting, which enjoys a high share, is highly demanding on PCB, usually adopting MCPCB (Metal Core PCB). Thirdly, Safety systems, consisting mainly of ADAS, ABS, and Airbag, make up about 22%. The last is Cockpit systems, mainly covering Instrument Display and Infotainment.

Automotive PCB has exceedingly high requirement on reliability, creating the biggest threshold. Recall system in automobile industry requires makers to take risks of faulty products. As small makers cannot afford this, they are usually ruled out. Challenges for automotive PCB include reliability, high temperature, high frequency, and high current.

PCBs in automotive engine and gearbox need to withstand high temperature above 150?, so ceramic substrates must be used, for ceramic multi-layer substrate contains mainly alumina (Al2O3) and aluminum nitride (AlN). High temperature co-fired ceramic (HTCC) PCB is usually sintered at temperature of over 1600?, and the conductor is high-melting point tungsten or molybdenum, which can be sintered together at the same time. Japanese Murata puts forward low temperature co-fired ceramic (LTCC), which finds few applications. Ceramic substrates are mostly supplied by Japanese KYOCERA and U.S. Rogers. PCBs used by European and U.S. carmakers are largely provided by German Schweizer, Duwel, and Wurth, and U.S. TTM. Japanese carmakers are mainly served by CMK and Meiko.

Automotive safety systems, especially ABS, generally adopt MCPCB (Metal Core PCB). Automotive ADAS needs to use a large quantity of radar which finds shipment of 19 million sets in 2014 and is expected to reach 96 million sets in 2020. In this case, high-frequency PCB will be employed. The PCB usually needs PTFE ceramic and can only be done by the companies (mainly from U.S. Europe and Japan) that are very experienced in RF. xEV is developing rapidly, especially after the outbreak of scandal over VW cheating pollution emissions tests.

Supply of cockpit PCBs are almost taken on by Taiwanese companies. HDI may be needed, as Infotainment becomes more complicated and the size of screen larger. Moreover, the number of automotive displays used also increases, like BMW 7 series using up to 7 displays for each vehicle. All these factors fuel a robust market.

Get Industry Insights. Simply.

  • Latest reports & slideshows with insights from top research analysts
  • 60 Million searchable statistics with tables, figures & datasets
  • More than 25,000 trusted sources
Get This Report
24/7 Customer Support

Talk to Ahmad

+1 718 618 4302

Purchase Reports From Reputable Market Research Publishers
E-Scrap and Printed Circuit Board E-Scrap Market - Ferrous Components, Metals, and Precious Metals) - Global Industry Analysis, Size, Share, Growth, Trends and Forecast 2016 - 2026

E-Scrap and Printed Circuit Board E-Scrap Market - Ferrous Components, Metals, and Precious Metals) - Global Industry Analysis, Size, Share, Growth, Trends and Forecast 2016 - 2026

  • $ 5795
  • Industry report
  • January 2017
  • by Transparency Market Research

Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market: Overview This report aims to provide a comprehensive strategic analysis of the global e-scrap and printed circuit board (PCB) e-scrap market ...

Flexible Printed Circuit Board - Global Industry Analysis, Size, Share, Growth, Trends and Forecast 2017 - 2025

Flexible Printed Circuit Board - Global Industry Analysis, Size, Share, Growth, Trends and Forecast 2017 - 2025

  • $ 5795
  • Industry report
  • March 2017
  • by Transparency Market Research

Flexible Printed Circuit Board (FPCB) Market (Type - Single Sided Flex Circuits, Double Sided Flex Circuits, Multi-Layer Flex Circuits, and Rigid Flex Circuits; End User - Instrumentations and Medical, ...

Surface Mount Technology Market by Equipment, Application, and Geography - Global Forecast to 2022

Surface Mount Technology Market by Equipment, Application, and Geography - Global Forecast to 2022

  • $ 5650
  • Industry report
  • March 2017
  • by MarketsandMarkets

“Surface mount technology market expected to exhibit significant growth potential between 2017 and 2022” The surface mount technology (SMT) market is expected to grow at a CAGR of 8.9% between 2017 ...


ref:plp2015

Reportlinker.com © Copyright 2017. All rights reserved.

ReportLinker simplifies how Analysts and Decision Makers get industry data for their business.