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Reverse Costing of Apple iPhone 5S Camera iPhone 5S Camera module

  • May 2014
  • -
  • System Plus Consulting
  • -
  • 122 pages

For the iPhone 5S iSight camera module, Apple continues to integrate a 8Mpixel resolution CMOS Image Sensor. They achieve to obtain 33% increase in light sensitivity by improving the camera aperture from f/2.4 to f/2.2 and by rising the pixel size from 1.4µm to 1.5µm.

The unique technology from Sony (Exmor-RS) allows to raise the pixel array size by 15% and thus to considerably improve the light sensitivity by keeping a similar cost compared to the previous CIS. The technology consists in a stacking of two separate chips using optimized processes: a pixel array circuit which uses a Back-Side Illuminated (BSI) technology, and a logic ISP circuit processed with a 65nm technology node. The two circuits are stacked with a wafer bonding process and connected together with copper TSVs.

The camera module, with dimensions of 8.5 x 7.8 x 5.7mm, is equipped with a 5-elements lens module and a VCM auto-focus actuator. The CIS is assembled in flip-chip on a ceramic substrate with a gold stud bumping process.

Table Of Contents

Reverse Costing of Apple iPhone 5S Camera iPhone 5S Camera module
Camera Module Supply Chain and Companies Profile

Physical Analysis

Camera Module
Camera Module View and Dimensions
Camera Module X-Ray
Camera Module Disassembly
CMOS Image Sensor
View and Dimensions
Pads, Tungsten Grid
TSV Connections
CIS Pixels
Logic Circuit (Transistors, SRAM)
Cross-Section: Camera Module
Overview
Driver (Assembly and Process) and MLCC
Ceramic Substrate, IR Filter and FPC
Lenses, Housing, VCM
Cross-Section: CMOS Image Sensor
Overview
Pad Trenches
Pixel Array Circuit
Logic Circuit
TSVs
Comparison with previous 8Mpixel CIS from OVT, Samsung and Sony
CIS Manufacturing Process Flow

Global Overview
Logic Circuit Front-End Process
Pixel Array Circuit Front-End Process
BSI + TSV + Microlenses Process
CIS Wafer Fabrication Unit
Cost Analysis

Synthesis of the cost analysis
Main steps of economic analysis
Yields Hypotheses
CMOS Image Sensor Cost
Logic Circuit Front-End Cost
Pixel Array Front-end Cost
BSI and TSV Front-End Cost
Color Filters and Microlenses Front-End Cost
Total Front-End Cost
Back-End: Tests and Dicing
CIS Wafer and Die Cost
Camera Module Assembly Cost
Lens Module Cost
VCM Actuator Cost
Final Cost
Camera Module Cost

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