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  4. > Reverse Costing of Cavendish Kinetics 32CK417R MEMS Antenna Tuner

Reverse Costing of Cavendish Kinetics 32CK417R MEMS Antenna Tuner

  • June 2015
  • -
  • System Plus Consulting
  • -
  • 106 pages

Cavendish Kinetics promises to transform the RF stage in mobile phone with its MEMS tunable capacitors. Today the 32CKxxx family is optimized for the antenna tuning function. And Cavendish Kinetics wants to use its SmarTune technology in RF filters and Tx antenna switch.

The Cavendish Kinetics components are integrated in Nubia Smartphones.

With a very small footprint, less than to 2mm², the 32CK417R is the smallest antenna tuner on the market. Moreover, the specific SmarTune technology offers a fine capability to tune the capacitor value, 32 steps between the min and max value to have a seamless tuning. The report provides all details on the structure of the component and the supply chain to produce this astonishing MEMS.

The 32CK417R integrates an ASIC to drive the variable capacitor and thanks to a SPI or MIPI bus communication facilitating the integration for phone manufacturers.

The Wafer Level Packaging, from STATS ChipPAC, reduces the insertion loss, 5x lower than RF SOI solution.

All the wafer manufacturing process, ASIC part and MEMS part, are performed by Tower Jazz.

The report includes a detailed technology and cost analysis describing the innovations of Cavendish Kinetics and TowerJazz of this unique Antenna Tuner.

Table Of Contents

Reverse Costing of Cavendish Kinetics 32CK417R MEMS Antenna Tuner
Overview / Introduction

Cavendish Company Profile

Physical Analysis

Physical Analysis Methodology
Package
Package Characteristics Marking and Pin-out
Package Opening and Wire Bonding Process
Package Cross-Section
MEMS Die
View, Dimensions and Marking
Bond Pad Opening and Bond Pad
Capacitor Area
Capacitor Cross-Section
Capacitor Delayering
Process Characteristics
ASIC Die
View, Dimensions and Marking
Delayering
Main Blocks Identification
Cross-Section
Process Characteristics
Comparison Wispry A210
Manufacturing Process Flow

Global Overview
ASIC Front-End Process
Tunable Capacitors Process Flow
Wafer Fabrication Unit
Packaging Process Flow
Package Assembly Unit
Cost Analysis

Synthesis of the cost analysis
Main steps of economic analysis
Yields Hypotheses
ASIC Front-End Cost
MEMS Front-End Cost
MEMS Front-End Cost per process steps
MEMS Back-End 0 : Probe Test and Dicing
Back-End : Wafer Level Packaging Cost
Back-End : Wafer Level Packaging Cost per Process Steps
Back-End : Final Test
32CK417R Component Cost
Price Analysis

Cavendish Financial Results
32CK147R Selling Price Estimation

View This Report »

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