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For the iPhone 6 FaceTime camera module, Apple continues to integrate a 1.2Mpixel resolution CMOS Image Sensor. 81% of light sensitivity has been increased by using the camera aperture f/2.2, rising the pixel size from 1.75µm to 2.2µm and using an innovative microlenses array.
The unique technology from Sony (Exmor-RS) consists in a stacking of a pixel array circuit which uses a Back-Side Illuminated (BSI) technology and a logic ISP circuit processed with a 65nm technology node. This allows to raise the pixel array size by 15% and to considerably improve the light sensitivity by integrating an innovative grid and lenses design.
The camera module, with dimensions of 6.2 x 6.0 x 3.8mm, is equipped with a 4-elements lens module integrated in a very low cost package. The CIS is assembled in flip-chip on a ceramic substrate with a gold stud bumping process.
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