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Reverse Costing of STMicroelectronics LSM6DS3 MEMS IMU

  • June 2015
  • -
  • System Plus Consulting
  • -
  • 140 pages

Combo sensors, and particularly 6-axis IMU, will represent the majority of the inertial MEMS market in the coming years according to Yole. This large adoption has not profited much to STMicroelectronics lately, but their latest innovation in the field could change that. Indeed, the LSM6DS3 has been named “MEMS sensor device of the Year” in 2014 and ST had a big design win with a 6-axis IMU in the Apple Watch this year.

By achieving 50% footprint reduction and decreasing considerably the power consumption compared to ST’s previous generation IMU, the LSM6DS3 is ready to attack the mobile market where the competition on price is stronger than ever. In order to obtain this size of only 2.5x3x0.85mm, STMicroelectronics introduced many new features to its device. Indeed, the classical LGA 2-layer PCB has been replaced by an uncommon 3-layers PCB, the MEMS gyro and accelerometer have also been redesigned to be able to shrink the die size. On the processes side, new techniques borrowed from competitors products has been introduced in the MEMS fabrication and also a whole new process for the ASIC is now used allowing to embed 8KB of FIFO memory.

The LSM6DS3 is targeted for battery-powered smart sensor systems to be embedded in mobile and wearable devices and innovative objects for the Internet of Things (IoT).

The report includes a detailed technology and cost comparison with ST’s previous generation LSM6DS0 and with leading edge 6-Axis IMUs from Bosch Sensortec (BMI160) and InvenSense (MPU-6500).

Table Of Contents

Reverse Costing of STMicroelectronics LSM6DS3 MEMS IMU
1. Overview / Introduction

2. STMicroelectronics Company Profile

3. Physical Analysis

4. Physical Analysis Methodology
- Package
- Package Characteristics Marking and Pin-out
- Package Opening and Wire Bonding Process
- Package Cross-Section
- ASIC Die
- View, Dimensions and Marking
- Delayering and Main Blocks Identification
- Process Identification
- Cross-Section
- MEMS Die
- View, Dimensions and Marking
- Bond Pad Opening and Bond Pads Details
- Cap Removed and Cap Details
- Sensing Areas Details
- Cross-Section (Sensor, Cap and Sealing)
- Process Characteristics

5. Technology comparison with STMicroelectronics LSM6DS0, Bosch Sensortec BMI160 and InvenSense MPU-6500

6. Manufacturing Process Flow

7. Global Overview
- ASIC Front-End Process
- MEMS Process Flow
- Wafer Fabrication Units
- Packaging Process Flow and Assembly Unit

8. Cost Analysis

9. Yields Hypotheses
- ASIC Front-End Cost
- ASIC Back-End : Probe Test and Dicing Cost
- ASIC Wafer and Die Cost
- MEMS Front-End Cost
- MEMS Front-End Cost per process steps
- MEMS Back-End : Probe Test and Dicing Cost
- MEMS Wafer and Die Cost
- Back-End : Packaging Cost
- Back-End : Final Test and Calibration Cost
- LSM6DS3 Component Cost

10. Price Analysis

11. ST Financial Results
- LSM6DS3 Selling Price Estimation

12. Cost and Price comparison with Bosch Sensortec and InvenSense 6-Axis IMUs

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