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Reverse Costing of Raytheon EXC001 Raytheon IR Microbolometer

  • January 2015
  • -
  • System Plus Consulting
  • -
  • 100 pages

Initially focused on the military market, uncooled thermal camera sales have grown significantly due to the substantial cost reduction of microbolometers and growing adoption in commercial markets. With a vertically-integrated business model and a fabless structure, Raytheon enters in the consumer market.

The Seek Thermal camera has a very compact size and is compatible with Android smartphones via its micro-USB connector. The camera performs its calibration automatically thanks to an electromechanical shutter assembled on the electronic board. The device also includes a chalcogenide lens inserted in a zinc lens housing.

The thermal camera uses a new 12µm pixel design from Raytheon. The EXC001 microbolometer, is featuring a 206×156 pixels resolution, 6 times the resolution of the FLIR One. The sensor technology in the Raytheon component is an uncooled VOx microbolometer and a 2 levels structure. Thanks to its strong integration at the die level with a wafer-level packaging (WLP), this is the world’s smallest microbolometer-based thermal imaging camera die.

Based on a complete teardown analyses of the Seek Thermal Camera and the Raytheon microbolometer, the report provides the bill-of-material (BOM) and the manufacturing cost of the infrared camera as well as a complete physical analysis and manufacturing cost estimation of the infrared module.

Table Of Contents

Reverse Costing of Raytheon EXC001 Raytheon IR Microbolometer
1. SEEK THERMAL Camera

Overview/Introduction, Main Features

Teardown
- Packaging
- Views and Dimensions of the Housing
- Seek Thermal Camera Disassembly
- Chopper Module
- Lens Module
- Electronic Board
- High Definition Photos and PCB Markings
- Components Markings and Identification

Cost Analysis
Accessing the BOM
- Estimation of the cost of the PCB
- BOM Cost - Electronic Board, Housing and Packagin
- Material Cost Breakdown

Accessing the Added Value (AV) Cost
- Electronic Board Manufacturing Flow and AV Cost
- Housing and Packaging Assembly AV Cos
- Added Value Cost Breakdown
- Estimation of the Manufacturing Price

2. EXC001 Infrared Camera Module

Overview/Introduction, Company Profiles, Main Features

Physical Analysis

EXC001 Microbolometer
- View and Dimension
- Disassembly and Cross-Section

Infrared Sensor
- Microbolometer and ROIC Views and Dimensions
- Pixel Details, Delayering
- Cross-Section and Process Characteristics

Manufacturing Process Flow
- ROIC Process and Microbolometer Process Flow
- Wafer Fabrication Unit

Cost Analysis
- Yield Hypotheses
- ROIC and Microbolometer Wafer and Die Cost
- ASIC Wafer and Die Cost
- EXC001 die Cost and Price

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