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Reverse Costing of Bosch Sensortec BMA355 3-Axis

  • July 2014
  • -
  • System Plus Consulting
  • -
  • 148 pages

After being integrated in the latest Apple's iPhone in 2013, Bosch is now the top MEMS supplier according to Yole's Top 30 MEMS Ranking 2014. This strong growth is mainly due to the consumer and mobile business of Bosch Sensortec.

With a size of only 1.4mm3 (1.2x1.5x0.8mm), the BMA355 is the smallest MEMS accelerometer on the market and features 60% volume reduction compared to state of the art 2x2x0.9mm MEMS accelerometers. This size reduction has been made possible by the use of a WLCSP package where all the manufacturing steps are realized at the wafer-level. To interconnect MEMS and ASIC with a WLCSP package, Through-Silicon Vias (TSVs) are used, introducing the first MEMS component with TSV Via-Middle process.

The BMA355 is a 12-bit digital resolution accelerometer well suited for applications requiring extremely small form factors.

The report includes a detailed technical and cost comparison with state of the art MEMS accelerometers from STMicroelectronics and mCube.

Discover all the details in the report!

Table Of Contents

Reverse Costing of Bosch Sensortec BMA355 3-Axis
1. Glossary

2. Introduction, Bosch Sensortec Company Profile

3. Physical Analysis

- Package
- - Package Views and Dimensions
- - Package Opening
- - Package Cross-Section (TSV, RDL)

- ASIC Die
- - View, Dimensions and Marking
- - Delayering
- - Main Blocks Identification
- - Process Identification
- - Cross-Section

- MEMS Die
- - View, Dimensions and Marking
- - Bond Pad Opening
- - Cap Removed and Cap Details
- - Sensing Area Details
- - Cross-Section (Sensor, Cap and Sealing)
- - Process Characteristics

- Consumer 3-Axis Accelerometer Comparison

4. Manufacturing Process Flow

- Global Overview
- ASIC Front-End Process and Wafer Fab Unit
- MEMS Process Flow and Wafer Fab Unit
- WLP Process Flow and Assembly Unit

5. Cost Analysis

- Main steps of economic analysis
- Yields Hypotheses
- ASIC FEOL and BEOL Cost
- ASIC TSV Cost
- ASIC TSV Cost per Process Steps
- MEMS Front-End Cost
- MEMS Back-End 0 : Probe Test and Dicing
- MEMS Front-End Cost per process steps
- MEMS Wafer and Die Cost
- Wafer-Level Packaging Cost
- Wafer-Level Packaging Cost per Process Steps
- Back-End : Final Test and Calibration Cost
- BMA355 Component Cost

6. Estimated Price Analysis

7. Consumer 3-Axis Accelero Cost Comparison

View This Report »

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