Table of Contents
GaN Systems offers for GS66508T (650V, 30A) a top-side cooling using AT&S ECP® embedded die packaging process. Compared to the bottom-side cooling approach, this new power packaging process allows to reduce the package footprint by 60% for a cost 40% cheaper!
The GS66508P is packaged is an innovative embedded die package developed by AT&S (ECP® process). This package has no wire bonding to reduce the inductance and a design to increase the heat management using the two sides of the die.
The new position of the die in the package allows to enhance the thermal dissipation. Moreover a simplification of the process reduces the time and the cost of manufacturing.
The report includes a complete physical analysis of the packaging process, with details on all technical choices regarding process, equipment and materials.
The report also features a comparison with GaNpx bottom-side cooled packaging and with AT&S first generation ECP® process in order to understand the different technology choices made.
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