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Reverse Costing of Maxim MAX21100 6-Axis

  • September 2014
  • -
  • System Plus Consulting
  • -
  • 136 pages

With the same process used for their 3-Axis gyro and acquired from the purchasing of SensorDynamics in 2011, the MAX21100 combines on only one MEMS die a 3-Axis gyroscope and a 3-Axis accelerometer.

The PSM-X2 technology platform used to build the sensor includes a proprietary surface micromachining process and a gold silicon eutectic wafer bonding allowing an hermetic encapsulation and a dual pressure wafer-level capping of the sensors.

Assembled in a LGA 3.0×3.0×0.83mm package, the MAX21100 is a low power consumption (3.45mA) 3-Axis gyroscope plus 3-Axis accelerometer IMU with integrated 9-axis sensor fusion (6+3 DoF) targeted for consumer applications.

The report is including a detailed technical and cost comparison with state of the art 6-Axis MEMS IMUs (3-Axis gyroscope + 3-Axis accelerometer) from STMicroelectronics, Bosch Sensortec and InvenSense. Surprisingly, Maxim is able to provide a very competitive component due to an important silicon area reduction.

Discover all the details in the report!

Table Of Contents

Reverse Costing of Maxim MAX21100 6-Axis
1. Glossary

2. Overview/Introduction , Maxim Company Profile

3. Physical Analysis

- Package

- Package Views and Dimensions
- Package Opening
- Wire Bonding Process
- Package Cross-Section

- ASIC Die

- View, Dimensions and Marking
- Delayering
- Main Blocks Identification
- Cross-Section
- Process Characteristics

- MEMS Die

- View, Dimensions and Marking
- Bond Pad Opening
- Cap Removed and Cap Details
- Sensing Area Details
- Cross-Section (Sensor, Cap and Sealing)
- Process Characteristics

- Consumer 6-Axis IMU Comparison

4. Manufacturing Process Flow

- Global Overview
- ASIC Front-End Process
- ASIC Wafer Fabrication Unit
- MEMS Process Flow
- MEMS Wafer Fabrication Unit
- Packaging Process Flow and Assembly Unit

5. Cost Analysis

- Main steps of economic analysis
- Yields Hypotheses
- ASIC Front-End Cost
- ASIC Back-End 0 : Probe Test and Dicing
- ASIC Wafer and Die Cost
- MEMS Front-End Cost
- MEMS Back-End 0 : Probe Test and Dicing
- MEMS Front-End Cost per process steps
- MEMS Wafer and Die Cost
- Back-End : Packaging Cost
- Back-End : Packaging Cost per Process Steps
- Back-End : Final Test Cost
- MAX21100 Component Cost
- Consumer 6-Axis IMU Cost Comparison

6. Estimated Price Analysis

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