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Reverse Costing of Murata SCC2000 Series Automotive MEMS Combo

  • November 2015
  • -
  • System Plus Consulting
  • -
  • 160 pages

Murata SCC2000 series sensors are combined accelerometer and gyroscope devices aimed at use in tough environments such as those encountered in automotive and industrial applications. The SCC2000 series has best in class temperature dependency, shock sensitivity and bias stability characteristics and consists of a low-g 3-axis accelerometer with two angular rate sensor options of either X or Z-axis detection.

The SCC2000 series features independent acceleration and angular rate sensing elements manufactured with Murata proprietary High Aspect Ratio (HAR) 3D-MEMS process and using SOI and cavity-SOI (c-SOI) substrates. A single ASIC produced with an advanced BCD process is used.

The acceleration sensing element consists of four acceleration sensitive masses and the angular rate sensing element consists of moving masses that are purposely exited to in-plane drive motion.

The SCC2000 devices are packaged in a SOIC 24-pin premolded plastic housing measuring 15.0×8.5×4.1mm. The combo sensor is compliant to the ISO26262 automotive safety standard and the AEC-Q100 stress test qualification requirements for electronic components used in automotive applications.

SCC2000 series is targeted for applications demanding high stability with tough environmental requirements. Typical applications include: IMUs for highly demanding environments, platform stabilization and control, machine control systems, Electronic Stability Control (ESC), Hill Start Assist (HSA), roll over detection and Navigation systems.

The report includes the analysis of all combo sensors in the SCC2000 series: the SCC2230-E02, SCC2230-D08 and SCC2130-D08. Also a comparison with previous generation SCC1300 series is included.

Table Of Contents

Reverse Costing of Murata SCC2000 Series Automotive MEMS Combo
1. Introduction

2. Physical Analysis (SCC2230-E02)
- Physical Analysis Methodology
- Package
- Package Characteristics Marking and Pin-out
- Package Opening
- Package Cross-Section
- ASIC Die
- View, Dimensions and Marking
- Delayering and Process Identification
- Cross-Section
- MEMS Gyro Die
- View, Dimensions and Marking
- MEMS Gyro Opening
- MEMS Gyro Sensing Structure
- MEMS Gyro Electrodes
- MEMS Gyro Cross-Section
- MEMS Accelerometer Die
- View, Dimensions and Marking
- MEMS Accelero Structure
- MEMS Accelero Opening
- MEMS Accelero Cross-Section

3. Physical Analysis of SCC2230-D08

4. Physical Analysis of SCC2130-D08

5. Comparison with Murata's previous generation SCC1300

6. Manufacturing Process Flow
- Global Overview
- ASIC Front-End Process
- MEMS Process Flow
- Wafer Fabrication Units
- Packaging Process Flow and Assembly Unit

7. Cost Analysis
Yields Hypotheses
- ASIC Front-End Cost
- ASIC Probe Test and Dicing Cost
- ASIC Wafer and Die Cost
- MEMS Gyro Front-End Cost
- MEMS Gyro Front-End Cost per process steps
- MEMS Gyro Probe Test and Dicing Cost
- MEMS Gyro Wafer and Die Cost
- MEMS Accelero Front-End Cost
- MEMS Accelero Front-End Cost per process steps
- MEMS Accelero Probe Test and Dicing Cost
- MEMS Accelero Wafer and Die Cost
- Back-End : Packaging Cost
- Back-End : Final Test and Calibration Cost
- SCC2230 Component Cost

8. Price Analysis
- Murata Financial Results
- SCC2230 Selling Price Estimation

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