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  4. > System On Package (SOP) Market - By Technology Elements (Electrical Silicon Through-Vias, Fine Pitch, High Bandwidth Wiring And Others), By Application (Consumers Electronics, Wireless Communication) And By Geography - Forecast (2015 - 2020)

System On Package (SOP) Market - By Technology Elements (Electrical Silicon Through-Vias, Fine Pitch, High Bandwidth Wiring And Others), By Application (Consumers Electronics, Wireless Communication) And By Geography - Forecast (2015 - 2020)

  • December 2014
  • -
  • Industry ARC
  • -
  • 160 pages

Summary

Table of Contents

SOP(System On Package) is a technology that places an entire system with computing, communications, and consumer functions all in a single chip. This technology is forecast to enable lower cost, more efficient and higher performance electronic systems. SOP saves interconnection time and heat generation by keep a full system with computing, communications, and consumer functions all in a single chip.

SOP report categorizes the market into three different segments, namely, market by type of technology elements, application, and geography. Based on the technology elements, the market has been classified into Electrical Silicon through-vias, Fine-Pitch, High Bandwidth Wiring, Fine-Pitch Solder Interconnection, Fine-Pitch Known-good-Die and Advanced Microchannel Cooling. The applications include Consumer electronics and wireless communications. Based on the geography, the report has been segmented into North America, Europe, APAC, and RoW.

Please note: this report requires certain updates. We have all the information available but require 2 business days to complete the process and ensure it is as up-to-date as possible.


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