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  4. > Reverse Costing of FLiR One IR camera add-on

Reverse Costing of FLiR One IR camera add-on

  • December 2014
  • -
  • System Plus Consulting
  • -
  • 74 pages

Executive Summary
This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling price of the third generation FLIR LEPTON LWIR Camera Module.
- The Lepton 3 is integrated in the 2nd generation FLIR One for Android and iOS. It is an infrared camera system that integrates a fixed-focus lens assembly, an 160x120 long-wave infrared (LWIR) microbolometer sensor array, and signal-processing electronics.
- The new Lepton 3 LWIR core shares almost the same dimensions than the previous Lepton core but offers a four times improved resolution of 160x120 pixels (versus 80x60 pixel for the Lepton 2). Despite this improvement, it consumes slightly the same power with 160mW versus 150mW. This achievement has been made possible by the reduction of the pixel size, from 17µm to 12µm in the Lepton 3. This new pixel size has been accompanied by new processes for the ROIC, the microbolometer and the wafer-level window (new technology node, new pixel integration with the ROIC and a simplified window which no longer needs an SOI wafer…).
- On the optical module side, strong efforts have been made to improve lenses resulting in a wider field of view (FOV). The lenses are still wafer-level silicon optics but area has been enhanced thanks to hexagonal shapes compared to square shapes previously.
- The report also includes a comparison with the Lepton 2 core integrated in the FLIR One 1st Generation and a comparison with solutions provided in the Seek Thermal camera (Raytheon microbolometer) and in the Opgal Therm-App camera (Ulis microbolometer).

Table Of Contents

Reverse Costing of FLiR One IR camera add-on
Glossary
1. Overview / Introduction 4
- Executive Summary
- Reverse Costing Methodology
2. Company Profile 7
- FLIR Systems
- LEPTON Characteristics
3. Physical Analysis 15
- Synthesis of the Physical Analysis
- Physical Analysis Methodology
- LEPTON Module 18
- Module Views, Dimensions and Pin Out
- Module Opening
- Housing, Lenses
- IR Sensor Assembly
- LEPTON Module Cross-Section 31
- Cross-Section Overview
- Cross-Section: Housing, Lenses
- Cross-Section: Heat Spreader, Substrate
- IR Sensor Die 50
- View, Dimensions and Marking
- Window Removed, window details
- Pixels Area Overview and Details
- ROIC Delayering and Process
- IR Sensor Cross-Section 73
- Cross-Section Overview
- Cross-Section: Sealing
- Cross-Section: Window
- Cross-Section: ROIC
- Cross-Section: Microbolometer
3. Physical Analysis (cont.)
- ASIC Dies 92
- View, Dimensions and Marking
- ASIC Delayering and Process
- ASIC Cross-Section: RDL and Bumping
- ASIC Cross-Section: Metal Layers
- Comparison with FLIR Lepton 2 114
4. Manufacturing Process Flow 118
- Global Overview
- ASIC Front-End Process
- ASIC Wafer Fabrication Unit
- ROIC, Microbolometer and Window Process Flows
- IR Sensor Wafer Fabrication Unit
- Lenses Process Flow and Wafer Fabrication Unit
5. Cost Analysis 139
- Main steps of economic analysis
- Yields Hypotheses
- ASICs Front-End Cost, Wafer and Die Cost
- ROIC Front-End Cost
- Microbolometer Front-End Cost
- Window Front-End Cost
- IR Sensor wafer and Die Cost
- Lenses Wafers and Dies Cost
- Module Assembly Cost and Test
- LEPTON Module Cost
6. Estimated Price Analysis 177
- Manufacturer Financial Ratios
- LEPTON Module Estimated Selling Price
7. Comparison with Seek Thermal and Therm-App 181
1. Overview/Introduction 3
- Introduction
- Company Profile : FLIR
- FLIR ONE Main Characteristics
- Executive Summary
- Reverse Costing Methodology
2. Physical Analysis 9
- Global view of the Packaging
- Packaging Opening
- Global Views of the FLIR ONE
- Views and Dimensions of the Housing
- FLIR ONE Disassembly
- Shutter Disassembly
- Housing Disassembly
- FLIR One for Android Opening
- Electronic Boards
- Main Board - Top Side - Global View
- Main Board - Top Side - High Definition Photo
- Main Board - Top Side - Markings
- Main Board - Top Side - Components Markings
- Main Board - Top Side - Components Identification
- Main Board - Bottom Side - Global View
- Main Board - Bottom Side - High Definition Photo
- Main Board - Top Side - Markings
- Main Board - Top Side - Components Markings
- Main Board - Top Side - Components Identification
- Lightning Board
3. Cost Analysis 40
- Accessing the BOM
- Estimation of the cost of the PCBs
- Estimation of the Cost of the Sonix SN9C270A
- BOM Cost - Main Board
- BOM Cost - Lightning Board
- BOM Cost - Housing
- BOM Cost - Packaging
- Material Cost Breakdown
- Accessing the Added Value (AV) cost
- Main Board Manufacturing Flow
- Details of the Main Board AV Cost
- Details of the Housing Assembly AV Cost
- Added Value Cost Breakdown
- Manufacturing Cost Breakdown
4. Estimated Price Analysis 71
- Estimation of the Manufacturing Price
Contact 74

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