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  4. > Reverse Costing of STMicroelectronics HTS221 Humidity and temperature sensor

The HTS221 humidity sensor is the first environment sensor from STMicroelectronics which follows the train of new open cavity combos. Assembled in a 6-pins LGA 2 x 2 x 0.9mm package; the HTS221 is a digital humidity and temperature sensor equipped with a sensor die and an ASIC. It has operating ranges of -40…+125°C, 0…100 % relative humidity for 16bit output data for temperature and humidity.

The relative humidity sensor uses a polymer dielectric planar capacitor digital measurement technology which allows a precise response in very compact size. The integrated heater allows a high ODR.

This device uses a new type of package built around an original holed cap developed by STMicroelectronics for mobile phones and for industrial application with a temperature range from -40 °C to +120 °C.

The report presents deep technology and cost analysis of HTS221 with an exhaustive package analysis. It also includes a technology and production cost comparison with Bosch BME280 humidity and pressure sensor and with Sensirion SHTC1 humidity MEMS.

Table Of Contents

Reverse Costing of STMicroelectronics HTS221 Humidity and temperature sensor
1. Glossary

2. Overview/Introduction, Companies Profile

3. Physical Analysis

4.Package
- Package Views and Dimensions
- Package Opening
- Wire bonding Process
- Package Cross-Section

5. ASIC Die
- View, Dimensions and Marking
- ASIC Delayering
- ASIC main blocks identification
- ASIC Process
- ASIC Die Cross-Section

6. Pressure and Humidity Die
- View, Dimensions and Marking
- MEMS Humidity Sensing Area
- Cap
- MEMS Humidity Cross-Section
- MEMS processes

7.Comparison with Bosch BME280 and Sensirion SCHTC1 pressure sensor

8. Manufacturing Process Flow

9. ASIC Front-End Process
- MEMS humidity Process Flow
- Wafer Fabrication Units
- Packaging Process Flow and Assembly Unit

10. Cost Analysis

11. Main steps of economic analysis
- Yields Hypotheses
- ASIC Front-End Cost
- ASIC Back-End 0 : Probe Test and Dicing
- ASIC Front-End Cost
- MEMS HumidityWafer and Die Cost
- MEMS HumidityFront-End Cost
- MEMS Humidity Back-End 0 : Probe Test and Dicing
- Back-End : Packaging Cost
- Back-End : Packaging Cost per Process Steps
- Back-End : Final Test Cost
- BME280 Component Cost

12. Estimated Price Analysis

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