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  4. > Sputtering Targets & Evaporation Materials Market Analysis By Sputtering Method (DC, Reactive, RF, Ion assisted, Magnetron and Gas Flow), By Evaporation Method (Thermal, Electron-beam, Vacuum, Reactive and Ion assisted), By Material Type (Pure Metals, All

Sputtering Targets & Evaporation Materials Market Analysis By Sputtering Method (DC, Reactive, RF, Ion assisted, Magnetron and Gas Flow), By Evaporation Method (Thermal, Electron-beam, Vacuum, Reactive and Ion assisted), By Material Type (Pure Metals, All

  • January 2015
  • -
  • Industry ARC
  • -
  • 186 pages

Summary

Table of Contents

Sputtering Targets & Evaporation Materials (ST&EM) are target materials which are used to deposit thin film or layer on desired substrate by employing various methods. Basically, sputtering and evaporation are variants of physical vapor deposition (PVD) processes which are used for various commercial and scientific purposes. Sputtering targets and evaporation materials have wide range of applications in semiconductor components, displays, sensors, data storage devices, photovoltaic cells, batteries, industrial tools, optics, automobile mirrors, decorative and many more. Owing to their significant applications in diverse end user industries, sputtering targets and evaporation materials market is set to grow at a considerable pace in the coming years. As per IndustryARC analysis, the global sputtering targets and evaporation materials recorded revenue of $2,820.6m in 2014. For the period of 2015 until 2020, it is estimated to grow at a compounded annual growth rate (CAGR) of 2.2% to reach $3,226.7m by 2020.

ST&EM market is set to experience considerable growth in the coming years, due to constant demand from dedicated end user sectors, especially electronics, energy, industrial, optical and others. APAC region is the major shareholder with more than 45% share in the global ST&EM market, due to the presence of numerous targets and materials providers and end user sectors. In the global ST&EM market, APAC region generated revenue of $1,370.5m in 2014 and is estimated to grow with significant CAGR during the forecast period. North America held the second major share followed by Europe and RoW. Overall, this market will find steady demand from dedicated end used industries.

This market has been segmented into methods of sputtering and evaporation, materials used as targets, application sectors and geography. The geography segmentation includes North America, Europe, APAC and RoW and market revenue is provided with respect to each region. Additionally, detailed qualitative and quantitative analysis of the factors responsible for driving and restraining growth of the ST&EM market along with future opportunities have been analyzed in the market forces chapter.

This report also includes profiles of the major companies such as:
Heraeus Holding,
Umicore Thin Film Products,
Hitachi Metals,
KAMIS Inc.,
The Kurt J.Leskar Company,
ULVAC GmbH and many more.
It is estimated that by 2020, there might not be significant difference in the ST&EM market share with respect to regions. APAC region is projected to hold major share with more than 48% in 2015 and 2020. By 2020, the market share of APAC is estimated to witness slight increase due to the demand from electronics and energy sector. The evolution of substitute technologies such as functional printing and 3D printing will affect the CAGR of ST&EM market in coming years. It is also estimated that North America and Europe will also experience slight decline in terms of ST&EM market share. Overall, sputtering targets and evaporation materials market may witness considerable demand mainly from APAC region.

Please note: this report requires certain updates. We have all the information available but require 2 business days to complete the process and ensure it is as up-to-date as possible.


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