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Reverse Costing of Sensonor STIM210 3-Axis

  • March 2014
  • -
  • System Plus Consulting
  • -
  • 160 pages

MEMS gyroscopes for tactical grade applications made a lot of progress in the past few years in term of reliability. They are now accepted in high-reliability environments, and are even starting to replace FOGs and other technologies in tactical applications.

With a bias instability of 0.5°/h, the Sensonor STIM210 is the world highest performance silicon MEMS gyroscope. The module is available without export control (ITAR-free). The analyzed module is a complete system offering 3 axes MEMS gyros associated with a 32-bit microcontroller which provides flexibility in device configuration.

STIM210 applications are typically found within Industrial, Aerospace and Defense markets, for various platform stabilizations, pointing and navigation systems, attitude heading reference systems (AHRSs), inertial navigation systems (INSs), smart munitions, missiles, 3D mapping systems, range finders, trains, robotics, and more. For many applications STIM210 directly replaces FOGs and improves system solutions with respect to robustness, reliability, size, weight, power and cost.

COMPLETE TEARDOWN WITH:

- Detailed Photos
- BOM Identification
- Precise Measurements
- Material Analysis
- Manufacturing Process Flow
- Supply Chain Evaluation
- Manufacturing Cost Analysis
- Selling Price Estimation

Table Of Contents

Reverse Costing of Sensonor STIM210 3-Axis
Glossary

Overview/Introduction

Company Profile

Physical Analysis
- Module
- -Views, Dimensions and Pin-out
-- Opening
- Electronic Board
-- Components Markings
-- Components Identification
-- Bare Dies Connections
- ASICs
-- View, Dimensions and Marking
-- Delayering, Process Identification
-- Cross-Section
- MEMS Gyro
-- View, Dimensions and Marking
-- Bond Pads and Bond Pads Opening
-- MEMS Cap Removed
-- MEMS Sensing Area
-- MEMS Gyro Principle
-- MEMS Cross-Section: Masses
-- MEMS Cross-Section: Electrode
-- MEMS Cross-Section: Buried Connections
-- MEMS Cross-Section: Getter

Manufacturing Process Flow
- Global Overview
- ASICs Front-End Processes and Wafer Fab Units
- MEMS Process Flow and Wafer Fab Unit
- Module Assembly Process Flow and Assembly Unit

Cost Analysis
- Main steps of economic analysis
- Yields Hypotheses
- ASICs Cost
-- Front-End Cost
-- Probe Test and Dicing Cost
-- Wafer and Die Cost
- MEMS Gyro Cost
-- Front-End Cost
-- Front-End Cost per process steps
-- Probe Test and Dicing Cost
-- Wafer and Die Cost
-- BOM Cost
- Electronic Board BOM Cost
-- Housing BOM Cost
-- Material Cost Breakdown
- Module Assembly and Test Cost
-- Electronic Board Assembly Cost
-- Housing Assembly Cost
-- Final Test and Calibration Cost
- STIM210 Module Cost and Estimated Price

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