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  4. > Reverse Costing of Bosch Sensortec BMI160 Bosch Sensortec BMI160

Reverse Costing of Bosch Sensortec BMI160 Bosch Sensortec BMI160

  • March 2015
  • -
  • System Plus Consulting
  • -
  • 177 pages

Bosch is now the top MEMS supplier with a production of more than 4 millions MEMS per day. This strong growth is due to both consumer applications and automotive applications.

With a size of only 7.5mm² (3×2.5mm), the BMI160 is the smallest 6-Axis IMU MEMS on the market and features 60% volume reduction compared to previous BMI055. This size reduction has been made possible by the use of a new design and process for the MEMS Gyro and by the integration in one ASIC die for the control of both MEMS. The BMI160 is a 16-bit digital resolution accelerometer and gyroscope well suited for applications requiring extremely small form factors.

Bosch has worked on the power consumption with a low power mode for the significant motion and step detector functions, using a “7-axis” accelerometer. Moreover, the unique ASIC die can perform the fusion of the data from the accelerometer and gyroscope with those from an external sensor.

The report is including a detailed technical and cost comparison with the previous generation BMI055 and the state of the art 6-Axis MEMS IMU from Invensense.

Table Of Contents

Reverse Costing of Bosch Sensortec BMI160 Bosch Sensortec BMI160
1. Glossary

2. Introduction, Bosch Sensortec Company Profile

3. Physical Analysis

4. Package
- Package Views and Dimensions
- Package Openin
- Package Cross-Section
- ASIC Die
- View, Dimensions and Marking
- Delayering
- Main Blocks Identification
- Process Identificatio
- Cross-Section
- MEMS Die
- View, Dimensions and Marking
- Bond Pad Opening
- Cap Removed and Cap Details
- Sensing Area Details
- Cross-Section (Sensor, Cap and Sealing
- Process Characteristics
- Consumer 6-Axis MEMS IMU Comparison (Bosch Sensortec BMI055 and BMI160, Invensense)

5. Manufacturing Process Flow

6. Global Overview
- ASIC Front-End Process and Wafer Fab Unit
- MEMS Process Flow and Wafer Fab Unit
- Package Process Flow and Assembly Unit

7. Cost Analysis

- Yields Hypotheses
- ASIC Front-End Cost
- ASIC Back-End 0 : Probe Test and Dicing
- ASIC Wafer and Die Cost
- MEMS Gyro and Accelero Front-End Cost
- MEMS Gyro and Accelero Front-End Cost per process steps
- MEMS Gyro and Accelero Back-End 0 : Probe Test and Dicing
- MEMS Gyro and Accelero Wafer and Die Cost
- Back-End : Packaging Cost
- Back-End : Final Test and Calibration Cost
- BMI160 Component Cost
- Consumer 6-Axis IMU Comparison

8. Estimated Price Analysis

9. Consumer 6-Axis MEMS IMU Cost Comparison (Bosch Sensortec BMI055 and BMI160, Invensense)

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