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Reverse Costing of Invensense IMU-9250 9-axes MEMS

  • March 2014
  • -
  • System Plus Consulting
  • -
  • 150 pages

For its second generation of 9 DoF sensor, InvenSense manages to integrate a 6-Axis Accelerometer/Gyroscope and a 3-Axis Magnetometer in a cost effective QFN package of only 3x3mm (45% footprint reduction compared to the previous generation).

This package reduction has been made possible thanks to a new design of the 3-axis gyroscope which now uses a single structure vibratory compared to three different structures for the previous generation of gyros. This new design results in a shrink of 40% of the 3-axis gyro area. The second benefice of this new design is that Nasiri process has been changed: cavities which were traditionally etched in the ASIC to allow MEMS structures moving are no longer used, thus resulting in cost reduction.

The MPU-9250 also integrates a new 3-Axis magnetometer from AKM, the AK8963, which features almost 40% size reduction compared to previous generation and sensitivity improvement with 0.15µT/LSB.

Table Of Contents

Reverse Costing of Invensense IMU-9250 9-axes MEMS
Glossary

Overview/Introduction , Companies Profile

Physical Analysis
Package
- Package Views and Dimensions
- Package Opening
- Wire bonding Process
- Package Cross-Section
MPU-6500 Die
- View, Dimensions and Marking
- MEMS Removed
- MEMS Sensing Area
- MEMS Cap
- ASIC Delayering and Process
- Die Cross-Section: ASIC
- Die Cross-Section: MEMS
- Die Cross-Section: Sensor
- Die Cross-Section: Cap
AK8963 Die
- View, Dimensions and Marking
- Hall Sensors
- Delayering and Process
- Die Cross-Section
- Magnetic Concentrator Cross-Section

Comparison with previous generation

Manufacturing Process Flow
- MPU-6500 ASIC Front-End Process
- MPU-6500 MEMS Process Flow
- AK8963 ASIC Front-End Process
- AK8963 Magnetic Concentrator Process Flow
- Wafer Fabrication Units
- Packaging Process Flow and Assembly Unit

Cost Analysis
- Main steps of economic analysis
- Yields Hypotheses
- MPU-6500 ASIC Front-End Cost
- MPU-6500 MEMS Front-End Cost
- MPU-6500 MEMS Front-End Cost per process steps
- MPU-6500 Total Front-end Cost
- MPU-6500 Back-End 0 : Probe Test and Dicing
- MPU-6500 Wafer and Die Cost
- AK8963 ASIC Front-End Cost
- AK8963 Magnetic Concentrator Cost
- AK8963 Total Front-end Cost
- AK8963 Back-End 0 : Probe Test and Dicing
- AK8963 Wafer and Die Cost
- Back-End : Packaging Cost
- Back-End : Packaging Cost per Process Steps
- Back-End : Final Test and Calibration Cost
- MPU-9250 Component Cost

Estimated Price Analysis

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