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  4. > Radiation Hardened Electronic Devices and Components Market Analysis: By Components (Memory, Microprocessor, FPGAs, Power ICs); By Materials (Silicon Carbide, Gallium Nitride, Hydrogenated Amorphous Silicon); Verticals (Industrial, Consumer Electronics, M

Radiation Hardened Electronic Devices and Components involve production of electronic components by hardening through radiation. Insulating substrates such as SOI (Silicon on Insulators), SOS (Sapphire) are used primarily. The hardened components have a special purpose of withstanding otherwise damaging radiations (radiation immunity) particularly a serious problem in the design of components for artificial satellites, spacecraft, military aircraft, nuclear power stations, and nuclear weapons and other computing devices. The market is affected by the high operating costs and low volume nature of the space market. But defence and aerospace are the main driving force that has been holding the industry from collapsing over the past 10 years.

The market has been segmented by geography as North America, Europe, Asia, and Rest of the World (ROW). Market size and forecast is provided for each of these regions. A detailed qualitative analysis of the factors responsible for driving and restraining growth of the Radiation Hardened components is discussed in the report. Market shares of the key players for 2013 are provided. The prominent players profiled in this report are Honeywell Electronics, BAE Systems, ST Microelectronics and others.

Table Of Contents

Radiation Hardened Electronic Devices and Components Market Analysis: By Components (Memory, Microprocessor, FPGAs, Power ICs); By Materials (Silicon Carbide, Gallium Nitride, Hydrogenated Amorphous Silicon); Verticals (Industrial, Consumer Electronics, M
1 Rad-Hard And Rad-Tol Edc- Market Overview

2 Executive Summary

3 Rad-Hard Edc Market Landscape

3.1 Market Share Analysis

3.2 Comparative Analysis

3.2.1 Product Benchmarking

3.2.2 Patent Analysis

3.2.3 Top 5 Financials Analysis

4 Rad-Hard Edc Market Forces

4.1 Market Drivers

4.1.1 Reliability On Radiation-Hardened And Radiation-Tolerant Components

4.1.2 Demand For Commercial Airplanes On The Rise

4.1.3 Space And Military Budget Cuts Increasing Demand For Higher Rad-Hard And Rad-Tol Components

4.2 Market Constraints

4.2.1 Increasing Liability To Damaging Radiation Effects Due To Decrease In Chip Sizes

4.3 Market Challenges

4.3.1 Increasing Cost Of See Testing Procedure

4.3.2 Inadequate See Testing Procedures

4.3.3 Reconfigurable Electronics On Priority List Of Space Agencies Across The World

4.4 Attractiveness Of Radiation Hardened Edc Industry

4.4.1 Power Of Suppliers

4.4.2 Power Of Customers

4.4.3 Threat Of New Entrants

4.4.4 Threat Of Substitution

4.4.5 Degree Of Competition

5 Rad-Hard Edc Market - Strategic Analysis

5.1 Value Chain Analysis

5.2 Pricing Analysis

5.3 Opportunities Analysis

5.4 Product/Market Life Cycle Analysis

5.5 Suppliers And Distributors

6 Rad Hard Edc Market By Products

6.1 Introduction

6.2 Analog And Mixed Signal/ Digital Electronic Devices

6.2.1 Rad-Hard A/D And D/A Converters

6.2.2 Rad-Hard Multiplexers

6.3 Discrete Semiconductors

6.4 Optoelectronics

6.5 Power Management

6.6 Sensors

6.7 Memory

6.8 Microprocessors And Microcontrollers

6.9 Fpgas

6.10 Asics

6.11 Others

6.11.1 Radiation Hardened Flip Flop

6.11.2 Radiation Hardened Cmos Structure Using An Implanted P Guard Structure

7 Rad Hard Edc Market By Materials

7.1 Silicon

7.2 Silicon Carbide

7.3 Gallium Nitride

7.4 Hydrogenated Amorphous Silicon

8 Rad Hard Edc Market By Product-Type

8.1 Custom-Made

8.2 Commercial-Off-The-Shelf (Cots)

9 Rad Hard Edc Market By Industry Verticals

9.1 Introduction

9.2 Aerospace

9.3 Military

9.4 Space

9.5 Nuclear

9.6 Medical

9.7 Consumer Electronics

9.8 Others

10 Rad Hard Edc Market - Geographic Analysis

10.1 Introduction

10.2 Americas

10.3 Europe

10.4 Apac

10.5 Row

11 Market Entropy

11.1 Introduction

11.1.1 New Product Launches

11.1.2 MandAs, Collaborations, Jvs And Partnerships

12 Company Profiles

12.1 Aeroflex Inc.

12.2 Atmel Corporation

12.3 Bae Systems Plc

12.4 Crane Co.

12.5 Honeywell Aerospace

12.6 International Rectifier Corporation

12.7 Intersil Corporation

12.8 Linear Technology Corporation

12.9 Maxwell Technologies Inc.

12.10 Microsemi Corporation

12.11 Stmicroelectronics Nv

12.12 Texas Instruments Inc.

12.13 Xilinx Inc.

12.14 Micropac Industries Inc.

12.15 Ms Kennedy Corporation

12.16 Peregrine Semiconductor Corp

12.17 Semicoa Corporation

12.18 Teledyne Microelectronic Technologies, Inc.

12.19 3D Plus SA.

12.20 Aitech Defense Systems Inc.

"*Financials would be provided on a best efforts basis for private companies"

13 Appendix

13.1 Abbreviations

13.2 Sources

13.3 Research Methodology

13.4 Expert Insights

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