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Radiation Hardened Electronic Devices and Components Market Analysis: By Components (Memory, Microprocessor, FPGAs, Power ICs); By Materials (Silicon Carbide, Gallium Nitride, Hydrogenated Amorphous Silicon); Verticals (Industrial, Consumer Electronics, M

  • October 2014
  • 142 pages
  • Industry ARC
Report ID: 3493092

Summary

Table of Contents

Radiation Hardened Electronic Devices and Components involve production of electronic components by hardening through radiation. Insulating substrates such as SOI (Silicon on Insulators), SOS (Sapphire) are used primarily. The hardened components have a special purpose of withstanding otherwise damaging radiations (radiation immunity) particularly a serious problem in the design of components for artificial satellites, spacecraft, military aircraft, nuclear power stations, and nuclear weapons and other computing devices. The market is affected by the high operating costs and low volume nature of the space market. But defence and aerospace are the main driving force that has been holding the industry from collapsing over the past 10 years.

The market has been segmented by geography as North America, Europe, Asia, and Rest of the World (ROW). Market size and forecast is provided for each of these regions. A detailed qualitative analysis of the factors responsible for driving and restraining growth of the Radiation Hardened components is discussed in the report. Market shares of the key players for 2013 are provided. The prominent players profiled in this report are Honeywell Electronics, BAE Systems, ST Microelectronics and others.

Please note: this report requires certain updates. We have all the information available but require 2 working days business days to complete the process and ensure it is as up-to-date as possible.


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