1. Market Research
  2. > Manufacturing
  3. > Metal Manufacturing Market Trends
  4. > Reverse Costing of Apple iPhone 6s Plus Fingerprint Sensor

Reverse Costing of Apple iPhone 6s Plus Fingerprint Sensor

  • November 2015
  • -
  • System Plus Consulting
  • -
  • 118 pages

With the iPhone 6s Plus, Apple introduces a new fingerprint sensor. The new device has the same structure and capacitive technology than the previous one, but with important innovations in term of sensor design, die process and packaging.

Integrated in the home button, the 12.5×10.9 mm sensor is incorporated within a rectangular shaped housing composed of a stainless steel ring and an aluminum base. The sensor is protected by a sapphire window coated with two different materials and supported by innovative assembly of dies and flex PCB.

The fingerprint sensor allows it to scan the fingerprint just by pushing the button. The sensor has a resolution of 10,752 pixels with a pixel density of 500ppi. It uses a capacitive touch technology to take an image of the fingerprint from the subepidermal layers of the skin.

Respect to the old fingerprint sensor, the new sensor is composed of two dies, one dedicated to the sensing and one containing the logic. The ASIC die has a 0.18µm manufacturing process and the sensor die is manufactured with a more recent CMOS 65nm technology. While in the previous sensor had edge cavities for the wire bonding; the new sensor is implemented with TSV which allow a better packaging and wire bonding to the flex PCB.

The report includes comparisons with iPhone 5s fingerprint sensor and with the latest Samsung’s and Huawei’s fingerprints buttons.

Table Of Contents

Reverse Costing of Apple iPhone 6s Plus Fingerprint Sensor
1. Introduction

2. Company Profile and Supply Chain

3. Physical Analysis
- Physical Analysis Methodology
- Fingerprint Button assembly
- Home Button Assembly Views
- Gasket and Flex PCB Removed
- Fingerprint Sensor
- Home Button Cross-Section
- Sensor Die
- Sensor Die View, Dimensions and Marking
- Sensor Die Capacitors
- Sensor Die Delayering
- Sensor Die Bonding and TSV
- Sensor Die Process
- Sensor Cross-Section (Metal Layers, TSV…)
- ASIC Die
- Dimensions and Markings
- Delayering
- IC Process
- Die Cross-Section

4. Technology and Cost comparison with iPhone 5s fingerprint sensor

5. Manufacturing Process Flow
- Global Overview
- Sensor Front-End and TSV
- Sensor 3D Packaging Process Flow
- Sensor ASIC Process
- Sensor Packaging Process
- Fabrication Units

6. Cost Analysis
- Sensor Front-End, TSV and 3D Packaging Cost
- Sensor Back-End 0
- Sensor Wafer Cost
- Sensor Die Cost
- ASIC Front-End and Back-End 0
- ASIC Wafer Cost
- ASIC Die Cost
- Sapphire Window Cost
- Component Cost and Price

View This Report »

Get Industry Insights. Simply.

  • Latest reports & slideshows with insights from top research analysts
  • 24 Million searchable statistics with tables, figures & datasets
  • More than 10,000 trusted sources
24/7 Customer Support

Talk to Veronica

+1 718 514 2762

Purchase Reports From Reputable Market Research Publishers
Metal Fabrication Market - Global Industry Analysis, Size, Share, Growth, Trends, and Forecast 2016 - 2024

Metal Fabrication Market - Global Industry Analysis, Size, Share, Growth, Trends, and Forecast 2016 - 2024

  • $ 5795
  • Industry report
  • September 2016
  • by Transparency Market Research

The Metal fabrication market report provides an analysis of the global metal fabrication market for the period 2014 – 2024, wherein 2014 is the base year and the period from 2016 to 2024 is the forecast ...

Soft Magnetic Materials Market by Material Type, Application, End User Industry - Global Forecast to 2026

Soft Magnetic Materials Market by Material Type, Application, End User Industry - Global Forecast to 2026

  • $ 5650
  • Industry report
  • November 2016
  • by MarketsandMarkets

“Soft magnetic materials market projected to grow at a CAGR of 7.8%” The global soft magnetic materials market is projected to reach USD 28.15 billion by 2021, at a CAGR of 7.8% from 2016 to 2021. ...

U.S., Europe, and Asia Market Study on Industrial Hydrogen: Electronics Segment is Estimated to Dominate with 22.0% Market Share in 2016

U.S., Europe, and Asia Market Study on Industrial Hydrogen: Electronics Segment is Estimated to Dominate with 22.0% Market Share in 2016

  • $ 4900
  • Industry report
  • September 2016
  • by Persistence Market Research

Hydrogen is undoubtedly the clean fuel of the future and finds wide application in various industries including chemical, electronics, glass, metal production, pharma and biotech, and welding and metal ...

Global Die Casting Market

October 2016 $ 4250

ref:plp2015

Reportlinker.com © Copyright 2016. All rights reserved.

ReportLinker simplifies how Analysts and Decision Makers get industry data for their business.