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Reverse Costing of STMicroelectronics A3G4250D 3-Axis

  • October 2014
  • -
  • System Plus Consulting
  • -
  • 119 pages

MEMS are getting broadly adopted in the automotive industry and non-safety applications like in-dash navigation are now requiring low-cost and small footprint components.

The A3G4250D is a low power consumption MEMS gyroscope which is the first 3-axis gyroscope to have met the industry-standard qualification for automotive integrated circuits (AEC-Q100).

STMicroelectronics 3-axis gyroscope for automotive applications measures angular rates up to ±245 dps and has been designed and produced using the same manufacturing process (THELMA) than ST consumer products.

Assembled in a 4.0 x 4.0 x 1.1mm package, it embeds an 8-bit temperature sensor and operates within an extended temperature range from -40 to 85°C.

It is suitable for applications including in-dash navigation, telematics and vehicle tolling systems, motion control with MMI (man-machine interface), appliances and robotics.

Table Of Contents

Reverse Costing of STMicroelectronics A3G4250D 3-Axis
1. Overview / Introduction
- Executive Summary
- Reverse Costing Methodology

2. Company Profile
- STMicroelectronics
- A3G4250D Characteristics

3. Physical Analysis
- Synthesis of the Physical Analysis
- Physical Analysis Methodology
Package
- Package Views and Dimensions
- Package Pin Out
- Package Opening
- Wire Bonding Process
- Package Cross-Section
ASIC Die 30
- View, Dimensions and Marking
- Delayering
- Main Blocks Identification
- Cross-Section
- Process Characteristics
MEMS Die 43
- View, Dimensions and Marking
- Bond Pad Opening
- Cap Removed and Cap Details
- Sensing Area Details
- Cross-Section (Sensor, Cap and Sealing)
- Process Characteristics

4. Manufacturing Process Flow
- Global Overview
- ASIC Front-End Process
- ASIC Wafer Fabrication Unit
- MEMS Process Flow
- MEMS Wafer Fabrication Unit
- Packaging Process Flow
- Package Assembly Unit

5. Cost Analysis
- Main steps of economic analysis
- Yields Hypotheses
- ASIC Front-End Cost
- ASIC Back-End 0 : Probe Test and Dicing
- ASIC Wafer and Die Cost- MEMS Front-End Cost
- MEMS Back-End 0 : Probe Test and Dicing
- MEMS Front-End Cost per process steps
- MEMS Front-End: Equipment Cost per Family
- MEMS Front-End: Material Cost per Family
- MEMS Wafer and Die Cost- Back-End : Packaging Cost
- Back-End : Packaging Cost per Process Steps
- Back-End : Final Test Cost- MAX21000 Component Cost- Consumer 3-Axis Gyro Cost Comparison

6. Estimated Price Analysis
- Manufacturer Financial Ratios
- Estimated Selling Price

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