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  4. > Sputtering Targets & Evaporation Materials Market Analysis By Sputtering Method (DC, Reactive, RF, Ion assisted, Magnetron and Gas Flow), By Evaporation Method (Thermal, Electron-beam, Vacuum, Reactive and Ion assisted), By Material Type (Pure Metals, All

Sputtering Targets & Evaporation Materials (ST&EM) are target materials which are used to deposit thin film or layer on desired substrate by employing various methods. Basically, sputtering and evaporation are variants of physical vapor deposition (PVD) processes which are used for various commercial and scientific purposes. Sputtering targets and evaporation materials have wide range of applications in semiconductor components, displays, sensors, data storage devices, photovoltaic cells, batteries, industrial tools, optics, automobile mirrors, decorative and many more. Owing to their significant applications in diverse end user industries, sputtering targets and evaporation materials market is set to grow at a considerable pace in the coming years. As per IndustryARC analysis, the global sputtering targets and evaporation materials recorded revenue of $2,820.6m in 2014. For the period of 2015 until 2020, it is estimated to grow at a compounded annual growth rate (CAGR) of 2.2% to reach $3,226.7m by 2020.

ST&EM market is set to experience considerable growth in the coming years, due to constant demand from dedicated end user sectors, especially electronics, energy, industrial, optical and others. APAC region is the major shareholder with more than 45% share in the global ST&EM market, due to the presence of numerous targets and materials providers and end user sectors. In the global ST&EM market, APAC region generated revenue of $1,370.5m in 2014 and is estimated to grow with significant CAGR during the forecast period. North America held the second major share followed by Europe and RoW. Overall, this market will find steady demand from dedicated end used industries.

This market has been segmented into methods of sputtering and evaporation, materials used as targets, application sectors and geography. The geography segmentation includes North America, Europe, APAC and RoW and market revenue is provided with respect to each region. Additionally, detailed qualitative and quantitative analysis of the factors responsible for driving and restraining growth of the ST&EM market along with future opportunities have been analyzed in the market forces chapter.

This report also includes profiles of the major companies such as:
Heraeus Holding,
Umicore Thin Film Products,
Hitachi Metals,
KAMIS Inc.,
The Kurt J.Leskar Company,
ULVAC GmbH and many more.
It is estimated that by 2020, there might not be significant difference in the ST&EM market share with respect to regions. APAC region is projected to hold major share with more than 48% in 2015 and 2020. By 2020, the market share of APAC is estimated to witness slight increase due to the demand from electronics and energy sector. The evolution of substitute technologies such as functional printing and 3D printing will affect the CAGR of ST&EM market in coming years. It is also estimated that North America and Europe will also experience slight decline in terms of ST&EM market share. Overall, sputtering targets and evaporation materials market may witness considerable demand mainly from APAC region.

Table Of Contents

Sputtering Targets and Evaporation Materials Market Analysis By Sputtering Method (DC, Reactive, RF, Ion assisted, Magnetron and Gas Flow), By Evaporation Method (Thermal, Electron-beam, Vacuum, Reactive and Ion assisted), By Material Type (Pure Metals, All
1. Global Sputtering Targets and Evaporation Materials Market Overview

2. Executive Summary

3. Global Sputtering Targets and Evaporation Materials Market Landscape

3.1. Market share Analysis

3.2. Comparative Analysis

3.2.1. Product Benchmarking

3.2.2. End-User Profiling

3.2.3. Patent Analysis

3.2.4. Top 5 Financial Analysis

4. Global Sputtering Targets and Evaporation Materials - Market Forces

4.1. Market Drivers

4.2. Market Constraints

4.3. Market Challenges

4.4. Attractiveness of the Sputtering Targets and Evaporation Materials Industry

4.4.1. Power of Suppliers

4.4.2. Power of Customers

4.4.3. Threat of New entrants

4.4.4. Threat of Substitution

4.4.5. Degree of Competition

5. Global Sputtering Targets and Evaporation Materials Market - Strategic Analysis

5.1. Value Chain Analysis

5.2. Pricing Analysis

5.3. Opportunity Analysis

5.4. Product Life Cycle Analysis

5.5. Suppliers and Distributors

6. Global Sputtering Targets and Evaporation Materials Market - By Sputtering Method

6.1. Introduction

6.2. DC sputtering

6.3. Reactive sputtering

6.4. RF sputtering

6.5. Ion assisted sputtering

6.6. Magnetron sputtering

6.7. Gas flow sputtering

7. Global Sputtering Targets and Evaporation Materials Market - By Evaporation Method

7.1. Introduction

7.2. Thermal evaporation

7.3. Electron-beam evaporation

7.4. Vacuum evaporation

7.5. Reactive evaporation

8. Global Sputtering Targets and Evaporation Materials Market - By Material Type

8.1. Introduction

8.2. Pure metals

8.3. Elemental semiconductors

8.4. Alloys

8.5. Compounds (oxides, nitrides, sulphides and carbides)

9. Global Sputtering Targets and Evaporation Materials Market - By Application

9.1. Electronics

9.1.1. Magnetic data storage

9.1.2. Displays

9.1.3. Semiconductors

9.1.4. Sensors

9.2. Industrial

9.2.1. Wear Resistant

9.2.2. Corrosion Resistant

9.2.3. Heat Resistant

9.3. Energy

9.3.1. Photovoltaic cells

9.3.2. Solar thermal collectors

9.3.3. Batteries

9.4. Optics

9.4.1. Microscopes

9.4.2. Camera lenses

9.4.3. Automobile mirrors

9.5. Others

10. Global Sputtering Targets and Evaporation Materials Market - By Geography

10.1. Introduction

10.2. North America

10.2.1. U.S.

10.2.2. Canada

10.2.3. Others

10.3. Europe

10.3.1. U.K.

10.3.2. Germany

10.3.3. France

10.3.4. Switzerland

10.3.5. Others

10.4. APAC

10.4.1. China

10.4.2. Japan

10.4.3. India

10.4.4. Australia

10.4.5. Others

10.5. RoW

10.5.1. South America

10.5.2. Middle East and Africa

11. Market Entropy

11.1. New Product Launches

11.2. MandAs, Collaborations, Partnerships and JVs

12. Company Profiles

12.1. Heraeus Holding

12.2. Umicore AGandCo.

12.3. Hitachi Metals

12.4. Treibacher Industrie AG

12.5. KAMIS Inc

12.6. The Kurt J.Leskar Company

12.7. AJA International Inc

12.8. ACI alloys Inc

12.9. Soleras Advanced Coatings

12.10. Evochem Advanced Materials

12.11. American Elements

12.12. ULVAC GmbH

12.13. ADVANTIV Technologies Inc

12.14. SCI Engineered Materials

12.15. Able Target Limited

12.16. International Advanced Materials

12.17. Oerlikon balzers

12.18. Plasmaterials Inc

12.19. Leadmat Advanced Materials Co., Ltd

12.20. FURAYA Metals Co., Ltd

"*Financials would be provided on a best efforts basis for private companies"

13. Appendix

13.1. Abbreviations

13.2. Sources

13.3. Research Methodology

13.4. Bibliography

13.5. Compilation of Expert Insights

13.6 Disclaimer

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