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Reverse Costing of InvenSense MP67B InvenSense MP67B

  • February 2015
  • -
  • System Plus Consulting
  • -
  • 109 pages

With 74.5 million units of iPhone sold during the last quarter 2014, InvenSense made a very good deal by replacing STMicroelectronics as the supplier of the gyroscope for the iPhone 6 and 6 Plus.

The MP67B is a custom version of InvenSense 6-Axis device (3-Axis gyroscope + 3-Axis accelerometer) made for Apple. Compared to InvenSense’s standard 6-Axis device MPU-6500, specific modifications have been realized. The main ones consist in the package modification with the use of a LGA substrate compared to a QFN leadframe, and in the ASIC which has been redesigned.

The MP67B uses the same process as InvenSense’s second generation 6-axis device with a new design of the 3-axis gyroscope which now uses a single structure vibratory compared to three different structures for the previous generation of gyros. This new design results in a shrink of 40% of the 3-axis gyro area. The second benefit of this new design is that Nasiri process has been changed: cavities which were traditionally etched in the ASIC to allow MEMS structures moving are no longer used, thus resulting in cost reduction.

Table Of Contents

Reverse Costing of InvenSense MP67B InvenSense MP67B
1. Overview / Introduction
- Executive Summary
- Reverse Costing Methodology

2. Company Profile
- InvenSense Profile
- iPhone 6 Teardown

3. Physical Analysis
- Synthesis of the Physical Analysis
- Physical Analysis Methodology

Package
- Package View and Dimensions
- Package Opening
- Package Cross-Section

Die
- View, Dimensions and Marking
- MEMS Removed
- MEMS Sensing Area: Gyroscope
- MEMS Sensing Area: X/Y-Axis Accelerometer
- MEMS Sensing Area: Z-Axis Accelerometer
- MEMS Cap- ASIC Delayering and Process
- Die Cross-Section: ASIC
- Die Cross-Section: MEMS (Pads Opening)
- Die Cross-Section: MEMS (Sealing)
- Die Cross-Section: Sensor (Electrical Contacts)
- Die Cross-Section: Sensor (Standoffs)
- Die Cross-Section: Sensor (Al-GE Bonding)
- Die Cross-Section: Sensor (Mobile Elements)
- Die Cross-Section: Cap

- Comparison with MPU-6

- Comparison with previous generation

5. Manufacturing Process Flow
- Global Overview
- ASIC Front-End Process
- MEMS Process Flow
- Wafer Fabrication Unit
- Packaging Process Flow
- Package Assembly Unit

6. Cost Analysis
- Synthesis of the cost analysis- Main steps of economic analysis
- Yields Hypotheses
- ASIC Front-End Cost
- MEMS Front-End Cost
- ASIC/MEMS Assembly Cost
- MEMS Front-End Cost per process steps
- Total Front-end Cost
- Back-End : Probe Test and Dicing
- Wafer and Die Cost
- Back-End : Packaging Cost
- Back-End : Packaging Cost per Process Steps
- Back-End : Final Test and Calibration Cost
- Component Cost

7. Estimated Price Analysis
- InvenSense Financial Ratios
- Component Estimated Price

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