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  4. > Reverse Costing of Opgal Therm-App Infrared Camera

Reverse Costing of Opgal Therm-App Infrared Camera

  • July 2015
  • -
  • System Plus Consulting
  • -
  • 166 pages

Based on a high definition microbolometer from Ulis, the Therm-App infrared camera is a high-end product for smartphone. More conservative in their technological choices, the microbolometer is more expensive but better. The choice of the quality is also in the camera with the possibility of interchangeable lenses in function of the use. Opgal and Ulis target the professional market and are more in competition with standard IR cameras than with IR cameras for mobile.

The Therm-App camera has a very compact size and is compatible with Android smartphones via its micro-USB-OTG connector. The camera is shutterless and a interchangeable lenses system allow to upgrade the camera for the near or faraway application.

The thermal camera uses a new 17µm pixel design from ULIS. The Pico384P microbolometer, is featuring a 384×288 pixels resolution, 24 times the resolution of the FLIR Lepton and 3 times the resolution of the Seek Thermal (Raytheon EXC001). The sensor technology in the ULIS component is an amorphous silicon microbolometer on 1 level structure. The large pixels allow an excellent NETD of 70mK and a good frame. The PICO384P is based on a complex and modern ROIC die.

To offer the best performances, ULIS encapsulates their microbolometer in a ceramic package more expensive than the Wafer level Package used by Flir and Raytheon.

Based on a complete teardown analysis of the Therm-App Camera and the ULIS microbolometer, the report provides the bill-of-material (BOM) and the manufacturing cost of the infrared camera as well as a complete physical analysis and manufacturing cost estimation of the infrared module.

At last, a characteristics comparison between Flir One, Seek Thermal and Therm-App Cameras highlights differences in technical choices made by the three companies.

Table Of Contents

Reverse Costing of Opgal Therm-App Infrared Camera
Opgal - Therm-App

Opgal Company Profile

Teardown

Physical Analysis Methodology
Package Opening
Electronic Board
Cost Analysis

Accessing the BOM
Estimation of the Cost of the PCB
BOM Cost -
Accessing the Added Value (AV) cost
Electronic Board Manufacturing Flow
Details of the Housing Assembly AV Cost
Details of the Packaging Assembly AV Cost
Manufacturing Cost Breakdown
Estimation of the Manufacturing Price - Opgal
Ulis - PICO384P

Ulis Company Profile

Physical Analysis

Global Overview
Package Opening
Microbolometer
ROIC circuit
Microbolometer cross-Section
Manufacturer Process Price

ROIC
Microbolometer
Package
Cost Analysis

Synthesis of the cost analysis
Yields Hypotheses
ROIC Front-End Cost
Microbolometer Front-End Cost
Back-End : Packaging Cost
PICO384P Component Cost
Price Analysis

Estimated Selling Price

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