Table of Contents
This industry is proud to release a complete report on the world’s first HBM integrated on chip featured in the latest AMD graphic card Radeon™ R9 Fury X. Led by AMD and SK Hynix, this 3D & 2.5D component integrates HBM memories (DRAM dies & Logic dies connected with via-middle TSV and micro-bumps) and GPU stacked onto a silicon interposer (including also via-middle TSV).
The HBM delivers 60% more memory bandwidth, 3x the performance per watt and consumes 94% less PCB area than GDDR5.
The report includes a complete physical analysis of the packaging process, with details on all technical choices regarding process and equipment (wafer bonding, via etching, via filling, bumping, underfill…) and materials.
Also, the complete manufacturing supply chain has been identified (GPU foundry, Interposer foundry, HBM Foundry, PCB substrate manufacturer, OSAT product integrator) in order to provide a detailed description of the manufacturing process with manufacturing cost calculation.
The report also features a comparison with Samsung 3D TSV DRAM stacking process in order to understand the different technology choices made by the different players.
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