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Reverse Costing of InvenSense ICS43432 Digital MEMS Microphone

  • October 2014
  • -
  • System Plus Consulting
  • -
  • 107 pages

Following the acquisition of MEMS Microphone Business Line of Analog Devices for 100M$ in October 2013, InvenSense releases its last high performances digital MEMS Microphone based on flexible membrane and capacitive common sensing principle.

The ICS-43432 is a digital microphone equipped with MEMS and amplification ASIC into a single chip. It is designed by CMOS process, it has I²S protocol interface and high SNR of 65dBA.

The MEMS transducer is a condenser microphone with a flexible poly-Si membrane and a rigid reference electrode manufactured on SOI substrate. Compared with state of the art MEMS Microphones, it presents a new design of the diaphragm with octagonal shape and centralfixation.

Assembled in a 6-pins LGA4.0x3.0x1.0mm package, the ICS-43432 is an high performance digital output microphone with bottom port targeted for consumers applications.

Table Of Contents

Reverse Costing of InvenSense ICS43432 Digital MEMS Microphone
1. Overview / Introduction
- Executive Summary
- Reverse Costing Methodology

2. Company Profile
- InvenSense
- Digital Microphones portfolio

3. Physical Analysis
- Synthesis of the Physical Analysis
- Device Design
- Physical Analysis Methodology
Package
- Package Views and Dimensions
- Package Opening
- Package Cross-Section
ASIC Die
- View and Dimensions
- Die Marking
- Die Delayering
- Die Process
- Die Cross-Section
- Process Characteristics
MEMS Die
- View and Dimensions
- Marking
- Dicing
- Bond Pads
- Membrane and Backplate
- Central Support
- Anti-Stiction holes
- Cavity- Cross-Section
- MEMS Characteristics

4. Manufacturing Process Flow
- Global Overview
- ASIC Front
- End Process
- ASIC Wafer Fabrication Unit
- MEMS Process Flow- MEMS Wafer Fabrication Unit
- Packaging Process Flow- Package Assembly Unit

5. Cost Analysis
- Synthesis of the cost analysis
- Main steps of economic analysis
- Yields Explanation
- Yields Hypotheses
- ASIC Front-End Cost
- ASIC Back-End 0 : Probe Test and Dicing- ASIC Wafer Cost
- ASIC Die Cost- MEMS Front-End Cost
- MEMS Front-End Cost per process steps
- MEMS Front-End: Equipment Cost per Family
- MEMS Front-End: Material Cost per Family
- MEMS Back-End 0 : Probe Test and Dicing
- MEMS Wafer Cost- MEMS Die Cost
- Back-End : Packaging Cost
- Back-End : Packaging Cost per Process Steps
- Back-End : Final Test Cost- Microphone Component Cost

6. Estimated price Analysis
- Manufacturer financial ration
- Microphone Component Price

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