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Reverse Technology Analyses of Apple iPhone 6s Plus

  • November 2015
  • -
  • System Plus Consulting
  • -
  • 120 pages

The Apple iPhone 6s Plus holds many IC components which are listed and reviewed in the report. All these ICs (more than 60 references) have been opened in order to measure the real silicon area consumption. A special focus has been made to highlight the component structure and understand the manufacturing process on “noteworthy” components among 4 selected topics: Advanced packaging, MEMS/Sensor, RF and Imaging. True innovations have been observed in the sensors components like a new process for the MEMS microphone improving the SNR or a 3D packaging with TSV in the fingerprint sensor and many more.

Also a technological comparison with the Samsung Galaxy S6 has been made in order to understand choices made by both smartphone makers.

Key inspected components:

MEMS/Sensors components

Fingerprint sensor – new generation: new packaging, new processes (includes TSV)
eCompass – new supplier, custom product which has never been used in a smartphone
Microphone – new process improving the SNR
6-Axis IMU – new reference, custom design
Ambient light sensor – new reference, wafer-level package
Imaging components

Front and rear camera modules
Flash LED – flip-chip integration
Packaging components

Apple A9 Processor – advanced Package-on-Package (PoP) structure
Qualcomm Snapdragon – multi-chip, smallest pitch on the board
Dialog Power management – largest ball count WLP (380-ball)
RF component

Wi-Fi & Bluetooth combo module
Power Amplifier Module

Table Of Contents

Reverse Technology Analyses of Apple iPhone 6s Plus
Executive Summary

Apple iPhone 6s Plus Teardown

Electronic Board

High Resolution Pictures
ICs Identification
ICs Identification (mfr., ref., fcn., pkg. type, size and pin count)
ICs Silicon Area
Repartition by package type
Mfr. Design wins ranking
ICs Package footprint and Silicon Area ranking
PCB Characteristics
PCB Cross-Section
PCB min. line width
Advanced Packaging

Apple A9 PoP
Package views and dimensions
Package Opening and Dies measurement
Package Cross-Section
Qualcomm Snapdragon
Package views and dimensions
Package Opening and Dies measurement
Package Cross-Section
Dialog WLP Power Management
Package views and dimensions
Package Cross-Section
MEMS/Sensors

Fingerprint Sensor
Button Assembly View
Fingerprint sensor Cross-Section
Sensor dies measurement
3-Axis eCompass
Package views and dimensions
Package Opening and Dies measurement
Package Cross-Section
Microphone
Package views and dimensions
Package Opening and Dies measurement
Package Cross-Section
6-Axis IMU
Package views and dimensions
Package Opening and Die measurement
MEMS opening and sensor details
Cross-Section
Ambient Light Sensor
Package views and dimensions
Package Opening and Die measurement
Package Cross-Section
RF Devices

5G Wi-Fi and Bluetooth Combo Chip
Package views and dimensions
Package Opening and Dies Measurement
Package Cross-Section
Power Amplifier Module
Package views and dimensions
Package Opening and Dies measurement
Package Cross-Section
Camera Modules and Flash LED

12Mp Rear Camera Module
Module views and dimensions
Module Opening and CIS die measurement
Module Cross-Section
5Mp Front Camera Module
Module views and dimensions
Module Opening and CIS die measurement
Module Cross-Section
Flash LED
Package views and dimensions
Package Opening and LED die measurement
Package Cross-Section

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